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XC2S200-6FGG1054C: Xilinx Spartan-II FPGA – Full Specifications, Features & Buying Guide

Product Details

The XC2S200-6FGG1054C is a high-performance, cost-effective Field-Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-II family. Designed for high-volume commercial applications, this device delivers 200,000 system gates, 5,292 logic cells, and a robust 1,054-pin Fine-Pitch Ball Grid Array (FBGA) package — making it one of the most capable members of the Spartan-II lineup. Whether you are developing digital signal processing systems, communication hardware, or custom embedded logic, the XC2S200-6FGG1054C provides a flexible, field-upgradable platform without the high NRE cost of mask-programmed ASICs.


What Is the XC2S200-6FGG1054C? – Overview of the Xilinx Spartan-II FPGA

The XC2S200-6FGG1054C belongs to Xilinx’s Spartan-II FPGA family, a 2.5V programmable logic device family fabricated on a 0.18-micron process. The part number breaks down as follows:

Part Number Segment Meaning
XC2S200 Spartan-II device with 200K system gates
-6 Speed grade 6 (fastest available; commercial range only)
FGG Fine-Pitch Ball Grid Array (Pb-Free “G” variant)
1054 1,054 pins
C Commercial temperature range (0°C to +85°C)

As a Xilinx FPGA, the XC2S200-6FGG1054C is an ideal solution for engineers seeking programmable logic with maximum I/O density in a compact BGA footprint.


XC2S200-6FGG1054C Key Features and Technical Highlights

The XC2S200-6FGG1054C stands out in the Spartan-II family for its combination of gate density, I/O capacity, and speed. Key features include:

  • 200,000 system gates (logic and RAM combined)
  • 5,292 Configurable Logic Cells (CLBs)
  • 28 × 42 CLB array for dense logic implementation
  • 284 maximum user I/O pins (excluding 4 global clock inputs)
  • 75,264 bits of distributed RAM for fast on-chip data storage
  • 56K bits of block RAM organized in two dedicated columns
  • Four Delay-Locked Loops (DLLs) for precise clock management
  • -6 speed grade — the fastest commercial speed grade in the Spartan-II family
  • 2.5V core voltage (VCCINT), with multi-voltage I/O support
  • 1,054-pin FBGA package (Pb-Free) for high-density PCB designs
  • Commercial temperature range: 0°C to +85°C
  • JTAG boundary scan support (IEEE 1149.1)
  • SelectRAM+™ technology for efficient distributed and block memory
  • In-system reconfigurability — update logic in the field without hardware replacement

XC2S200-6FGG1054C Full Technical Specifications

Core Logic Specifications

Parameter Value
Device Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Distributed RAM 75,264 bits
Block RAM 56K bits (56,000 bits)
Delay-Locked Loops (DLLs) 4

Package and Electrical Specifications

Parameter Value
Package Type Fine-Pitch BGA (FBGA)
Package Code FGG1054
Pin Count 1,054
Maximum User I/O 284
Core Voltage (VCCINT) 2.5V
I/O Voltage (VCCO) 1.5V, 1.8V, 2.5V, 3.3V
Process Technology 0.18µm CMOS
Speed Grade -6 (fastest Spartan-II commercial grade)
Operating Temperature 0°C to +85°C (Commercial)
RoHS Compliance Yes (Pb-Free “G” package)

Performance Specifications

Parameter Value
Maximum System Clock Up to 200+ MHz (design-dependent)
Internal Clock Speed Approx. 200–263 MHz (DLL-driven)
I/O Standards Supported LVTTL, LVCMOS, GTL, HSTL, SSTL, PCI
Configuration Modes Master Serial, Slave Serial, SelectMAP, JTAG

Spartan-II Family Comparison: Where Does the XC2S200 Stand?

The XC2S200 is the largest device in the Spartan-II family. The table below shows how it compares to its siblings:

Device Logic Cells System Gates CLB Array Max User I/O Distributed RAM Block RAM
XC2S15 432 15,000 8×12 86 6,144 bits 16K
XC2S30 972 30,000 12×18 92 13,824 bits 24K
XC2S50 1,728 50,000 16×24 176 24,576 bits 32K
XC2S100 2,700 100,000 20×30 176 38,400 bits 40K
XC2S150 3,888 150,000 24×36 260 55,296 bits 48K
XC2S200 5,292 200,000 28×42 284 75,264 bits 56K

The XC2S200-6FGG1054C, with its 1,054-pin package, maximizes the available I/O pins and is the preferred choice when signal routing density is a priority.


XC2S200-6FGG1054C Architecture Deep Dive

Configurable Logic Blocks (CLBs)

The CLB is the fundamental logic element of the Spartan-II architecture. Each CLB contains four logic cells, each consisting of a 4-input Look-Up Table (LUT), carry logic, and a D-type flip-flop. The 28×42 CLB array of the XC2S200 provides a total of 1,176 CLBs, enabling complex combinational and sequential logic implementation.

Block RAM

The XC2S200 features two dedicated columns of block RAM, delivering a total of 56K bits of dual-port synchronous RAM. Each block RAM can be independently configured for different widths and depths, making it highly suitable for FIFO buffers, lookup tables, and embedded data storage.

Delay-Locked Loops (DLLs)

Four DLLs, one placed at each corner of the die, provide zero-skew clock distribution, frequency synthesis, and phase shifting. The DLL architecture ensures that clock signals arrive at all flip-flops simultaneously, enabling high-speed synchronous designs.

Input/Output Blocks (IOBs)

Each IOB in the Spartan-II supports programmable drive strength, slew rate control, and a wide range of single-ended and differential I/O standards. The FGG1054 package exposes up to 284 user I/O pins, making the XC2S200-6FGG1054C ideal for data-intensive interfaces.


XC2S200-6FGG1054C Applications and Use Cases

The XC2S200-6FGG1054C is a versatile programmable logic device used across a wide range of industries and applications:

Application Area Use Case Examples
Digital Signal Processing (DSP) FIR/IIR filters, FFT engines, audio/video processing
Communications Protocol bridges, serial interface controllers, packet processing
Industrial Control Motor control, sensor fusion, custom state machines
Consumer Electronics Set-top boxes, display controllers, embedded processing
Test & Measurement Waveform generation, pattern recognition, logic analyzers
Automotive (non-safety) In-vehicle infotainment, body electronics
Military/Aerospace (legacy) FPGA-based signal processing subsystems

XC2S200-6FGG1054C vs. Similar Xilinx FPGAs

When selecting an FPGA, it helps to compare the XC2S200-6FGG1054C against related parts:

Part Number Family Gates Package Speed Grade Key Difference
XC2S200-6FGG1054C Spartan-II 200K 1054-FBGA -6 This product
XC2S200-5FGG1054C Spartan-II 200K 1054-FBGA -5 Slower speed grade
XC2S200-6PQ208C Spartan-II 200K 208-PQFP -6 Fewer I/O, through-hole friendly
XC2S200-6FG456C Spartan-II 200K 456-FBGA -6 Fewer pins, smaller footprint
XC3S200-4FGG456C Spartan-3 200K 456-FBGA -4 Newer generation, lower power

The FGG1054 package variant is the best choice when your design requires the maximum number of I/O connections, as it exposes the full 284 user I/Os of the XC2S200.


Configuration and Programming the XC2S200-6FGG1054C

Supported Configuration Modes

The XC2S200-6FGG1054C supports multiple configuration modes to suit different system architectures:

  • Master Serial – Uses an external serial PROM (e.g., Xilinx XCFxxS)
  • Slave Serial – Controlled by an external microprocessor or FPGA
  • SelectMAP (Parallel) – High-speed 8-bit parallel configuration
  • JTAG (IEEE 1149.1) – Boundary scan and in-circuit configuration

Recommended Configuration PROMs

PROM Part Capacity Interface Compatible
XCF02S 2Mbit Serial Yes
XCF04S 4Mbit Serial Yes
XCF08P 8Mbit Serial/SelectMAP Yes

Design Tools

Xilinx’s ISE Design Suite (ISE 14.7) is the recommended EDA tool for targeting Spartan-II devices. While Vivado does not support Spartan-II, ISE 14.7 remains freely available and fully supports synthesis, implementation, and bitstream generation for the XC2S200-6FGG1054C.


Ordering Information for XC2S200-6FGG1054C

Part Number Decoder

XC  2S  200  -6  FGG  1054  C
|   |   |    |   |    |     |
|   |   |    |   |    |     └── Temperature: C = Commercial (0°C to +85°C)
|   |   |    |   |    └──────── Pin Count: 1054
|   |   |    |   └───────────── Package: FGG = Fine-Pitch BGA (Pb-Free)
|   |   |    └───────────────── Speed Grade: -6 (fastest)
|   |   └────────────────────── Gate Count: 200K
|   └────────────────────────── Family: Spartan-II (2S)
└────────────────────────────── Xilinx prefix

Available Package Options for XC2S200

Package Pin Count Type Pb-Free Option
PQ208 / PQG208 208 Plastic QFP Yes (G suffix)
FG456 / FGG456 456 Fine-Pitch BGA Yes (G suffix)
FG676 / FGG676 676 Fine-Pitch BGA Yes (G suffix)
FGG1054 1,054 Fine-Pitch BGA Yes (G suffix)

Frequently Asked Questions (FAQ) – XC2S200-6FGG1054C

What is the operating temperature range of the XC2S200-6FGG1054C?

The “C” suffix designates the Commercial temperature range: 0°C to +85°C. For industrial temperature range (-40°C to +85°C), look for the “I” suffix variant (note: the -6 speed grade is available only in the commercial range).

Is the XC2S200-6FGG1054C RoHS compliant?

Yes. The “G” in “FGG” indicates a Pb-Free (lead-free) package, making it RoHS compliant for environmentally regulated markets.

Can the XC2S200-6FGG1054C be reprogrammed?

Yes. As an SRAM-based FPGA, it is fully reprogrammable. Configuration is loaded from an external PROM or host controller at power-up, and it can be updated in the field without hardware changes.

What design software supports the XC2S200-6FGG1054C?

Xilinx ISE Design Suite 14.7 is the primary supported tool. This includes the free ISE WebPACK edition, which provides synthesis, implementation, and device programming support for all Spartan-II devices.

What is the difference between -5 and -6 speed grade?

The -6 speed grade offers the fastest propagation delays and highest operating frequencies in the Spartan-II family. It is only available in the commercial temperature range. The -5 speed grade is slightly slower but available in both commercial and industrial ranges.


Why Choose the XC2S200-6FGG1054C for Your Design?

The XC2S200-6FGG1054C delivers an outstanding combination of logic capacity, I/O density, speed, and cost-effectiveness in a single programmable device. As a Pb-Free, commercial-grade Spartan-II FPGA, it is well-suited for high-volume production designs that demand maximum I/O capability and the fastest available speed grade. Its in-system reprogrammability eliminates the risk and NRE cost of fixed-logic ASICs, shortening product development cycles and enabling last-minute design changes without PCB respins.

For engineers and procurement teams sourcing Xilinx Spartan-II FPGAs, the XC2S200-6FGG1054C remains a proven and reliable choice across a broad range of digital design applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.