The XC2S200-6FGG1042C is a high-performance, cost-effective Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume applications that demand versatile programmability, the XC2S200-6FGG1042C delivers 200,000 system gates, 5,292 logic cells, and a robust 1,042-pin Fine-Pitch Ball Grid Array (FBGA) package — making it a powerful choice for engineers seeking an ASIC alternative without the overhead of custom silicon development.

Whether you are designing telecom equipment, industrial controllers, consumer electronics, or embedded systems, the XC2S200-6FGG1042C offers the flexibility and performance required for demanding digital designs. Explore the full range of Xilinx FPGA solutions to find the right fit for your project.

What Is the XC2S200-6FGG1042C? – Product Overview

The XC2S200-6FGG1042C belongs to Xilinx’s Spartan-II FPGA family, a 2.5V programmable logic device series built on 0.18µm CMOS process technology. The part number decodes as follows:

This makes the XC2S200-6FGG1042C the largest and fastest variant in the Spartan-II family, ideal for designs requiring maximum I/O density alongside top-tier clock performance.

XC2S200-6FGG1042C Key Specifications

Core Logic Specifications

Electrical & Environmental Specifications

Timing & Performance

XC2S200-6FGG1042C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1042C contains 1,176 Configurable Logic Blocks arranged in a 28×42 array. Each CLB includes four logic cells, each with a 4-input Look-Up Table (LUT), a flip-flop, and fast carry logic. This architecture enables efficient implementation of arithmetic functions, state machines, and data path logic.

Input/Output Blocks (IOBs)

With 284 maximum user I/O pins, the XC2S200-6FGG1042C supports a wide range of I/O voltage standards including LVTTL, LVCMOS, SSTL, GTL, and more. Each IOB features programmable slew rate control, optional output inversion, and pull-up/pull-down resistors.

Block RAM

The device features 56Kbits of dedicated block RAM organized in two columns on opposite sides of the die. Block RAM supports true dual-port operation, making it ideal for FIFOs, lookup tables, and memory-intensive applications.

Delay-Locked Loops (DLLs)

Four on-chip DLLs — one at each corner of the die — provide zero clock skew distribution, frequency synthesis, phase shifting, and input delay compensation. This ensures reliable high-speed synchronous designs.

Spartan-II Family Comparison Table

The XC2S200 is the largest member of the Spartan-II lineup. See how it compares:

The XC2S200-6FGG1042C is clearly the highest-capacity device in this family, making it the go-to choice when maximum logic density and I/O count are required.

Supported I/O Standards

The XC2S200-6FGG1042C supports a broad selection of industry-standard I/O interfaces:

XC2S200-6FGG1042C vs. Other Package Options

The XC2S200 is available in multiple packages. Here is a comparison to help you choose the right variant:

The FGG1042C variant offers the highest pin count in the XC2S200 lineup, enabling maximum routing flexibility and I/O bandwidth for complex board designs.

Key Features of the XC2S200-6FGG1042C

• 200,000 system gates — the largest gate count in the Spartan-II family
• 5,292 logic cells with 4-input LUTs and dedicated flip-flops
• 1,176 CLBs (28×42 array) for dense logic implementation
• 284 user I/O pins supporting a wide variety of voltage standards
• 56Kbits of block RAM in dual-port configuration
• 4 Delay-Locked Loops (DLLs) for zero-skew clock distribution and frequency synthesis
• Speed grade -6 — the fastest available for the Spartan-II family
• 2.5V core supply voltage with multi-standard I/O flexibility
• 1,042-pin FGG (Pb-free BGA) package for high-density PCB designs
• Commercial temperature range: 0°C to +85°C
• JTAG boundary scan (IEEE 1149.1) for board-level testing
• Partial reconfiguration not required — full bitstream configuration via JTAG, Master Serial, Slave Serial, SelectMAP

Configuration Modes

The XC2S200-6FGG1042C supports multiple configuration modes to suit different system architectures:

Typical Applications for the XC2S200-6FGG1042C

The XC2S200-6FGG1042C is widely used in applications that require high I/O bandwidth, fast logic, and large on-chip memory. Common use cases include:

• Telecommunications equipment – line cards, switching fabrics, protocol converters
• Industrial automation – programmable motion controllers, sensor interfaces
• Medical devices – signal processing, imaging data pipelines
• Consumer electronics – set-top boxes, digital video processing
• Automotive electronics – engine control, ADAS sensor fusion (with appropriate temperature margin)
• Military and aerospace (COTS) – signal intelligence, radar processing
• Embedded systems – custom processor interfaces, bus bridges (PCI, ISA, VME)
• Networking hardware – packet processing, protocol bridging, MAC/PHY interfaces

Development Tools & Software Support

The XC2S200-6FGG1042C is supported by Xilinx’s legacy design tools. Engineers working with Spartan-II devices should use:

Note: Xilinx Vivado does not support Spartan-II devices. Use ISE Design Suite 14.7 (the final release) for XC2S200-6FGG1042C design implementation. ISE 14.7 is available as a free download from the AMD/Xilinx website.

Ordering Information & Part Number Decoder

Understanding the Xilinx FPGA part number structure helps ensure you order the correct component:

XC  2S  200  -  6  FGG  1042  C
|   |    |      |   |     |    |
|   |    |      |   |     |    +-- Temperature: C = Commercial (0° to +85°C)
|   |    |      |   |     +------- Pin count: 1042
|   |    |      |   +------------- Package: FGG = Fine-Pitch BGA (Pb-free)
|   |    |      +----------------- Speed grade: -6 (fastest)
|   |    +------------------------ Gate count: 200K
|   +----------------------------- Family: Spartan-II (2S)
+---------------------------------  Xilinx FPGA prefix

Why Choose the XC2S200-6FGG1042C Over a Custom ASIC?

The Spartan-II XC2S200-6FGG1042C is designed as a direct ASIC alternative, offering compelling advantages:

For projects at prototype or low-to-medium volume stages, the XC2S200-6FGG1042C provides an unmatched combination of speed, flexibility, and cost-effectiveness.

Frequently Asked Questions (FAQ)

What is the maximum clock frequency of the XC2S200-6FGG1042C?

The XC2S200-6FGG1042C (-6 speed grade) supports system clock frequencies exceeding 200 MHz for simple register-to-register paths. Actual achievable frequency depends on the logic depth, routing complexity, and I/O constraints of your specific design.

Is the XC2S200-6FGG1042C RoHS compliant?

Yes. The “G” in the package designator “FGG” indicates a Pb-free (lead-free) package, making the XC2S200-6FGG1042C compliant with RoHS environmental directives.

What design software do I need for the XC2S200-6FGG1042C?

Use Xilinx ISE Design Suite 14.7. Vivado does not support Spartan-II devices. ISE 14.7 supports synthesis, place-and-route, simulation, and programming for all Spartan-II devices.

Can I use VHDL or Verilog with the XC2S200-6FGG1042C?

Yes. The XC2S200-6FGG1042C fully supports both VHDL and Verilog HDL design entry through ISE, as well as schematic capture.

What is the difference between FGG and FG packages?

Both are Fine-Pitch Ball Grid Array packages. The “G” suffix in “FGG” denotes the Pb-free (RoHS-compliant) version. The “FG” variant uses standard tin-lead solder balls.

Is the XC2S200-6FGG1042C still in production?

The Spartan-II family has reached end-of-life status. However, the XC2S200-6FGG1042C remains widely available through authorized distributors and component brokers for legacy system maintenance and production continuity.

Summary

The XC2S200-6FGG1042C is the flagship device of Xilinx’s Spartan-II FPGA family, combining 200,000 system gates, 5,292 logic cells, 284 user I/Os, 56Kbits of block RAM, and four DLLs in a 1,042-pin Pb-free BGA package. Operating at the fastest -6 speed grade in a commercial temperature range, this FPGA is an excellent choice for any application requiring high logic density, broad I/O voltage compatibility, and field-programmable flexibility.

For engineers building telecommunications, industrial, or embedded systems, the XC2S200-6FGG1042C delivers the performance and flexibility needed to accelerate development — all without the cost and risk of custom ASIC development.