The XC2S200-6FGG1056C is a high-performance, cost-effective Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume commercial applications, this device delivers 200,000 system gates, 5,292 logic cells, and a 1056-ball Fine Pitch BGA (FBGA) package — making it one of the most capable members of the Spartan-II lineup. Whether you are designing embedded systems, telecommunications equipment, or industrial control boards, the XC2S200-6FGG1056C offers the flexibility, speed, and logic density your project demands.

For a broad selection of compatible programmable logic solutions, explore our full range of Xilinx FPGA products.

What Is the XC2S200-6FGG1056C?

The XC2S200-6FGG1056C is part of Xilinx’s Spartan-II 2.5V FPGA family, a series of programmable logic devices engineered as a cost-competitive alternative to mask-programmed ASICs. The part number breaks down as follows:

Note: The -6 speed grade is exclusively available in the Commercial temperature range, making this part ideal for consumer and commercial electronics applications.

XC2S200-6FGG1056C Key Specifications

General Device Specifications

XC2S200-6FGG1056C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1056C contains 1,176 Configurable Logic Blocks arranged in a 28×42 matrix. Each CLB consists of two slices, and each slice contains two 4-input Look-Up Tables (LUTs) and two flip-flops, enabling efficient implementation of both combinational and sequential logic.

Input/Output Blocks (IOBs)

The device supports up to 284 user-configurable I/O pins, each featuring programmable input/output standards. The IOBs support a wide range of single-ended and differential I/O standards, including LVTTL, LVCMOS, GTL, SSTL, and more.

Block RAM

The XC2S200-6FGG1056C includes 56K bits of total block RAM organized in dual-port configurations. This embedded memory is ideal for FIFOs, lookup tables, and data buffering in high-throughput designs.

Distributed RAM

With 75,264 bits of distributed RAM, designers can implement small, fast memory structures directly within the CLB fabric — reducing routing delays and improving overall system performance.

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops (DLLs) are located at each corner of the die. The DLLs provide precise clock edge alignment, frequency synthesis, and phase shifting, eliminating clock skew across the device.

Spartan-II Family Comparison Table

As shown above, the XC2S200 is the largest and most capable device in the Spartan-II family, making the XC2S200-6FGG1056C the top choice for logic-intensive designs.

Configuration Modes

The XC2S200-6FGG1056C supports multiple configuration modes, giving designers flexibility in how the device is programmed during power-up.

During power-on and throughout configuration, all I/O drivers remain in a high-impedance state to prevent bus contention.

XC2S200-6FGG1056C Package Information

FGG1056 Fine Pitch BGA Package Details

The 1056-ball FGG package provides a large number of available I/Os in a compact surface-mount footprint, making it suitable for space-constrained PCB designs where signal density is critical.

Key Features of the XC2S200-6FGG1056C

• ✅ 200,000 system gates — largest in the Spartan-II family
• ✅ Speed grade -6 — fastest commercially available Spartan-II speed grade
• ✅ 5,292 logic cells in a 28×42 CLB array
• ✅ 284 maximum user I/O pins for high pin-count designs
• ✅ 56K bits of block RAM for embedded data storage
• ✅ 75,264 bits of distributed RAM within CLB fabric
• ✅ Four on-chip DLLs for precise clock management
• ✅ 1056-ball Pb-free BGA package (FGG1056)
• ✅ 2.5V core supply voltage for low power consumption
• ✅ JTAG boundary scan support (IEEE 1149.1)
• ✅ Multiple I/O standards including LVTTL, LVCMOS, SSTL, GTL+
• ✅ Commercial temperature range (0°C to +85°C)

XC2S200-6FGG1056C Applications

The XC2S200-6FGG1056C is widely used across multiple industries due to its combination of high logic density, fast speed grade, and broad I/O flexibility.

Typical Application Areas

Ordering Information & Part Number Decoder

Xilinx Spartan-II devices follow a structured ordering code. Understanding the XC2S200-6FGG1056C part number helps confirm you are ordering the correct device.

XC2S200 - 6 - FGG - 1056 - C
  |        |    |      |    |
  |        |    |      |    └── Temperature: C = Commercial (0°C to +85°C)
  |        |    |      └─────── Pin Count: 1056 pins
  |        |    └────────────── Package: FGG = Pb-Free Fine Pitch BGA
  |        └─────────────────── Speed Grade: -6 (fastest)
  └──────────────────────────── Device: Spartan-II 200K gates

Available Speed Grades for XC2S200

Why Choose the XC2S200-6FGG1056C?

Superior Alternative to Mask-Programmed ASICs

The Spartan-II family was specifically designed as a cost-effective, reconfigurable alternative to ASICs. Unlike fixed-function ASICs, the XC2S200-6FGG1056C can be reprogrammed in the field, dramatically shortening development cycles and reducing NRE (Non-Recurring Engineering) costs.

High-Speed Performance at -6 Speed Grade

At the -6 speed grade, this device delivers the fastest performance available in the Spartan-II family, supporting demanding timing budgets in high-frequency designs. The on-chip DLLs further enhance clock performance by eliminating skew and enabling frequency multiplication.

Pb-Free Compliance (RoHS)

The double “G” in FGG confirms this is a Pb-free (lead-free) package, compliant with RoHS environmental directives — an important consideration for products sold in the European Union and other regions with environmental regulations.

Extensive I/O Flexibility

With 284 maximum user I/O pins and support for a wide variety of I/O standards, the XC2S200-6FGG1056C easily interfaces with processors, memory, FPGAs, ASICs, and peripherals without the need for external level shifters in most common use cases.

Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1056C?

The XC2S200-6FGG1056C is a Xilinx Spartan-II FPGA with 200,000 system gates, speed grade -6, housed in a 1056-ball Pb-free Fine Pitch BGA package, rated for commercial temperature operation (0°C to +85°C).

What is the difference between XC2S200-6FGG456C and XC2S200-6FGG1056C?

The core FPGA logic (200K gates, 5,292 cells) is identical. The difference is the package: the FGG456 has 456 balls while the FGG1056 has 1056 balls, providing significantly more available I/O connections and better board-level routing flexibility for high pin-count designs.

Is the XC2S200-6FGG1056C still in production?

The Spartan-II family has reached end-of-life (EOL) status with Xilinx (now AMD). However, the XC2S200-6FGG1056C remains widely available through authorized distributors and component brokers for maintenance, repair, and legacy system support.

What software is used to program the XC2S200-6FGG1056C?

The XC2S200-6FGG1056C is programmed using Xilinx ISE Design Suite (the recommended tool for Spartan-II devices). Designs are typically written in VHDL or Verilog and synthesized into a bitstream for configuration.

What configuration memory is compatible with the XC2S200-6FGG1056C?

Xilinx Platform Flash PROMs (XCF series) are the recommended companion memory devices for configuring the XC2S200-6FGG1056C in Master Serial mode.

Conclusion

The XC2S200-6FGG1056C remains a powerful and versatile FPGA solution for engineers working on commercial-grade designs that demand high logic density, fast operation, and broad I/O capability. With 200,000 system gates, speed grade -6 performance, 284 user I/Os, and a 1056-ball Pb-free BGA package, it delivers everything needed for complex digital design in a proven, well-documented architecture.

Whether you are designing new hardware or maintaining existing systems, the XC2S200-6FGG1056C continues to be a reliable choice in the programmable logic landscape.