Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1063C: Xilinx Spartan-II FPGA — Full Specifications, Features & Buying Guide

Product Details

The XC2S200-6FGG1063C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications, this device delivers 200,000 system gates, 5,292 logic cells, and an advanced 1,063-ball Fine-Pitch Ball Grid Array (FBGA) package — making it one of the most capable members of the Spartan-II lineup. Whether you’re prototyping a complex digital system or replacing an ASIC, the XC2S200-6FGG1063C offers a flexible, reprogrammable solution backed by AMD Xilinx engineering.


What Is the XC2S200-6FGG1063C?

The XC2S200-6FGG1063C is part of the Xilinx Spartan-II FPGA series — a 2.5V programmable logic device built on 0.18μm CMOS process technology. It belongs to the XC2S200 device tier, the largest in the Spartan-II family, offering maximum logic density and I/O flexibility. The part number breaks down as follows:

Part Number Segment Meaning
XC2S200 Spartan-II device with 200K system gates
-6 Speed grade (-6 is the fastest; commercial temperature only)
FGG Fine-Pitch Ball Grid Array, Pb-Free packaging
1063 1,063 total ball count
C Commercial temperature range (0°C to +85°C)

This is a Pb-free (RoHS-compliant) variant of the XC2S200, identifiable by the double “G” in the package code (FGG vs. FG).


XC2S200-6FGG1063C Key Specifications

Core Logic & Memory

Parameter XC2S200 Value
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Distributed RAM 75,264 bits
Block RAM 56K bits (7 × 8K blocks)
Delay-Locked Loops (DLLs) 4

Package & Electrical

Parameter Value
Package Type Fine-Pitch BGA (FGG)
Pin Count 1,063
Core Voltage (VCCINT) 2.5V
I/O Voltage 3.3V (multi-standard)
Max User I/O Pins 284
Speed Grade -6 (fastest available)
Temperature Range Commercial: 0°C to +85°C
Technology Node 0.18μm CMOS
Max System Clock Up to 263 MHz

Supported I/O Standards

The XC2S200-6FGG1063C supports 16 selectable I/O standards, including:

I/O Standard Type
LVTTL Single-ended
LVCMOS2 Single-ended
PCI (3.3V, 33/66MHz) Single-ended
GTL / GTL+ Open-drain
SSTL2 / SSTL3 Stub-series terminated
AGP Single-ended
CTT Center-tapped terminated
HSTL (Class I/III) High-speed transceiver

XC2S200-6FGG1063C Architecture Overview

Configurable Logic Blocks (CLBs)

Each CLB in the XC2S200 contains four Slices, and each Slice includes:

  • Two 4-input Look-Up Tables (LUTs)
  • Two storage elements (flip-flops or latches)
  • Fast carry and arithmetic logic
  • Wide function multiplexers

This architecture enables efficient implementation of counters, state machines, DSP functions, and memory controllers.

Block RAM

The device integrates 56K bits of block RAM organized into dual-port RAM blocks. Each block can be configured as 4K × 1, 2K × 2, 1K × 4, or 512 × 8 — providing flexible on-chip data storage without consuming CLB resources.

Delay-Locked Loops (DLLs)

Four on-chip DLLs enable:

  • Clock deskewing and distribution
  • Frequency synthesis
  • Phase shifting
  • Duty-cycle correction

Spartan-II Family Comparison: Where Does the XC2S200 Fit?

Device Logic Cells System Gates CLBs Max I/O Block RAM
XC2S15 432 15,000 96 86 16K
XC2S30 972 30,000 216 92 24K
XC2S50 1,728 50,000 384 176 32K
XC2S100 2,700 100,000 600 176 40K
XC2S150 3,888 150,000 864 260 48K
XC2S200 5,292 200,000 1,176 284 56K

The XC2S200 is the top-tier device in the Spartan-II family, offering the highest gate count, most CLBs, and largest block RAM.


Common Applications of the XC2S200-6FGG1063C

The XC2S200-6FGG1063C is widely used in applications where reprogrammable logic replaces traditional ASICs at lower cost and risk:

Industrial & Embedded Control

High I/O count and configurable logic make this FPGA ideal for motor controllers, PLCs, and real-time embedded systems requiring deterministic performance.

Telecommunications & Networking

With support for high-speed I/O standards (HSTL, GTL+) and on-chip DLLs, the device is well-suited for line cards, protocol bridges, and baseband processing units.

Test & Measurement Equipment

The 284 user I/O pins and 200K gate capacity support parallel data acquisition, signal conditioning, and digital pattern generation in bench instruments and ATE systems.

Automotive Electronics

Used in infotainment systems, ADAS prototyping, and vehicle communication interfaces during development and validation phases.

Scientific & Research Instruments

FPGAs excel in sensor data fusion, real-time signal processing, and laboratory control systems where flexibility and parallel execution matter.


XC2S200-6FGG1063C vs. Other XC2S200 Variants

Part Number Package Pins Pb-Free Temp Range Speed
XC2S200-6FGG1063C FGG (BGA) 1,063 Yes Commercial -6
XC2S200-6FGG456C FGG (BGA) 456 Yes Commercial -6
XC2S200-6FGG256C FGG (BGA) 256 Yes Commercial -6
XC2S200-6PQG208C PQFP 208 Yes Commercial -6
XC2S200-5FGG456I FGG (BGA) 456 Yes Industrial -5

The FGG1063 package provides the highest pin density in the XC2S200 lineup, supporting the full 284 user I/O complement with ample power and ground balls for signal integrity.


Programming & Design Tools

The XC2S200-6FGG1063C is supported by Xilinx ISE Design Suite (not Vivado, which does not support Spartan-II). Key tools include:

  • ISE Project Navigator — RTL design entry and project management
  • XST (Xilinx Synthesis Technology) — HDL synthesis for Verilog and VHDL
  • ModelSim / iSim — Functional and timing simulation
  • IMPACT / iMPACT — Device configuration via JTAG or Slave Serial interface
  • ChipScope Pro — On-chip logic analysis

Configuration is loaded via JTAG boundary scan, Master Serial, Slave Serial, or SelectMAP (Parallel) modes using external configuration PROMs such as the XCF series.


Why Choose the XC2S200-6FGG1063C Over an ASIC?

Factor ASIC XC2S200-6FGG1063C FPGA
NRE Cost Very high ($500K+) None
Time to Market 6–18 months Days to weeks
Design Changes Not possible post-fabrication Fully reprogrammable
Volume Suitability High volume only Flexible
Risk High Low
Performance Optimized Good (up to 263 MHz)

For prototyping, low-to-mid volume production, or applications requiring field updates, the XC2S200-6FGG1063C is a far superior choice to mask-programmed ASICs.


Ordering & Availability

The XC2S200-6FGG1063C is classified as a mature/legacy product under AMD Xilinx. While no longer in active production, it remains available through authorized distributors and component brokers. When sourcing this part, verify:

  • Date codes and lot traceability
  • Counterfeit screening (X-ray, decapsulation) for gray-market parts
  • Storage conditions — moisture sensitivity level (MSL) compliance for BGA packages
  • RoHS conformance — the “G” in FGG confirms Pb-free solder balls

For broader Xilinx programmable logic solutions including modern Artix, Kintex, and Virtex devices, visit our Xilinx FPGA resource page.


Frequently Asked Questions (FAQ)

Q: What is the maximum clock frequency of the XC2S200-6FGG1063C? A: The device supports system clock frequencies up to 263 MHz, with internal DLLs for clock management and deskewing.

Q: Is the XC2S200-6FGG1063C RoHS compliant? A: Yes. The “FGG” designation (with double G) indicates a Pb-free, RoHS-compliant package with lead-free solder balls.

Q: Which software tool is used to program the XC2S200-6FGG1063C? A: Xilinx ISE Design Suite is the supported EDA tool. Vivado does not support Spartan-II devices.

Q: What temperature range does the XC2S200-6FGG1063C support? A: The “C” suffix indicates the commercial temperature range: 0°C to +85°C. Note that the -6 speed grade is exclusively available in the commercial temperature range.

Q: How many I/O pins does the XC2S200-6FGG1063C have? A: It offers up to 284 user-configurable I/O pins, plus 4 global clock/user input pins.

Q: Can the XC2S200-6FGG1063C be reprogrammed? A: Yes. Like all Xilinx SRAM-based FPGAs, the XC2S200 is fully reprogrammable an unlimited number of times.


Summary

The XC2S200-6FGG1063C is the highest-density, fastest speed-grade, Pb-free variant of Xilinx’s flagship Spartan-II device. With 200,000 system gates, 5,292 logic cells, 284 user I/O pins, 56K bits of block RAM, and a 1,063-ball BGA package, it delivers the logic capacity and pin bandwidth needed for demanding embedded, industrial, and communications designs. Its reprogrammable architecture makes it an ideal, cost-effective alternative to custom ASICs — with zero NRE cost and full field-update capability.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.