The XC2S200-6FGG1064C is a high-performance, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s legendary Spartan-II family. Designed for high-volume, logic-intensive applications, this device packs 200,000 system gates and 5,292 logic cells into a compact 1064-ball Fine Pitch BGA (Pb-free) package — making it an ideal choice for engineers who demand programmable flexibility without the steep NRE costs of custom ASICs.
Whether you’re designing telecom equipment, industrial controllers, or embedded data processing systems, the XC2S200-6FGG1064C delivers the performance, I/O density, and design versatility your project requires. Explore the full range of compatible devices at Xilinx FPGA.
What Is the XC2S200-6FGG1064C?
The XC2S200-6FGG1064C belongs to the Xilinx Spartan-II FPGA series, built on a mature 0.18 µm CMOS process and operating at a core voltage of 2.5V. It is the largest member of the Spartan-II family, offering the most logic resources, the highest I/O count, and the fastest available speed grade (-6) in this product line.
Decoding the Part Number
| Part Number Segment |
Meaning |
| XC2S200 |
Xilinx Spartan-II, 200K system gates |
| -6 |
Speed Grade 6 (fastest available, commercial only) |
| FGG |
Fine Pitch Ball Grid Array – Pb-Free (RoHS) |
| 1064 |
1,064 total ball count |
| C |
Commercial temperature range (0°C to +85°C) |
XC2S200-6FGG1064C Key Specifications at a Glance
| Parameter |
Value |
| Manufacturer |
Xilinx (AMD) |
| Product Family |
Spartan-II |
| Part Number |
XC2S200-6FGG1064C |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Max User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (56,000 bits) |
| Delay-Locked Loops (DLLs) |
4 |
| Speed Grade |
-6 (Fastest) |
| Max Operating Frequency |
263 MHz |
| Core Voltage |
2.5V |
| Process Technology |
0.18 µm CMOS |
| Package Type |
FGG1064 (Fine Pitch BGA, Pb-Free) |
| Pin Count |
1,064 |
| Temperature Range |
Commercial: 0°C to +85°C |
| RoHS Compliance |
Yes (Pb-Free “G” package) |
| Configuration Interface |
Master Serial, Slave Serial, SelectMAP |
XC2S200-6FGG1064C Core Architecture & Features
Configurable Logic Blocks (CLBs)
The XC2S200 features a 28 × 42 array of 1,176 CLBs, each consisting of two slices. Every slice contains two 4-input Look-Up Tables (LUTs), two flip-flops, and dedicated carry logic. This architecture enables efficient implementation of complex combinational and sequential logic with minimal routing overhead.
Block RAM & Distributed RAM
Memory architecture is a key strength of the XC2S200-6FGG1064C:
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits (from CLB LUTs) |
| Block RAM |
56,000 bits (7 × 8K blocks) |
| Total On-Chip RAM |
~131 Kbits |
The dual-port Block RAM supports independent read and write operations, making it ideal for FIFOs, frame buffers, and lookup tables in DSP pipelines.
Input/Output Blocks (IOBs)
With up to 284 user I/O pins in the FGG1064 package, this device supports a wide range of single-ended and differential I/O standards including LVTTL, LVCMOS, PCI, GTL+, HSTL, and SSTL. Each IOB includes programmable input delays and slew rate control for signal integrity optimization.
Delay-Locked Loops (DLLs)
Four on-chip Delay-Locked Loops (one at each corner of the die) eliminate clock distribution skew, multiply/divide clock frequencies, and phase-shift clocks — critical for high-speed synchronous designs and source-synchronous interfaces.
Spartan-II Family Comparison Table
| Device |
Logic Cells |
System Gates |
CLB Array |
Max User I/O |
Dist. RAM (bits) |
Block RAM |
| XC2S15 |
432 |
15,000 |
8×12 |
86 |
6,144 |
16K |
| XC2S30 |
972 |
30,000 |
12×18 |
92 |
13,824 |
24K |
| XC2S50 |
1,728 |
50,000 |
16×24 |
176 |
24,576 |
32K |
| XC2S100 |
2,700 |
100,000 |
20×30 |
176 |
38,400 |
40K |
| XC2S150 |
3,888 |
150,000 |
24×36 |
260 |
55,296 |
48K |
| XC2S200 |
5,292 |
200,000 |
28×42 |
284 |
75,264 |
56K |
The XC2S200 is the flagship of the Spartan-II family — offering the most resources across every metric.
Speed Grade Comparison for XC2S200
| Speed Grade |
Max Frequency |
Temperature Range |
Notes |
| -5 |
200 MHz |
Commercial & Industrial |
General purpose |
| -6 |
263 MHz |
Commercial only |
Fastest; XC2S200-6FGG1064C |
The -6 speed grade is exclusively available in the commercial temperature range, making the XC2S200-6FGG1064C the go-to choice for applications prioritizing raw performance in controlled environments.
XC2S200-6FGG1064C Package Information
The FGG1064 package designation provides important physical details:
| Attribute |
Detail |
| Package Style |
Fine Pitch Ball Grid Array (FBGA) |
| Total Balls |
1,064 |
| Lead-Free (Pb-Free) |
Yes – “G” suffix indicates RoHS-compliant packaging |
| Footprint |
Large BGA; PCB design requires fine-pitch BGA routing |
| Thermal Management |
Standard air cooling suitable for commercial range |
Note: The “GG” in FGG1064 confirms this is the Pb-Free version of the FG1064 package, suitable for RoHS-compliant manufacturing environments.
Typical Applications of the XC2S200-6FGG1064C
The XC2S200-6FGG1064C excels across a wide range of demanding application domains:
Communications & Networking
- Protocol bridging (Ethernet, PCI, USB)
- Line cards and switching fabrics
- Wireless baseband processing
Industrial & Embedded Control
- Motor control with high I/O count
- Programmable logic controller (PLC) replacement
- Real-time sensor fusion
Video & Image Processing
- Frame grabbers and image pipelines
- HDMI/DVI signal routing
- Machine vision preprocessing
Defense & Aerospace (Legacy Systems)
- Ruggedized legacy system replacement
- Signal processing in radar front-ends
- Secure communication protocols
Computing & Storage
- Custom memory interfaces
- Hardware accelerators
- PCIe endpoint logic
Why Choose the XC2S200-6FGG1064C Over an ASIC?
| Factor |
ASIC |
XC2S200-6FGG1064C FPGA |
| NRE (Non-Recurring Engineering) Cost |
$500K–$5M+ |
$0 |
| Design Cycle Time |
12–24 months |
Weeks |
| Field Upgradability |
None |
Full reprogrammability |
| Minimum Order Quantity |
Typically 10,000+ |
1 unit |
| Risk of Obsolescence |
High (fixed design) |
Low (logic can be updated) |
The XC2S200-6FGG1064C offers ASIC-like performance at a fraction of the cost and timeline — the core value proposition of Spartan-II FPGAs.
Configuration & Programming
The XC2S200-6FGG1064C supports multiple configuration modes via its dedicated configuration pins:
- Master Serial Mode – Uses an external serial PROM (e.g., Xilinx XCF series)
- Slave Serial Mode – Driven by an external microcontroller or FPGA
- SelectMAP (Slave Parallel) – Byte-wide parallel configuration for fast load times
- JTAG Boundary Scan – IEEE 1149.1 compliant; supports in-system programming and debugging
Configuration data is loaded into internal SRAM-based configuration cells on every power-up, allowing dynamic reconfiguration in field-deployed systems.
Design Tools & Software Support
The XC2S200-6FGG1064C is supported by:
| Tool |
Purpose |
| Xilinx ISE Design Suite |
Primary synthesis, implementation, and bitstream generation |
| ModelSim / Vivado Simulator |
RTL and gate-level simulation |
| CORE Generator |
IP core instantiation (DSP, memory controllers, interfaces) |
| ChipScope Pro |
On-chip logic analysis and debugging |
While Vivado does not officially target Spartan-II, the ISE 14.7 toolchain provides full support for the XC2S200 device family, including timing-driven place-and-route.
Ordering Information & Product Variants
| Part Number |
Package |
Speed Grade |
Temp Range |
Pb-Free |
| XC2S200-6FG456C |
FG456 (456-ball BGA) |
-6 |
Commercial |
No |
| XC2S200-6FGG456C |
FGG456 (456-ball BGA) |
-6 |
Commercial |
Yes |
| XC2S200-6FG256C |
FG256 (256-ball BGA) |
-6 |
Commercial |
No |
| XC2S200-5FG456I |
FG456 (456-ball BGA) |
-5 |
Industrial |
No |
| XC2S200-6FGG1064C |
FGG1064 (1064-ball BGA) |
-6 |
Commercial |
Yes |
Frequently Asked Questions (FAQ)
Q: What is the XC2S200-6FGG1064C used for?
It is used in telecommunications, embedded systems, industrial automation, video processing, and any application requiring high I/O count, reprogrammable logic, and fast operating speeds up to 263 MHz.
Q: Is the XC2S200-6FGG1064C RoHS compliant?
Yes. The “G” in “FGG” indicates the Pb-Free (lead-free) package variant, making it fully RoHS compliant for use in environmentally regulated markets.
Q: What is the maximum I/O count of the XC2S200-6FGG1064C?
Q: Can the XC2S200-6FGG1064C be reprogrammed in the field?
Yes. As an SRAM-based FPGA, it reloads its configuration from an external non-volatile source (PROM or flash) on each power cycle, and can be reconfigured at any time via JTAG or SelectMAP interfaces.
Q: What design software do I need?
Xilinx ISE Design Suite 14.7 is the recommended tool for Spartan-II device design, simulation, and bitstream generation.
Summary
The XC2S200-6FGG1064C is Xilinx’s most capable Spartan-II FPGA, combining 200K system gates, 284 user I/O pins, 131 Kbits of on-chip RAM, and the fastest available -6 speed grade in a Pb-Free 1064-ball BGA package. It is the definitive choice for high-volume, performance-sensitive embedded and communications designs that need the reprogrammability of an FPGA without compromising on logic density or I/O flexibility.
For a broader selection of programmable logic solutions, visit Xilinx FPGA to compare devices, check availability, and find the right part for your next design.
