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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
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XC2S200-6FGG1046C: Xilinx Spartan-II FPGA – Full Specifications & Buying Guide

Product Details

The XC2S200-6FGG1046C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications, this 2.5V FPGA delivers 200,000 system gates, 5,292 logic cells, and a 1046-pin Fine Pitch Ball Grid Array (FBGA) package — making it one of the most capable devices in the Spartan-II lineup. Whether you are working on telecommunications, industrial automation, or embedded system design, the XC2S200-6FGG1046C provides the logic density and I/O flexibility engineers demand.


XC2S200-6FGG1046C Quick Overview

Attribute Details
Manufacturer Xilinx (AMD)
Part Number XC2S200-6FGG1046C
Series Spartan-II
Logic Cells 5,292
System Gates 200,000
CLB Array 28 × 42
Total CLBs 1,176
Max User I/O 284
Package Type FGG1046 (Fine Pitch BGA, Pb-Free)
Number of Pins 1046
Speed Grade -6
Supply Voltage 2.5V
Operating Temperature Commercial (0°C to +85°C)
Technology Node 0.18 µm
RoHS Compliance Pb-Free (G in part number indicates Pb-Free)

What Is the XC2S200-6FGG1046C? Understanding the Part Number

Breaking down the part number helps engineers quickly identify the exact device:

Code Segment Meaning
XC2S200 Xilinx Spartan-II, 200K system gates
-6 Speed grade -6 (fastest in the Spartan-II family)
FGG Fine Pitch Ball Grid Array, Pb-Free package
1046 1046 total pins
C Commercial temperature range (0°C to +85°C)

The -6 speed grade is the fastest available for the Spartan-II family and is exclusively offered in the Commercial temperature range. The “G” in FGG indicates a RoHS-compliant, lead-free package — ideal for designs that must meet modern environmental regulations.


XC2S200-6FGG1046C Key Features and Technical Specifications

Logic and Memory Architecture

The XC2S200-6FGG1046C is built around a robust architecture combining Configurable Logic Blocks (CLBs), distributed RAM, and dedicated block RAM resources.

Resource XC2S200 Specification
Logic Cells 5,292
System Gates (Logic + RAM) 200,000
CLB Array 28 × 42
Total CLBs 1,176
Distributed RAM 75,264 bits
Block RAM 56K bits (56,000 bits)
Configuration Bits 1,335,840

Clock and Timing Performance

The Spartan-II XC2S200 uses four on-chip Delay-Locked Loops (DLLs), one placed at each corner of the die, delivering precise clock distribution and minimal skew.

Timing Parameter Value
Max System Clock 263 MHz
DLL Count 4
DLL Placement One per die corner
Speed Grade -6 (fastest)

I/O and Packaging

I/O Parameter Value
Maximum User I/O 284
Global Clock / User Input Pins 4 (additional, not counted in I/O)
Package FGG1046 Fine Pitch BGA
Pin Count 1046
I/O Standard Support LVTTL, LVCMOS2, PCI, GTL, HSTL, SSTL, AGP

XC2S200-6FGG1046C Configuration Modes

The XC2S200-6FGG1046C supports multiple configuration modes, giving designers flexibility in how the device loads its bitstream at power-up.

Configuration Mode CCLK Direction Data Width Serial DOUT
Master Serial Output 1-bit Yes
Slave Serial Input 1-bit Yes
Slave Parallel (SelectMAP) Input 8-bit No
Boundary-Scan (JTAG) N/A 1-bit No

All I/O drivers remain in a high-impedance state during power-on and throughout the configuration process, protecting downstream circuits during startup.


Spartan-II Family Comparison: Where Does the XC2S200 Fit?

Understanding how the XC2S200 compares to other Spartan-II devices helps engineers select the right part for their design requirements.

Device Logic Cells System Gates CLB Array Max I/O Dist. RAM Block RAM
XC2S15 432 15,000 8×12 86 6,144 16K
XC2S30 972 30,000 12×18 92 13,824 24K
XC2S50 1,728 50,000 16×24 176 24,576 32K
XC2S100 2,700 100,000 20×30 176 38,400 40K
XC2S150 3,888 150,000 24×36 260 55,296 48K
XC2S200 5,292 200,000 28×42 284 75,264 56K

The XC2S200 is the largest and most capable device in the Spartan-II family, offering the highest logic density, the most I/O pins, and the largest memory resources.


Why Choose the XC2S200-6FGG1046C? Core Advantages

Cost-Effective Alternative to Mask-Programmed ASICs

The Spartan-II FPGA family was designed as a direct, cost-effective alternative to mask-programmed ASICs. Unlike ASICs, the XC2S200-6FGG1046C eliminates expensive non-recurring engineering (NRE) costs, long manufacturing lead times, and the risk of design errors that result in costly respins. Because the device is fully reprogrammable, design upgrades can be deployed in the field without any hardware replacement — a capability that is simply not possible with traditional ASICs.

High I/O Density with Flexible Standards

With up to 284 user-configurable I/O pins and support for a wide range of I/O standards — including PCI, LVTTL, HSTL, SSTL, and AGP — the XC2S200-6FGG1046C adapts to virtually any board-level interface requirement. This flexibility makes it suitable for bridging multiple voltage domains and bus standards within a single design.

Dedicated Block RAM and Distributed RAM

Designers benefit from both distributed RAM (75,264 bits embedded within the CLB array) and dedicated block RAM (56K bits in two vertical columns). This dual-memory architecture supports simultaneous read/write operations and enables high-bandwidth data buffering without consuming general-purpose logic resources.

Four On-Chip DLLs for Precision Clocking

The four on-chip Delay-Locked Loops eliminate clock skew, support clock multiplication and division, and enable zero-delay clock buffering. This is critical for high-speed synchronous designs where timing margin is tight.

Pb-Free, RoHS-Compliant Packaging

The “G” in the FGG package code confirms lead-free solder ball construction, making the XC2S200-6FGG1046C compliant with RoHS directives — important for products sold in the European Union and other regulated markets.


XC2S200-6FGG1046C Applications

The XC2S200-6FGG1046C is well-suited for a broad range of applications:

Application Area Use Case
Telecommunications Protocol bridging, line card control, framing logic
Industrial Automation Motor control, sensor interfacing, PLC logic
Embedded Systems Custom processor cores, co-processing
Consumer Electronics Display controllers, signal routing
Networking & Communications Packet processing, bus bridging
Test & Measurement Data acquisition, pattern generation
Defense & Aerospace (legacy) Ruggedized legacy system maintenance

XC2S200-6FGG1046C vs. Alternative Part Numbers

Customers sometimes search for related XC2S200 variants. The table below clarifies key differences between popular ordering codes:

Part Number Package Pins Speed Grade Pb-Free Temp Range
XC2S200-6FGG1046C FGG1046 FBGA 1046 -6 Yes Commercial
XC2S200-6FG256C FG256 FBGA 256 -6 No Commercial
XC2S200-6FGG256C FGG256 FBGA 256 -6 Yes Commercial
XC2S200-5FG456C FG456 FBGA 456 -5 No Commercial
XC2S200-6PQ208C PQ208 PQFP 208 -6 No Commercial
XC2S200-5FG456I FG456 FBGA 456 -5 No Industrial

The XC2S200-6FGG1046C stands out by combining the highest pin count (1046), the fastest speed grade (-6), and a Pb-free package in a single device — maximizing both I/O availability and environmental compliance.


XC2S200-6FGG1046C: Design and Development Tools

Xilinx supports the Spartan-II family through its legacy ISE Design Suite. While newer devices use the Vivado Design Suite, ISE remains the appropriate toolchain for XC2S200-based designs. Key tools include:

  • Xilinx ISE – Synthesis, implementation, and bitstream generation
  • IMPACT – Device programming and configuration
  • ChipScope Pro – In-system logic analysis and debugging
  • CORE Generator – IP core integration

Engineers maintaining legacy designs or developing new products on proven silicon can access ISE through the AMD/Xilinx archive.


Frequently Asked Questions About the XC2S200-6FGG1046C

Q: What is the maximum operating frequency of the XC2S200-6FGG1046C? The device supports system clock rates up to 263 MHz. The -6 speed grade represents the fastest performance tier in the Spartan-II family.

Q: Is the XC2S200-6FGG1046C still recommended for new designs? Xilinx has classified the Spartan-II family as not recommended for new designs (NRND). For new projects, AMD/Xilinx recommends migrating to the Spartan-7 or Artix-7 families. However, the XC2S200-6FGG1046C remains widely used in legacy system maintenance, military spares, and long-lifecycle industrial equipment.

Q: What is the difference between FGG1046 and FG1046 packages? The extra “G” in FGG1046 indicates a Pb-Free (lead-free) package with RoHS-compliant solder balls. The FG1046 (without the extra G) uses standard tin-lead solder.

Q: What programming files does the XC2S200-6FGG1046C use? The device uses a bitstream file (.bit) generated by the Xilinx ISE toolchain. It can be loaded via JTAG (Boundary-Scan), Master Serial, Slave Serial, or Slave Parallel (SelectMAP) configuration modes.

Q: How many user I/O pins are available on the XC2S200-6FGG1046C? The XC2S200 provides up to 284 user-configurable I/O pins. Note that four additional global clock/user input pins are not counted in this total.


Where to Buy the XC2S200-6FGG1046C

The XC2S200-6FGG1046C is available through authorized distributors and specialty component brokers. When sourcing this part, always verify:

  • Date code and lot traceability
  • Authentic Xilinx marking and packaging
  • RoHS/Pb-Free compliance documentation if required
  • Distributor authorization status to avoid counterfeit components

For a broader selection of Xilinx programmable logic devices, visit Xilinx FPGA for sourcing options, pricing, and technical support.


Summary: XC2S200-6FGG1046C at a Glance

The XC2S200-6FGG1046C is Xilinx’s most powerful Spartan-II device, combining 200,000 system gates, 284 user I/O pins, 56K bits of block RAM, four on-chip DLLs, and a Pb-free 1046-pin FBGA package — all operating at 2.5V with a -6 speed grade for maximum performance. While positioned as a legacy device for new designs, it remains an essential component for industrial maintenance, defense spares, and long-lifecycle embedded applications. Its proven reliability, wide I/O standard support, and flexible configuration options make the XC2S200-6FGG1046C a trusted choice for engineers working with existing Spartan-II infrastructure.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.