The XC2S200-6FGG1063C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications, this device delivers 200,000 system gates, 5,292 logic cells, and an advanced 1,063-ball Fine-Pitch Ball Grid Array (FBGA) package — making it one of the most capable members of the Spartan-II lineup. Whether you’re prototyping a complex digital system or replacing an ASIC, the XC2S200-6FGG1063C offers a flexible, reprogrammable solution backed by AMD Xilinx engineering.
What Is the XC2S200-6FGG1063C?
The XC2S200-6FGG1063C is part of the Xilinx Spartan-II FPGA series — a 2.5V programmable logic device built on 0.18μm CMOS process technology. It belongs to the XC2S200 device tier, the largest in the Spartan-II family, offering maximum logic density and I/O flexibility. The part number breaks down as follows:
| Part Number Segment |
Meaning |
| XC2S200 |
Spartan-II device with 200K system gates |
| -6 |
Speed grade (-6 is the fastest; commercial temperature only) |
| FGG |
Fine-Pitch Ball Grid Array, Pb-Free packaging |
| 1063 |
1,063 total ball count |
| C |
Commercial temperature range (0°C to +85°C) |
This is a Pb-free (RoHS-compliant) variant of the XC2S200, identifiable by the double “G” in the package code (FGG vs. FG).
XC2S200-6FGG1063C Key Specifications
Core Logic & Memory
| Parameter |
XC2S200 Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (7 × 8K blocks) |
| Delay-Locked Loops (DLLs) |
4 |
Package & Electrical
| Parameter |
Value |
| Package Type |
Fine-Pitch BGA (FGG) |
| Pin Count |
1,063 |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage |
3.3V (multi-standard) |
| Max User I/O Pins |
284 |
| Speed Grade |
-6 (fastest available) |
| Temperature Range |
Commercial: 0°C to +85°C |
| Technology Node |
0.18μm CMOS |
| Max System Clock |
Up to 263 MHz |
Supported I/O Standards
The XC2S200-6FGG1063C supports 16 selectable I/O standards, including:
| I/O Standard |
Type |
| LVTTL |
Single-ended |
| LVCMOS2 |
Single-ended |
| PCI (3.3V, 33/66MHz) |
Single-ended |
| GTL / GTL+ |
Open-drain |
| SSTL2 / SSTL3 |
Stub-series terminated |
| AGP |
Single-ended |
| CTT |
Center-tapped terminated |
| HSTL (Class I/III) |
High-speed transceiver |
XC2S200-6FGG1063C Architecture Overview
Configurable Logic Blocks (CLBs)
Each CLB in the XC2S200 contains four Slices, and each Slice includes:
- Two 4-input Look-Up Tables (LUTs)
- Two storage elements (flip-flops or latches)
- Fast carry and arithmetic logic
- Wide function multiplexers
This architecture enables efficient implementation of counters, state machines, DSP functions, and memory controllers.
Block RAM
The device integrates 56K bits of block RAM organized into dual-port RAM blocks. Each block can be configured as 4K × 1, 2K × 2, 1K × 4, or 512 × 8 — providing flexible on-chip data storage without consuming CLB resources.
Delay-Locked Loops (DLLs)
Four on-chip DLLs enable:
- Clock deskewing and distribution
- Frequency synthesis
- Phase shifting
- Duty-cycle correction
Spartan-II Family Comparison: Where Does the XC2S200 Fit?
| Device |
Logic Cells |
System Gates |
CLBs |
Max I/O |
Block RAM |
| XC2S15 |
432 |
15,000 |
96 |
86 |
16K |
| XC2S30 |
972 |
30,000 |
216 |
92 |
24K |
| XC2S50 |
1,728 |
50,000 |
384 |
176 |
32K |
| XC2S100 |
2,700 |
100,000 |
600 |
176 |
40K |
| XC2S150 |
3,888 |
150,000 |
864 |
260 |
48K |
| XC2S200 |
5,292 |
200,000 |
1,176 |
284 |
56K |
The XC2S200 is the top-tier device in the Spartan-II family, offering the highest gate count, most CLBs, and largest block RAM.
Common Applications of the XC2S200-6FGG1063C
The XC2S200-6FGG1063C is widely used in applications where reprogrammable logic replaces traditional ASICs at lower cost and risk:
Industrial & Embedded Control
High I/O count and configurable logic make this FPGA ideal for motor controllers, PLCs, and real-time embedded systems requiring deterministic performance.
Telecommunications & Networking
With support for high-speed I/O standards (HSTL, GTL+) and on-chip DLLs, the device is well-suited for line cards, protocol bridges, and baseband processing units.
Test & Measurement Equipment
The 284 user I/O pins and 200K gate capacity support parallel data acquisition, signal conditioning, and digital pattern generation in bench instruments and ATE systems.
Automotive Electronics
Used in infotainment systems, ADAS prototyping, and vehicle communication interfaces during development and validation phases.
Scientific & Research Instruments
FPGAs excel in sensor data fusion, real-time signal processing, and laboratory control systems where flexibility and parallel execution matter.
XC2S200-6FGG1063C vs. Other XC2S200 Variants
| Part Number |
Package |
Pins |
Pb-Free |
Temp Range |
Speed |
| XC2S200-6FGG1063C |
FGG (BGA) |
1,063 |
Yes |
Commercial |
-6 |
| XC2S200-6FGG456C |
FGG (BGA) |
456 |
Yes |
Commercial |
-6 |
| XC2S200-6FGG256C |
FGG (BGA) |
256 |
Yes |
Commercial |
-6 |
| XC2S200-6PQG208C |
PQFP |
208 |
Yes |
Commercial |
-6 |
| XC2S200-5FGG456I |
FGG (BGA) |
456 |
Yes |
Industrial |
-5 |
The FGG1063 package provides the highest pin density in the XC2S200 lineup, supporting the full 284 user I/O complement with ample power and ground balls for signal integrity.
Programming & Design Tools
The XC2S200-6FGG1063C is supported by Xilinx ISE Design Suite (not Vivado, which does not support Spartan-II). Key tools include:
- ISE Project Navigator — RTL design entry and project management
- XST (Xilinx Synthesis Technology) — HDL synthesis for Verilog and VHDL
- ModelSim / iSim — Functional and timing simulation
- IMPACT / iMPACT — Device configuration via JTAG or Slave Serial interface
- ChipScope Pro — On-chip logic analysis
Configuration is loaded via JTAG boundary scan, Master Serial, Slave Serial, or SelectMAP (Parallel) modes using external configuration PROMs such as the XCF series.
Why Choose the XC2S200-6FGG1063C Over an ASIC?
| Factor |
ASIC |
XC2S200-6FGG1063C FPGA |
| NRE Cost |
Very high ($500K+) |
None |
| Time to Market |
6–18 months |
Days to weeks |
| Design Changes |
Not possible post-fabrication |
Fully reprogrammable |
| Volume Suitability |
High volume only |
Flexible |
| Risk |
High |
Low |
| Performance |
Optimized |
Good (up to 263 MHz) |
For prototyping, low-to-mid volume production, or applications requiring field updates, the XC2S200-6FGG1063C is a far superior choice to mask-programmed ASICs.
Ordering & Availability
The XC2S200-6FGG1063C is classified as a mature/legacy product under AMD Xilinx. While no longer in active production, it remains available through authorized distributors and component brokers. When sourcing this part, verify:
- Date codes and lot traceability
- Counterfeit screening (X-ray, decapsulation) for gray-market parts
- Storage conditions — moisture sensitivity level (MSL) compliance for BGA packages
- RoHS conformance — the “G” in FGG confirms Pb-free solder balls
For broader Xilinx programmable logic solutions including modern Artix, Kintex, and Virtex devices, visit our Xilinx FPGA resource page.
Frequently Asked Questions (FAQ)
Q: What is the maximum clock frequency of the XC2S200-6FGG1063C? A: The device supports system clock frequencies up to 263 MHz, with internal DLLs for clock management and deskewing.
Q: Is the XC2S200-6FGG1063C RoHS compliant? A: Yes. The “FGG” designation (with double G) indicates a Pb-free, RoHS-compliant package with lead-free solder balls.
Q: Which software tool is used to program the XC2S200-6FGG1063C? A: Xilinx ISE Design Suite is the supported EDA tool. Vivado does not support Spartan-II devices.
Q: What temperature range does the XC2S200-6FGG1063C support? A: The “C” suffix indicates the commercial temperature range: 0°C to +85°C. Note that the -6 speed grade is exclusively available in the commercial temperature range.
Q: How many I/O pins does the XC2S200-6FGG1063C have? A: It offers up to 284 user-configurable I/O pins, plus 4 global clock/user input pins.
Q: Can the XC2S200-6FGG1063C be reprogrammed? A: Yes. Like all Xilinx SRAM-based FPGAs, the XC2S200 is fully reprogrammable an unlimited number of times.
Summary
The XC2S200-6FGG1063C is the highest-density, fastest speed-grade, Pb-free variant of Xilinx’s flagship Spartan-II device. With 200,000 system gates, 5,292 logic cells, 284 user I/O pins, 56K bits of block RAM, and a 1,063-ball BGA package, it delivers the logic capacity and pin bandwidth needed for demanding embedded, industrial, and communications designs. Its reprogrammable architecture makes it an ideal, cost-effective alternative to custom ASICs — with zero NRE cost and full field-update capability.