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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1044C: Xilinx Spartan-II FPGA – Full Specifications, Features & Datasheet Guide

Product Details

The XC2S200-6FGG1044C is a high-density Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Featuring 200,000 system gates, 5,292 logic cells, and a robust 1044-pin Fine-Pitch Ball Grid Array (FBGA) package, this device is engineered for cost-sensitive, high-volume digital applications. Whether you are designing embedded systems, communications hardware, or industrial control equipment, the XC2S200-6FGG1044C delivers reliable performance at 2.5V operation with a -6 speed grade optimized for commercial temperature environments.

If you are sourcing or evaluating Xilinx programmable logic devices, explore the full range available at Xilinx FPGA.


What Is the XC2S200-6FGG1044C?

The XC2S200-6FGG1044C is part of Xilinx’s Spartan-II FPGA family, a 2.5V programmable logic platform built on 0.18µm process technology. The part number breaks down as follows:

Part Number Segment Meaning
XC2S200 Spartan-II device with 200K system gates
-6 Speed grade (-6 is the fastest, commercial only)
FGG Fine-Pitch Ball Grid Array package type
1044 1044 total pins
C Commercial temperature range (0°C to +85°C)

This FPGA is positioned as a superior, programmable alternative to mask-programmed ASICs, eliminating the high upfront NRE costs, long design cycles, and inflexibility of traditional custom silicon.


XC2S200-6FGG1044C Key Specifications

Core Logic Resources

Parameter Value
Device Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Slices per CLB 4
Total Slices 4,704

Memory Resources

Memory Type Capacity
Distributed RAM 75,264 bits
Block RAM 56K bits (7 × 8K blocks)
Total On-Chip Memory ~131K bits

I/O and Package Details

Parameter Value
Package Type FGG (Fine-Pitch BGA)
Total Package Pins 1,044
Maximum User I/O 284
I/O Standards Supported LVTTL, LVCMOS2, PCI, GTL, SSTL, HSTL, CTT
Output Drive Strength Programmable (2mA – 24mA)

Electrical and Timing Characteristics

Parameter Value
Core Supply Voltage (VCCINT) 2.5V
I/O Supply Voltage (VCCO) 1.5V – 3.3V
Speed Grade -6 (Fastest)
Maximum System Frequency Up to 263 MHz
Technology Node 0.18µm
Temperature Range Commercial: 0°C to +85°C

XC2S200-6FGG1044C Architecture Overview

Configurable Logic Blocks (CLBs)

The heart of the XC2S200 is its CLB array arranged in a 28 × 42 grid, totaling 1,176 CLBs. Each CLB contains four slices, and each slice includes two 4-input Look-Up Tables (LUTs), two flip-flops, and dedicated carry logic. This architecture allows the XC2S200-6FGG1044C to implement complex combinational and sequential logic efficiently.

Block RAM Architecture

Seven independent 8K-bit block RAM modules are distributed symmetrically across the device. These dual-port RAM blocks support synchronous read and write operations and can be configured as various widths and depths, making them ideal for FIFOs, data buffers, and lookup tables in DSP pipelines.

Delay-Locked Loops (DLLs)

The XC2S200-6FGG1044C incorporates four on-chip Delay-Locked Loops (DLLs), one placed at each corner of the die. DLLs allow precise clock edge alignment, clock multiplication and division, and phase shifting — critical features for high-speed synchronous designs.

Input/Output Blocks (IOBs)

Each IOB supports a wide range of single-ended and differential I/O standards. Programmable drive strength and slew rate control reduce signal integrity issues. The device supports up to 284 user I/O pins in the FGG1044 package, providing extensive connectivity for system-level integration.


XC2S200-6FGG1044C vs. Other Spartan-II Family Members

The table below compares the XC2S200 with other members of the Spartan-II family to help engineers select the right device for their design requirements.

Device System Gates Logic Cells CLB Array Max User I/O Block RAM
XC2S15 15,000 432 8 × 12 86 16K
XC2S30 30,000 972 12 × 18 92 24K
XC2S50 50,000 1,728 16 × 24 176 32K
XC2S100 100,000 2,700 20 × 30 176 40K
XC2S150 150,000 3,888 24 × 36 260 48K
XC2S200 200,000 5,292 28 × 42 284 56K

The XC2S200 is the largest and most capable device in the Spartan-II family, making the XC2S200-6FGG1044C the premium choice when maximum logic density and I/O count are required.


Available Package Options for XC2S200

The XC2S200 is offered in multiple package options to suit different PCB form factors and I/O requirements.

Package Type Total Pins Max User I/O
PQ208 Plastic Quad Flat Pack (PQFP) 208 140
FG256 Fine-Pitch BGA 256 176
FG456 Fine-Pitch BGA 456 284
FGG456 Fine-Pitch BGA (Pb-free) 456 284
FGG1044 Fine-Pitch BGA 1,044 284

The FGG1044 package delivers the same 284 user I/O as the FGG456 but within a larger footprint, which can simplify PCB routing and thermal management in dense board designs.


Configuration Modes

The XC2S200-6FGG1044C supports several industry-standard configuration interfaces, enabling flexible system integration.

Configuration Mode Description
Master Serial Self-timed serial configuration using Xilinx PROMs
Slave Serial Controlled by external logic or processor
Master Parallel (SelectMAP) Fast, byte-wide parallel loading
Slave Parallel (SelectMAP) Processor-controlled byte-wide loading
JTAG (IEEE 1149.1) Boundary scan and in-circuit configuration

XC2S200-6FGG1044C Applications

The XC2S200-6FGG1044C excels across a broad range of industries due to its combination of logic density, memory resources, and flexible I/O.

Communications and Networking

The device’s high gate count and fast clock speeds make it well-suited for implementing communication protocols, packet processing, serializer/deserializer (SERDES) logic, and network interface controllers.

Industrial Automation and Control

The XC2S200-6FGG1044C is used in motor drive controllers, PLC (Programmable Logic Controller) interfaces, sensor fusion systems, and real-time process monitoring equipment where deterministic timing is essential.

Embedded Processing and Co-Processing

With its CLB resources and distributed RAM, this FPGA can implement soft-core processors (e.g., Xilinx PicoBlaze) alongside custom hardware accelerators, reducing system BOM costs.

Medical and Diagnostic Equipment

The device’s reliability and field-reconfigurability make it a popular choice in imaging systems, patient monitoring devices, and diagnostic instrument signal processing pipelines.

Consumer and Set-Top Electronics

Cost-optimized for high-volume production, the Spartan-II family targets consumer applications such as display controllers, codec implementations, and interface bridging circuits.


Design Tools and Software Support

The XC2S200-6FGG1044C is fully supported by Xilinx (now AMD) legacy design toolchains.

Tool Purpose
Xilinx ISE Design Suite Synthesis, implementation, and bitstream generation
ModelSim / ISIM RTL and gate-level simulation
ChipScope Pro In-system logic analysis
JTAG Programming Cable In-circuit configuration and debugging
VHDL / Verilog / Schematic Supported HDL and entry methods

Note: For new designs, AMD recommends migrating to newer device families (e.g., Spartan-7 or Artix-7) with Vivado Design Suite support. The XC2S200-6FGG1044C is best suited for legacy system maintenance and production continuity.


Ordering Information and Part Number Decoder

How to Read the XC2S200-6FGG1044C Part Number

XC  2S  200  -6  FGG  1044  C
│   │   │    │   │    │     └── Temperature: C = Commercial (0°C to +85°C)
│   │   │    │   │    └──────── Pin Count: 1044
│   │   │    │   └───────────── Package: FGG = Fine-Pitch BGA (Pb-Free)
│   │   │    └───────────────── Speed Grade: -6 (Fastest, Commercial Only)
│   │   └────────────────────── Gate Count: 200K system gates
│   └────────────────────────── Family: 2S = Spartan-II
└────────────────────────────── Xilinx FPGA prefix

RoHS and Pb-Free Status

The FGG suffix indicates this is the Pb-free (lead-free) version of the package, compliant with RoHS directives. The standard (non-Pb-free) variant uses the FG suffix without the extra “G.”


Frequently Asked Questions (FAQ)

What is the maximum operating frequency of the XC2S200-6FGG1044C?

The XC2S200-6FGG1044C operates at up to 263 MHz system frequency with the -6 speed grade, which is the fastest speed grade available in the Spartan-II family and is exclusive to the commercial temperature range.

Is the XC2S200-6FGG1044C still in production?

The XC2S200-6FGG1044C and the broader Spartan-II family have been subject to product discontinuation notices (PDN). Engineers sourcing this part should verify availability through authorized distributors and consider approved lifecycle stock for long-term production needs.

What is the difference between FGG1044 and FGG456 packages?

Both packages support the same maximum of 284 user I/O pins. The FGG1044 uses a larger 1044-ball array, which provides greater ball pitch spacing, simplifying PCB trace routing and potentially improving thermal dissipation compared to the denser FGG456 format.

Can the XC2S200-6FGG1044C be reprogrammed in the field?

Yes. The Spartan-II FPGA is an SRAM-based device, meaning it must be configured at power-up from an external configuration source (serial PROM, parallel flash, or processor). This also means the design can be updated in the field without hardware replacement — a key advantage over ASICs and OTP devices.

What voltage does the XC2S200-6FGG1044C require?

The core logic (VCCINT) operates at 2.5V. The I/O supply voltage (VCCO) is programmable per I/O bank and can range from 1.5V to 3.3V to interface with various logic families.


Summary

The XC2S200-6FGG1044C is the top-tier device in the Xilinx Spartan-II FPGA family, combining 200,000 system gates, 5,292 logic cells, 131K bits of on-chip memory, and 284 user I/O pins in a 1044-ball fine-pitch BGA package. Its -6 speed grade, 2.5V operation, and support for a wide range of I/O standards make it a versatile solution for communications, industrial, medical, and embedded applications. While best suited for legacy design support and high-volume production continuity, the XC2S200-6FGG1044C remains a capable and field-proven programmable logic device.

For a broader selection of programmable logic solutions, visit Xilinx FPGA.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.