The XC2S200-6FGG1051C is a high-performance field-programmable gate array (FPGA) from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications, this 200,000-gate FPGA delivers exceptional flexibility, programmability, and speed in a compact Fine-Pitch Ball Grid Array (FBGA) package. Whether you’re developing embedded systems, digital signal processing circuits, or prototyping complex logic designs, the XC2S200-6FGG1051C offers a proven and reliable solution.
What Is the XC2S200-6FGG1051C?
The XC2S200-6FGG1051C belongs to Xilinx’s Spartan-II product line — a family of 2.5V FPGAs built on 0.18µm process technology. The part number breaks down as follows:
| Part Number Segment |
Meaning |
| XC2S200 |
Spartan-II FPGA, 200K system gates |
| -6 |
Speed grade 6 (fastest available for this family) |
| FGG |
Fine-pitch Ball Grid Array (FBGA) package, Pb-Free |
| 1051 |
1051-pin package |
| C |
Commercial temperature range (0°C to +85°C) |
This device is ideal for engineers and procurement teams looking for a fast, lead-free FPGA in a large pin-count BGA package.
XC2S200-6FGG1051C Key Specifications
General Electrical Specifications
| Parameter |
Value |
| Manufacturer |
Xilinx (AMD) |
| Product Family |
Spartan-II |
| Part Number |
XC2S200-6FGG1051C |
| Logic Cells |
5,292 |
| System Gates |
200,000 |
| Speed Grade |
-6 (Commercial only) |
| Core Voltage (VCC) |
2.5V |
| I/O Voltage |
2.5V (multi-standard I/O supported) |
| Process Technology |
0.18µm |
| Operating Temperature |
0°C to +85°C (Commercial) |
| Package Type |
Fine-Pitch BGA (FGG) |
| Pin Count |
1,051 |
| RoHS / Pb-Free |
Yes (FGG suffix = Pb-free) |
Logic and Memory Resources
| Resource |
XC2S200 Value |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM (bits) |
75,264 |
| Block RAM (bits) |
56K (56,000 bits) |
| Delay-Locked Loops (DLLs) |
4 |
XC2S200-6FGG1051C Core Features and Architecture
Configurable Logic Blocks (CLBs)
Each CLB in the XC2S200 contains four slices, and each slice includes two Look-Up Tables (LUTs) and two flip-flops. The 28×42 CLB array gives designers 1,176 total CLBs — providing substantial programmable logic capacity for complex designs.
Block RAM
The XC2S200-6FGG1051C includes 56Kb of dual-port block RAM, arranged in two columns on opposite sides of the die. This dedicated memory supports high-speed data buffering, FIFOs, and lookup table applications without consuming CLB resources.
Delay-Locked Loops (DLLs)
Four on-chip DLLs — one at each corner of the die — enable:
- Clock skew elimination
- Frequency synthesis (multiply/divide)
- Phase shifting
- Clock domain management
These DLLs are critical for timing closure in high-speed designs.
Input/Output Blocks (IOBs)
The XC2S200-6FGG1051C supports a wide range of I/O standards through its programmable IOBs, including LVTTL, LVCMOS, PCI, GTL, HSTL, and SSTL. Each IOB features independent input and output registers to maximize signal integrity and timing performance.
Speed Grade -6: The Fastest Spartan-II Option
The -6 speed grade is the highest performance option in the Spartan-II family and is exclusively available in the Commercial temperature range. This makes the XC2S200-6FGG1051C the go-to choice when maximum switching speed is required in a 0°C to +85°C environment.
Spartan-II Family Comparison Table
| Device |
Logic Cells |
System Gates |
CLB Array |
Max I/O |
Block RAM |
| XC2S15 |
432 |
15,000 |
8×12 |
86 |
16K |
| XC2S30 |
972 |
30,000 |
12×18 |
92 |
24K |
| XC2S50 |
1,728 |
50,000 |
16×24 |
176 |
32K |
| XC2S100 |
2,700 |
100,000 |
20×30 |
176 |
40K |
| XC2S150 |
3,888 |
150,000 |
24×36 |
260 |
48K |
| XC2S200 |
5,292 |
200,000 |
28×42 |
284 |
56K |
The XC2S200 sits at the top of the Spartan-II family, offering the highest gate count, most logic cells, and largest block RAM capacity.
Why Choose the XC2S200-6FGG1051C?
Cost-Effective Alternative to ASICs
The Spartan-II FPGA family was specifically engineered as a superior alternative to mask-programmed ASICs. Unlike ASICs, the XC2S200-6FGG1051C eliminates upfront NRE costs and allows field reprogramming — meaning design changes can be deployed without hardware replacement.
High Pin Count for Complex Interfaces
With 1,051 pins in the FGG package, this device provides ample I/O connectivity for multi-bus architectures, memory interfaces, and high-channel-count signal processing applications.
Pb-Free (RoHS-Compliant) Packaging
The “G” in the FGG package designation confirms this is a Pb-free (lead-free) package, making it compliant with RoHS environmental regulations and suitable for modern electronics manufacturing.
Rapid Prototyping and Short Development Cycles
The programmable nature of the XC2S200-6FGG1051C allows engineers to iterate quickly on designs, significantly shortening time-to-market compared to fixed-logic devices.
XC2S200-6FGG1051C Ordering and Part Identification
Decoding the Full Part Number
XC2S200 - 6 - FGG - 1051 - C
| | | | |
| | | | +-- Temperature Range: C = Commercial (0°C to +85°C)
| | | +-------- Pin Count: 1051
| | +--------------- Package: FGG = Pb-Free Fine-Pitch BGA
| +-------------------- Speed Grade: -6 (fastest, commercial only)
+----------------------------- Device: Spartan-II, 200K gates
Available Package Options for XC2S200
| Package Code |
Package Type |
Pin Count |
Pb-Free |
| PQ208 |
Plastic Quad Flat Pack (PQFP) |
208 |
No |
| PQG208 |
PQFP Pb-Free |
208 |
Yes |
| FG256 |
Fine-Pitch BGA |
256 |
No |
| FGG256 |
Fine-Pitch BGA Pb-Free |
256 |
Yes |
| FG456 |
Fine-Pitch BGA |
456 |
No |
| FGG456 |
Fine-Pitch BGA Pb-Free |
456 |
Yes |
| FGG1051 |
Fine-Pitch BGA Pb-Free |
1051 |
Yes |
Typical Applications for XC2S200-6FGG1051C
The XC2S200-6FGG1051C is widely used across industries that demand programmable logic with high pin count and fast speed:
- Telecommunications – Line card control, protocol bridging, framing logic
- Industrial Automation – Motor control interfaces, sensor data aggregation
- Embedded Systems – Co-processor logic, bus interface expansion
- Consumer Electronics – Display controllers, audio/video processing
- Test & Measurement – Data capture, pattern generation
- Networking – Packet processing, look-up engine implementation
- Defense/Aerospace – Signal processing in controlled temperature environments
Design Tools and Programming Support
Xilinx Spartan-II devices including the XC2S200-6FGG1051C are supported by:
- Xilinx ISE Design Suite – The legacy design environment for synthesis, implementation, and bitstream generation
- HDL Languages – VHDL and Verilog are fully supported
- JTAG Configuration – Boundary Scan (IEEE 1149.1) for programming and testing
- Serial/Parallel Flash – Supports configuration from external PROMs
Note: While Vivado is Xilinx’s modern suite, it does not support legacy Spartan-II devices. ISE Design Suite (version 14.7) is the recommended toolchain for XC2S200 designs.
XC2S200-6FGG1051C vs. Similar FPGA Devices
| Feature |
XC2S200-6FGG1051C |
XC2S150-6FGG456C |
XC3S200-4FT256C |
| Family |
Spartan-II |
Spartan-II |
Spartan-3 |
| Gates |
200K |
150K |
200K |
| Logic Cells |
5,292 |
3,888 |
4,320 |
| Block RAM |
56Kb |
48Kb |
72Kb |
| I/O Pins |
284 |
260 |
173 |
| Package Pins |
1,051 |
456 |
256 |
| Voltage |
2.5V |
2.5V |
1.2V core |
| Speed Grade |
-6 |
-6 |
-4 |
For engineers evaluating options, the XC2S200-6FGG1051C offers the largest I/O count in the Spartan-II family, making it uniquely suitable for high-density connectivity requirements.
Frequently Asked Questions (FAQ)
What does the -6 speed grade mean for XC2S200?
The -6 speed grade indicates the fastest performance tier within the Spartan-II family. It is exclusively available in the Commercial temperature range (0°C to +85°C). A higher speed grade number means faster propagation delays and higher maximum operating frequency.
Is the XC2S200-6FGG1051C RoHS compliant?
Yes. The “FGG” package suffix (with double “G”) denotes a Pb-free, RoHS-compliant package variant, suitable for lead-free manufacturing processes.
What is the maximum operating frequency of XC2S200-6FGG1051C?
The XC2S200 Spartan-II FPGA is rated at up to 263MHz internal performance, though achievable system frequency depends on the design’s logic depth and routing complexity.
Can the XC2S200-6FGG1051C be reprogrammed in the field?
Yes. Like all FPGAs, this device is infinitely reprogrammable. Configuration is loaded via JTAG or from an external PROM on power-up, enabling firmware updates without physical hardware changes.
What design software supports XC2S200-6FGG1051C?
Xilinx ISE Design Suite (version 14.7) is the recommended tool. VHDL and Verilog are the supported HDL languages. Simulation tools such as ModelSim and Vivado Simulator (used standalone) are also compatible.
Where to Buy XC2S200-6FGG1051C
The XC2S200-6FGG1051C is available through authorized electronics distributors and specialty FPGA component suppliers. When sourcing this component, always verify:
- Authenticity and traceability
- Date code and lot code documentation
- RoHS compliance certificates
- Storage and handling conditions (moisture sensitivity)
For a broad selection of Xilinx programmable logic devices, visit Xilinx FPGA for competitive pricing and stock availability.
Summary: XC2S200-6FGG1051C at a Glance
| Specification |
Detail |
| Part Number |
XC2S200-6FGG1051C |
| Manufacturer |
Xilinx (AMD) |
| Family |
Spartan-II |
| Logic Cells |
5,292 |
| System Gates |
200,000 |
| CLBs |
1,176 (28×42 array) |
| Block RAM |
56Kb |
| Distributed RAM |
75,264 bits |
| DLLs |
4 |
| Max User I/O |
284 |
| Speed Grade |
-6 |
| Package |
FGG (Pb-Free Fine-Pitch BGA) |
| Pin Count |
1,051 |
| Core Voltage |
2.5V |
| Temp Range |
0°C to +85°C (Commercial) |
| Process |
0.18µm |
| RoHS Compliant |
Yes |
The XC2S200-6FGG1051C remains a trusted FPGA solution for engineers requiring a high-I/O, high-speed, Pb-free programmable logic device. Its proven Spartan-II architecture, combined with the speed-6 grade and large 1051-pin BGA footprint, makes it well-suited for demanding embedded, communications, and industrial applications.