Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XC2S200-6FGG1058C: Xilinx Spartan-II FPGA – Full Specifications & Buying Guide

Product Details

The XC2S200-6FGG1058C is a high-performance, cost-effective Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume embedded applications, this device delivers 200,000 system gates, 284 user I/O pins, and a fine-pitch BGA package — making it one of the most capable members of the Spartan-II lineup. Whether you’re designing industrial controllers, communications hardware, or consumer electronics, the XC2S200-6FGG1058C offers a compelling balance of logic density, I/O flexibility, and speed.


What Is the XC2S200-6FGG1058C?

The XC2S200-6FGG1058C is the top-density device in Xilinx’s Spartan-II FPGA series. The part number breaks down as follows:

Part Number Segment Meaning
XC2S200 Xilinx Spartan-II, 200K system gates
-6 Speed Grade 6 (fastest available for Commercial range)
FGG Fine-Pitch Ball Grid Array (FBGA), Pb-free package
1058 1058 pins
C Commercial temperature range (0°C to +85°C)

This is a Pb-free (RoHS-compliant) variant, indicated by the double “GG” in the package designator, making it suitable for modern green manufacturing environments.


XC2S200-6FGG1058C Key Features

The XC2S200-6FGG1058C includes the following key features that make it ideal for demanding digital logic applications:

  • 5,292 logic cells with 200,000 equivalent system gates
  • 1,176 Configurable Logic Blocks (CLBs) arranged in a 28 × 42 array
  • 284 user-programmable I/O pins
  • 75,264 bits of distributed RAM
  • 56K bits of block RAM (two on-chip block RAM columns)
  • Four Delay-Locked Loops (DLLs) for precise clock management
  • Speed Grade -6 — the fastest commercially available Spartan-II option
  • 2.5V core voltage with 5V-tolerant I/O capability
  • IEEE 1149.1 JTAG Boundary Scan support for in-system testing
  • Supports multiple I/O standards including LVTTL, LVCMOS, PCI, SSTL, GTL, and more
  • Fine-pitch BGA (FGG) package with 1058 pins for high-density board integration

XC2S200-6FGG1058C Electrical Specifications

Parameter Value
Core Supply Voltage (VCCINT) 2.5V
I/O Supply Voltage (VCCO) 1.5V – 3.3V
Speed Grade -6 (fastest Commercial)
Operating Temperature 0°C to +85°C (Commercial)
System Gates 200,000
Logic Cells 5,292
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56,384 bits (56K)
DLLs (Clock Management) 4
Configuration Width Serial / Parallel / JTAG

Package Information: FGG1058 Fine-Pitch BGA

The FGG1058 package is a Fine-Pitch Ball Grid Array with 1058 solder balls, designed for applications that require maximum I/O pin count in a compact, surface-mount footprint.

Package Attribute Details
Package Type Fine-Pitch Ball Grid Array (FBGA)
Pin Count 1058
Pb-Free Yes (“GG” designator)
Mounting Style Surface Mount (SMD)
Package Dimensions Refer to Xilinx DS001 package diagram
Moisture Sensitivity MSL 3 (standard FBGA)

Spartan-II Family Comparison: Where Does XC2S200 Stand?

The XC2S200 is the largest and most capable device in the Spartan-II family. Here is how it compares across the entire product line:

Device Logic Cells System Gates CLB Array Total CLBs Max User I/O Dist. RAM (bits) Block RAM (bits)
XC2S15 432 15,000 8 × 12 96 86 6,144 16K
XC2S30 972 30,000 12 × 18 216 92 13,824 24K
XC2S50 1,728 50,000 16 × 24 384 176 24,576 32K
XC2S100 2,700 100,000 20 × 30 600 176 38,400 40K
XC2S150 3,888 150,000 24 × 36 864 260 55,296 48K
XC2S200 5,292 200,000 28 × 42 1,176 284 75,264 56K

The XC2S200-6FGG1058C is the top-tier choice for applications demanding maximum logic density and I/O bandwidth within the Spartan-II platform.


Supported I/O Standards

The XC2S200-6FGG1058C supports a wide range of programmable I/O voltage standards, enabling direct interfacing with multiple external bus types:

I/O Standard Description
LVTTL Low Voltage TTL (3.3V)
LVCMOS2 Low Voltage CMOS (2.5V)
PCI 3.3V PCI Bus Interface
SSTL2 / SSTL3 Stub Series Terminated Logic
GTL / GTL+ Gunning Transceiver Logic
CTT Center-Tap Terminated
AGP Accelerated Graphics Port
HSTL High-Speed Transceiver Logic

Clock Management and DLL Architecture

One of the standout features of the XC2S200-6FGG1058C is its four on-chip Delay-Locked Loops (DLLs), one located at each corner of the die. These DLLs provide:

  • Zero-delay clock buffering for eliminating clock distribution skew
  • Clock multiplication and division for generating multiple frequency domains
  • Phase shifting for timing margin optimization
  • Input clock duty-cycle correction

This makes the XC2S200-6FGG1058C well-suited for synchronous designs requiring tight timing closure across all logic domains.


Configuration Modes

The XC2S200-6FGG1058C supports several configuration modes to fit various system designs:

Configuration Mode Description
Master Serial FPGA drives configuration clock; uses serial PROM
Slave Serial External controller drives configuration
Master Parallel (SelectMap) Fast parallel 8-bit byte-wide configuration
Slave Parallel (SelectMap) Parallel config via external processor
JTAG (Boundary Scan) IEEE 1149.1 compliant in-system programming

The device also supports partial reconfiguration and daisy-chained configuration for multi-FPGA systems.


Typical Applications

The XC2S200-6FGG1058C is widely used across a broad range of industries and applications:

  • Industrial automation – motor controllers, PLC interfaces, sensor fusion
  • Telecommunications – line cards, protocol bridging, framing logic
  • Embedded computing – co-processors, custom peripheral controllers
  • Consumer electronics – display controllers, image processing pipelines
  • Medical devices – signal acquisition, diagnostic interfaces
  • Automotive electronics – gateway controllers, CAN/LIN bus processing
  • Test & measurement – data acquisition systems, signal generators

Why Choose the XC2S200-6FGG1058C?

✅ Highest Logic Density in Spartan-II

With 5,292 logic cells and 200K equivalent gates, this is the most powerful device in the Spartan-II family — ideal for complex state machines, DSP pipelines, and large bus fabric implementations.

✅ Speed Grade -6: Maximum Performance

The -6 speed grade is the fastest available in the Commercial temperature range, delivering the shortest propagation delays and highest clock frequencies for performance-critical designs.

✅ Pb-Free (RoHS Compliant)

The FGG (double-G) package designation confirms Pb-free solder balls, fully compliant with RoHS and WEEE environmental directives.

✅ Flexible I/O Voltage Support

Support for over 8 I/O standards allows seamless integration into mixed-voltage PCB designs without external level-shifting hardware.

✅ Proven Xilinx Ecosystem

As part of the Xilinx FPGA portfolio, the XC2S200-6FGG1058C benefits from full tool chain support including ISE Design Suite, JTAG debugging, IP cores, and an extensive library of reference designs.


Ordering Information & Part Number Decoder

Xilinx uses a standardized naming convention for all Spartan-II devices. Here is a full breakdown of the XC2S200-6FGG1058C part number:

Field Code Meaning
Device Family XC2S Xilinx Spartan-II
Gate Count 200 200,000 System Gates
Speed Grade -6 Fastest Commercial Speed
Package Type FGG Fine-Pitch BGA, Pb-Free
Pin Count 1058 1058 Total Balls
Temp Range C Commercial (0°C to +85°C)

Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1058C used for?

The XC2S200-6FGG1058C is used in applications requiring high logic density and high I/O count in a compact package, including embedded controllers, communications systems, and industrial automation.

Is the XC2S200-6FGG1058C RoHS compliant?

Yes. The “GG” in the FGG package code indicates a Pb-free, RoHS-compliant package suitable for eco-friendly manufacturing.

What is the core voltage of the XC2S200-6FGG1058C?

The XC2S200-6FGG1058C operates on a 2.5V core voltage (VCCINT), with I/O voltages ranging from 1.5V to 3.3V depending on the selected I/O standard.

What tools are used to program the XC2S200-6FGG1058C?

Xilinx ISE Design Suite (including ISE WebPACK for smaller designs) supports the full Spartan-II device family. Configuration can be performed via JTAG, serial PROM, or parallel flash.

How does the -6 speed grade affect performance?

The -6 speed grade offers the shortest internal propagation delays of all Spartan-II speed grades, supporting the highest internal clock frequencies for Commercial temperature range designs.


Summary

The XC2S200-6FGG1058C is a flagship-level Xilinx Spartan-II FPGA, combining the maximum gate count and user I/O of the family with the fastest Commercial speed grade and a compact, Pb-free BGA package. Its combination of 5,292 logic cells, 284 I/O pins, on-chip DLLs, and wide I/O standard support makes it a versatile solution for demanding embedded and communications applications.

For engineers seeking a proven, cost-effective programmable logic device with robust tool chain support, the XC2S200-6FGG1058C remains a strong choice — backed by the full depth of the Xilinx design ecosystem.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.