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XC2S200-6FGG1059C: Xilinx Spartan-II FPGA – Full Specifications, Features & Datasheet Guide

Product Details

Meta Description: Buy XC2S200-6FGG1059C – Xilinx Spartan-II FPGA with 200K gates, 5,292 logic cells, 1,059-pin FGG BGA package, -6 speed grade. Full specs, pinout, and datasheet guide.


What Is the XC2S200-6FGG1059C?

The XC2S200-6FGG1059C is a high-performance Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. It combines 200,000 system gates with a large 1,059-pin Fine-Pitch Ball Grid Array (FGG BGA) package, making it one of the most capable devices in the Spartan-II lineup. Designed for high-volume, cost-sensitive applications, the XC2S200-6FGG1059C is powered by a 2.5V core supply and manufactured on Xilinx’s advanced 0.18µm CMOS process technology.

Whether you are designing communication systems, digital signal processing pipelines, or industrial control systems, the XC2S200-6FGG1059C FPGA delivers the flexibility, density, and speed your application demands.

For a broader look at this product family, visit Xilinx FPGA.


XC2S200-6FGG1059C Part Number Breakdown

Understanding the Xilinx part number helps you quickly identify the device configuration:

Code Segment Meaning
XC2S200 Xilinx Spartan-II, 200K system gates
-6 Speed Grade 6 (fastest in the Spartan-II family)
FGG Fine-Pitch Ball Grid Array (BGA) package, Pb-free
1059 1,059 total pins
C Commercial temperature range (0°C to +85°C)

Note: The “G” in FGG indicates a Pb-free (RoHS-compliant) package, making this part suitable for environmentally regulated markets.


Key Features of the XC2S200-6FGG1059C

The XC2S200-6FGG1059C offers a robust set of programmable logic features that position it as a reliable alternative to mask-programmed ASICs:

  • 200,000 equivalent system gates (logic and RAM combined)
  • 5,292 logic cells in a 28 × 42 CLB array (1,176 total CLBs)
  • 75,264 bits of distributed RAM
  • 56K bits of dedicated block RAM (7 × 8K blocks)
  • 284 maximum available user I/O pins
  • Four Delay-Locked Loops (DLLs) for precise clock management
  • -6 speed grade — the fastest available in the Spartan-II family
  • 2.5V core voltage (VCCINT) with multi-voltage I/O support
  • 0.18µm, 6-layer metal process technology
  • IEEE 1149.1 JTAG boundary scan support
  • Multiple configuration modes: Master Serial, Slave Serial, Master Parallel, Slave Parallel, Peripheral, and JTAG

XC2S200-6FGG1059C Full Technical Specifications

General Device Specifications

Parameter Value
Manufacturer Xilinx (AMD)
Series Spartan-II
Part Number XC2S200-6FGG1059C
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56,384 bits (56K)
DLLs 4
Speed Grade -6 (fastest)
Core Supply Voltage 2.5V
Process Technology 0.18µm CMOS

Package & Physical Specifications

Parameter Value
Package Type Fine-Pitch Ball Grid Array (FGG BGA)
Total Pin Count 1,059
Pb-Free / RoHS Yes (denoted by “G” in package code)
Temperature Range Commercial: 0°C to +85°C
Package Code FGG1059

Electrical Characteristics

Parameter Value
VCCINT (Core) 2.5V
VCCO (I/O) 1.5V, 1.8V, 2.5V, or 3.3V
Max Operating Frequency Up to 263 MHz (system)
Input Voltage Standards LVTTL, LVCMOS2, SSTL2, SSTL3, GTL, GTL+, HSTL, CTT, AGP

XC2S200-6FGG1059C Logic Architecture

Configurable Logic Blocks (CLBs)

Each CLB in the XC2S200-6FGG1059C contains two slices, and each slice contains:

  • Two 4-input Look-Up Tables (LUTs)
  • Two flip-flops with synchronous set/reset
  • Fast carry and arithmetic logic
  • Wide-function multiplexers

This architecture allows the XC2S200-6FGG1059C to efficiently implement complex combinational and sequential logic, arithmetic operations, and memory functions within the fabric itself.

Block RAM

The XC2S200-6FGG1059C includes 7 block RAM modules, each 8K bits in size, for a total of 56K bits of dedicated on-chip memory. These block RAMs can be configured as:

  • Single-port RAM
  • Dual-port RAM (simultaneous read and write)
  • Read-only ROM
  • FIFO buffers

Delay-Locked Loops (DLLs)

Four DLLs — one at each corner of the die — provide:

  • Clock deskewing and distribution
  • Frequency synthesis (multiplication and division)
  • Phase shifting
  • Variable delay control

Spartan-II Family Comparison Table

The XC2S200-6FGG1059C sits at the top of the Spartan-II density range. Here is how it compares to other family members:

Device Logic Cells System Gates CLB Array Max User I/O Distributed RAM Block RAM
XC2S15 432 15,000 8 × 12 86 6,144 bits 16K
XC2S30 972 30,000 12 × 18 92 13,824 bits 24K
XC2S50 1,728 50,000 16 × 24 176 24,576 bits 32K
XC2S100 2,700 100,000 20 × 30 176 38,400 bits 40K
XC2S150 3,888 150,000 24 × 36 260 55,296 bits 48K
XC2S200 5,292 200,000 28 × 42 284 75,264 bits 56K

The XC2S200-6FGG1059C clearly leads the Spartan-II family in every density metric, making it the preferred choice when maximum logic capacity is required.


Supported I/O Standards

One of the key strengths of the XC2S200-6FGG1059C is its broad I/O standard support, enabling seamless integration into mixed-voltage system designs:

I/O Standard Description
LVTTL Low-Voltage TTL (3.3V)
LVCMOS2 Low-Voltage CMOS (2.5V)
SSTL2 Stub Series Terminated Logic for 2.5V
SSTL3 Stub Series Terminated Logic for 3.3V
GTL / GTL+ Gunning Transceiver Logic
HSTL High-Speed Transceiver Logic
CTT Center-Tap Terminated Logic
AGP Accelerated Graphics Port compatible

Configuration Modes

The XC2S200-6FGG1059C supports multiple configuration interfaces to fit any system design:

Mode Description
Master Serial FPGA drives configuration clock; reads serial bitstream from external PROM
Slave Serial External device drives configuration clock and bitstream
Master Parallel (x8) FPGA reads byte-wide parallel data from PROM
Slave Parallel (SelectMAP) External microprocessor loads configuration data
Peripheral (Byte-Wide) Microprocessor loads FPGA through peripheral interface
JTAG (IEEE 1149.1) Boundary scan and in-circuit configuration

Typical Applications of the XC2S200-6FGG1059C

The XC2S200-6FGG1059C FPGA is widely used in applications that demand high logic density and flexible I/O, including:

  • Digital Signal Processing (DSP) — filters, FFTs, digital modulation
  • Communications — line card designs, protocol bridging, data serialization
  • Industrial Automation — motor control, PLC replacement, sensor fusion
  • Consumer Electronics — set-top boxes, display controllers, image processing
  • Test & Measurement Equipment — data acquisition, pattern generation
  • Networking Equipment — packet processing, switching, routing logic
  • Embedded System Co-processing — logic offloading from embedded CPUs

XC2S200-6FGG1059C vs. Similar Devices

Buyers sometimes compare the XC2S200-6FGG1059C with related Xilinx parts. The table below highlights the primary differences:

Part Number Gates Speed Grade Package Pins Temp Range Pb-Free
XC2S200-5FGG456C 200K -5 FGG BGA 456 Commercial Yes
XC2S200-6FGG456C 200K -6 FGG BGA 456 Commercial Yes
XC2S200-5FG256C 200K -5 FG BGA 256 Commercial No
XC2S200-6PQ208C 200K -6 PQFP 208 Commercial No
XC2S200-6FGG1059C 200K -6 FGG BGA 1,059 Commercial Yes

The XC2S200-6FGG1059C stands out with the largest pin count (1,059) and the fastest speed grade (-6) in a Pb-free BGA package, ideal for designs that require maximum I/O flexibility and high signal integrity.


Design Tools & Software Support

The XC2S200-6FGG1059C is fully supported by Xilinx design tools, including:

  • Xilinx ISE Design Suite — the primary legacy tool for Spartan-II synthesis, place & route, and bitstream generation
  • ModelSim / XSim — for functional and timing simulation
  • ChipScope Pro — in-system logic analyzer
  • iMPACT — JTAG-based programming and configuration tool

Designers working with newer FPGA families may migrate to the Vivado Design Suite, though ISE remains the recommended toolchain for Spartan-II devices.


Ordering Information & Compliance

Attribute Detail
Full Part Number XC2S200-6FGG1059C
Manufacturer Xilinx / AMD
RoHS / Pb-Free Yes
Temperature Grade Commercial (0°C to +85°C)
REACH Compliance Check with distributor
Country of Origin United States (design)

Frequently Asked Questions (FAQ)

What does the “-6” speed grade mean on the XC2S200-6FGG1059C?

The -6 speed grade is the fastest available for Spartan-II devices. It indicates the component meets the most stringent timing specifications in the family. A lower speed grade number means faster performance. The -6 speed grade is exclusively offered in the commercial temperature range (0°C to +85°C).

Is the XC2S200-6FGG1059C RoHS compliant?

Yes. The “G” in the FGG package designation confirms this is a Pb-free, RoHS-compliant device.

How many I/O pins does the XC2S200-6FGG1059C have?

The device supports up to 284 user I/O pins. Note that four additional global clock/user input pins are available but not included in the 284-pin count.

Can I configure the XC2S200-6FGG1059C using JTAG?

Yes. The XC2S200-6FGG1059C supports IEEE 1149.1 JTAG boundary scan for in-circuit configuration and testing.

What voltage does the XC2S200-6FGG1059C core operate at?

The core (VCCINT) operates at 2.5V. The I/O supply (VCCO) can be configured for 1.5V, 1.8V, 2.5V, or 3.3V depending on the I/O standard used.

What programming software should I use for the XC2S200-6FGG1059C?

Use Xilinx ISE Design Suite combined with iMPACT for bitstream generation and JTAG programming of the XC2S200-6FGG1059C.


Conclusion

The XC2S200-6FGG1059C is the highest-density, fastest speed grade Spartan-II FPGA in a lead-free 1,059-pin BGA package. With 200,000 system gates, 5,292 logic cells, 56K of block RAM, 284 user I/O pins, and four DLLs, it is a powerful and cost-effective solution for complex digital designs across communications, DSP, industrial, and consumer applications. Its broad I/O standard support, flexible configuration options, and proven Xilinx architecture make it a trusted choice for engineers worldwide.

To explore the complete range of compatible devices and solutions, visit Xilinx FPGA.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.