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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1049C: Xilinx Spartan-II FPGA – Full Specifications & Datasheet Guide

Product Details

The XC2S200-6FGG1049C is a high-performance, cost-effective Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume, logic-intensive applications, this device delivers 200,000 system gates in a robust 1049-ball Fine-Pitch BGA (FGG1049) package with a commercial temperature range. Whether you are an engineer replacing obsolete components or designing a new embedded system, the XC2S200-6FGG1049C remains a reliable and well-documented solution in the Xilinx FPGA lineup.


What Is the XC2S200-6FGG1049C?

The XC2S200-6FGG1049C is part of Xilinx’s Spartan-II 2.5V FPGA family, built on a 0.18 µm process technology. The part number breaks down as follows:

Part Number Segment Meaning
XC2S200 Xilinx Spartan-II, 200K system gates
-6 Speed grade 6 (fastest, Commercial only)
FGG Fine-Pitch Ball Grid Array (Pb-free package)
1049 1049-pin package
C Commercial temperature range (0°C to +85°C)

This is a Pb-free (RoHS-compliant) variant, identified by the double “G” in the package code (FGG vs FG). It is the largest and highest-pin-count package available in the XC2S200 series, making it ideal for designs that require maximum I/O flexibility.


XC2S200-6FGG1049C Key Specifications

Core Logic Resources

Parameter Value
Logic Cells 5,292
System Gates (Logic + RAM) 200,000
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Total Distributed RAM Bits 75,264 bits
Total Block RAM Bits 56K bits
Block RAM Columns 2

Electrical & Physical Characteristics

Parameter Value
Core Supply Voltage 2.5V
I/O Supply Voltage 1.5V – 3.3V
Process Technology 0.18 µm CMOS
Speed Grade -6 (Commercial grade, fastest)
Package Type FGG1049 (Fine-Pitch Ball Grid Array)
Pin Count 1049
Operating Temperature 0°C to +85°C (Commercial)
RoHS Compliance Yes (Pb-free)

Timing & Performance

Parameter Value
Maximum System Frequency Up to 200+ MHz
DLL (Delay-Locked Loop) Count 4
Configuration Clock (CCLK) Variable
Input Setup Time Fast, speed-grade dependent

XC2S200-6FGG1049C Architecture Overview

Configurable Logic Blocks (CLBs)

The Spartan-II architecture organizes its logic into Configurable Logic Blocks (CLBs), arranged in a 28×42 matrix for the XC2S200. Each CLB contains two slices, and each slice contains two 4-input Look-Up Tables (LUTs) and two flip-flops. This gives the XC2S200 significant logic density while maintaining a compact die size.

Block RAM

The XC2S200-6FGG1049C includes 56Kbits of block RAM organized in two columns on either side of the CLB array. Each block RAM is a true dual-port 4K × 4-bit synchronous RAM that can be configured in multiple aspect ratios. This makes the device well-suited for applications requiring on-chip data buffering, FIFOs, or lookup tables.

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops (DLLs) are placed at the four corners of the die. The DLLs allow designers to eliminate clock distribution delays, multiply or divide clock frequencies, and phase-shift clock signals — all critical for high-speed synchronous designs.

Input/Output Blocks (IOBs)

The device supports up to 284 user I/Os through its Input/Output Blocks. Each IOB supports multiple I/O standards including LVTTL, LVCMOS (1.8V, 2.5V, 3.3V), PCI, GTL, HSTL, SSTL, and AGP. The high pin count of the FGG1049 package supports all available I/Os with generous space for power and ground planes.


Supported Configuration Modes

The XC2S200-6FGG1049C supports multiple configuration modes, giving designers flexibility in how the FPGA is programmed at startup:

Configuration Mode M[2:0] CCLK Direction Data Width DOUT
Master Serial 000 Output 1-bit Yes
Slave Serial 110 Input 1-bit Yes
Slave Parallel (SelectMAP) 010 Input 8-bit No
Boundary-Scan (JTAG) 100 N/A 1-bit No

Configuration data is stored in an external PROM or provided via JTAG. The device enters a high-impedance state on all I/Os during and after configuration until the design takes control.


Spartan-II Family Comparison Table

The XC2S200 is the largest member of the Spartan-II family. Here is how it compares to its siblings:

Device Logic Cells System Gates CLB Array Total CLBs Max User I/O Block RAM
XC2S15 432 15,000 8×12 96 86 16K
XC2S30 972 30,000 12×18 216 92 24K
XC2S50 1,728 50,000 16×24 384 176 32K
XC2S100 2,700 100,000 20×30 600 176 40K
XC2S150 3,888 150,000 24×36 864 260 48K
XC2S200 5,292 200,000 28×42 1,176 284 56K

Ordering Information & Part Number Variants

Xilinx offers the XC2S200 in both standard and Pb-free packaging. The FGG suffix (double G) indicates the Pb-free version. Other common XC2S200 variants include:

Part Number Package Pins Speed Grade Temp Range RoHS
XC2S200-6FGG1049C FGG1049 BGA 1049 -6 Commercial Yes
XC2S200-6FGG456C FGG456 BGA 456 -6 Commercial Yes
XC2S200-6FGG256C FGG256 BGA 256 -6 Commercial Yes
XC2S200-5FGG456C FGG456 BGA 456 -5 Commercial Yes
XC2S200-5FGG256I FGG256 BGA 256 -5 Industrial Yes
XC2S200-6PQG208C PQFP 208 -6 Commercial Yes

Note: The -6 speed grade is exclusively available in the Commercial temperature range. For Industrial temperature range (-40°C to +100°C) applications, the -5 speed grade must be used.


Typical Applications for the XC2S200-6FGG1049C

The XC2S200-6FGG1049C is ideally suited for a wide range of embedded and digital design applications:

  • Communications & Networking – line cards, protocol bridging, data path processing
  • Industrial Automation – motor control, sensor interfaces, real-time logic
  • Consumer Electronics – display controllers, video signal processing
  • Embedded Computing – bus interfaces, glue logic replacement, co-processing
  • Test & Measurement – data acquisition, signal generation, hardware acceleration
  • ASIC Prototyping – rapid design validation before tape-out

Because the Spartan-II family was designed as a cost-effective alternative to mask-programmed ASICs, the XC2S200 delivers reprogrammability and flexibility without the non-recurring engineering (NRE) costs or long lead times of traditional ASIC development.


Development Tools & Software Support

The XC2S200-6FGG1049C is supported by Xilinx (now AMD) legacy design tools:

Tool Description
ISE Design Suite Legacy Xilinx design flow; supports Spartan-II synthesis, P&R, and bitstream generation
ChipScope Pro On-chip logic analysis and debugging
JTAG Tools Boundary-scan testing and in-system programming
IP Core Generator Pre-built IP for memory controllers, DSP, and interfaces

For newer projects, engineers may consider migrating to more recent Xilinx FPGA families supported by the Vivado Design Suite, though ISE remains the recommended toolchain for Spartan-II devices.


Why Choose the XC2S200-6FGG1049C?

  • Maximum I/O in the Spartan-II family – 284 user I/Os via high-density FGG1049 package
  • Pb-free (RoHS-compliant) – meets modern environmental regulations
  • Fastest speed grade available – -6 grade for demanding timing budgets
  • Cost-effective FPGA logic – proven low-cost Spartan-II architecture
  • Four on-chip DLLs – robust clock management for high-speed synchronous designs
  • Reprogrammable – field upgrades without hardware replacement

Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1049C used for?

It is used in communications, industrial automation, embedded systems, and ASIC prototyping applications where a high I/O count, reprogrammable logic solution is needed.

What is the difference between FG and FGG in the part number?

The double “G” (FGG) denotes a Pb-free (lead-free) package, while a single “G” (FG) indicates the standard package with solder balls. Both have identical electrical performance.

Is the -6 speed grade available in industrial temperature?

No. The -6 speed grade is exclusively available in the Commercial temperature range (0°C to +85°C). For industrial temperature requirements, the -5 speed grade must be selected.

What configuration interface does the XC2S200-6FGG1049C support?

It supports Master Serial, Slave Serial, Slave Parallel (SelectMAP), and Boundary-Scan (JTAG) configuration modes.

Is the XC2S200-6FGG1049C still in production?

The Spartan-II family has reached end-of-life status from AMD/Xilinx. However, it remains widely available through authorized distributors and component specialists as a replacement or legacy-support part.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.