The XC2S200-6FGG1052C is a high-performance, cost-effective Field-Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-II family. Featuring 200,000 system gates, 5,292 logic cells, and a large 1052-ball Fine-Pitch BGA (FGG) package, this device is engineered for embedded systems, digital signal processing, communications, and industrial control applications. Whether you are an engineer sourcing components or a procurement specialist comparing FPGA solutions, this guide provides all the specifications, features, and application details you need.

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What Is the XC2S200-6FGG1052C? An Overview

The XC2S200-6FGG1052C belongs to the Xilinx Spartan-II FPGA family, one of the most widely adopted low-cost programmable logic families in the industry. The part number breaks down as follows:

• XC2S200 – Spartan-II device with 200,000 system gates
• -6 – Speed grade 6 (fastest available in the Spartan-II family, Commercial range only)
• FGG – Fine-Pitch Ball Grid Array package (Pb-free / RoHS-compliant variant)
• 1052 – 1,052-ball package
• C – Commercial temperature range (0°C to +85°C)

For engineers looking for a proven, reprogrammable alternative to mask-programmed ASICs, the XC2S200-6FGG1052C delivers exceptional value. You can explore the full range of compatible devices at Xilinx FPGA.

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XC2S200-6FGG1052C Key Specifications

General Device Specifications

Speed & Electrical Specifications

Package Specifications

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XC2S200-6FGG1052C Key Features and Architecture

#### Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1052C contains 1,176 CLBs arranged in a 28×42 matrix. Each CLB consists of two slices, and each slice contains two 4-input Look-Up Tables (LUTs) and two flip-flops. This architecture gives designers enormous flexibility for implementing combinational and sequential logic.

#### Block RAM and Distributed RAM

The device offers 56Kbits of dedicated block RAM organized in two columns on opposite sides of the die, alongside 75,264 bits of distributed RAM embedded within the CLBs. This dual-RAM architecture enables efficient buffering, FIFOs, and on-chip data storage without consuming external memory bandwidth.

#### Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops (DLLs), one at each corner of the die, enable zero-delay clock distribution, clock multiplication, and clock phase shifting. This is critical for high-speed synchronous designs operating at or near the 200 MHz limit.

#### I/O Flexibility and Standards

With up to 284 user I/O pins, the XC2S200-6FGG1052C supports a wide range of I/O voltage standards including LVTTL, LVCMOS (3.3V, 2.5V, 1.8V, 1.5V), GTL, GTL+, SSTL, and HSTL. This makes it highly adaptable for interfacing with processors, memory devices, ADCs, DACs, and other peripherals.

#### Speed Grade -6: Highest Performance in the Family

The -6 speed grade is the fastest available in the Spartan-II lineup and is exclusively available in the Commercial temperature range. It is the ideal choice for latency-sensitive, high-throughput applications where maximum clock speed is a priority.

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XC2S200-6FGG1052C vs. Other Spartan-II Devices

The table below compares the XC2S200 with other devices in the Spartan-II family to help you choose the right part for your design.

The XC2S200 is the largest and most capable device in the Spartan-II family, making the XC2S200-6FGG1052C the top choice for complex designs that demand maximum logic resources and I/O count.

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XC2S200-6FGG1052C Ordering Information and Part Number Decoding

Understanding the Xilinx part number scheme helps engineers confirm the correct device for their application.

Note: The “G” in “FGG” distinguishes the lead-free (Pb-free) package from the standard “FG” variant. Always verify the suffix when ordering to ensure RoHS compliance.

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Advantages of the XC2S200-6FGG1052C Over ASICs

One of the most compelling reasons engineers choose the XC2S200-6FGG1052C over custom ASICs is programmability and flexibility:

• No NRE Costs – Avoid expensive non-recurring engineering fees associated with ASIC tape-outs.
• Faster Time to Market – Begin prototyping and production without waiting for silicon fabrication cycles.
• Field Upgradability – Update device logic post-deployment without any hardware replacement.
• Risk Reduction – Design changes and bug fixes are performed entirely in software.
• Cost Efficiency for Low-to-Mid Volumes – FPGAs offer superior economics compared to ASICs at moderate production volumes.

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Typical Applications for the XC2S200-6FGG1052C

The XC2S200-6FGG1052C is suited to a wide variety of demanding applications across multiple industries:

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Design Tools and Software Support

The XC2S200-6FGG1052C is supported by Xilinx ISE Design Suite, the standard toolchain for legacy Spartan-II devices. While newer Xilinx families use the Vivado Design Suite, ISE remains the recommended toolset for Spartan-II FPGA development and includes:

• XST (Xilinx Synthesis Technology) for RTL synthesis
• PAR (Place and Route) for layout optimization
• iMPACT for device programming and configuration
• ChipScope Pro for in-circuit debugging

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Frequently Asked Questions (FAQ)

What is the maximum operating frequency of the XC2S200-6FGG1052C?

The device supports system performance up to 200 MHz, with the -6 speed grade delivering the best timing performance in the Spartan-II lineup.

Is the XC2S200-6FGG1052C RoHS compliant?

Yes. The “G” suffix in the FGG package designation indicates a Pb-free, RoHS-compliant package, suitable for modern environmental regulations.

What temperature range does the XC2S200-6FGG1052C support?

The “C” suffix denotes a Commercial temperature range of 0°C to +85°C. For industrial or extended range applications, consider the Industrial (-I) variants of the XC2S200.

Can the XC2S200-6FGG1052C be reprogrammed in the field?

Yes. As an SRAM-based FPGA, it is fully reprogrammable. Configuration is loaded at power-up from an external PROM or via JTAG, and the device can be reconfigured as many times as needed.

What is the difference between XC2S200-6FGG1052C and XC2S200-5FGG456C?

The key differences are speed grade (-6 is faster than -5) and package (1052-ball FGG vs. 456-ball FGG). The 1052-ball package provides more I/O routing flexibility in large PCB designs.

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Summary: Why Choose the XC2S200-6FGG1052C?

The XC2S200-6FGG1052C is the flagship device of Xilinx’s Spartan-II family — combining the highest gate count (200K), the fastest speed grade (-6), maximum I/O (284 pins), and a large, PCB-friendly 1052-ball BGA package. It is a proven, field-upgradable FPGA solution ideal for engineers and procurement teams seeking reliable, cost-effective programmable logic. Its Pb-free construction ensures compliance with modern environmental standards, and its broad I/O standard support guarantees compatibility with virtually any system interface.

For a complete selection of compatible and alternative Xilinx programmable logic devices, visit Xilinx FPGA.