The XC2S200-6FGG1040C is a high-performance, cost-effective Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume, logic-intensive applications, this device delivers 200,000 system gates, 5,292 logic cells, and up to 284 user I/O pins — all housed in a robust 1040-ball Fine-Pitch BGA (FBGA) package. Whether you are building communication systems, industrial controllers, or digital signal processing solutions, the XC2S200-6FGG1040C offers an outstanding combination of performance, flexibility, and value.

For a broader selection of programmable logic solutions, explore our full range of Xilinx FPGA products.

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What Is the XC2S200-6FGG1040C? Understanding the Part Number

Before diving into specifications, it helps to decode the part number:

The “G” in FGG confirms this is a RoHS-compliant, Pb-free package — an important distinction for modern PCB assembly and environmental compliance requirements.

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XC2S200-6FGG1040C Key Specifications at a Glance

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XC2S200-6FGG1040C Architecture and Core Features

Configurable Logic Blocks (CLBs)

The XC2S200 contains 1,176 CLBs arranged in a 28×42 matrix. Each CLB includes four logic cells, and each logic cell contains a 4-input function generator (LUT), carry logic, and a flip-flop. This architecture enables highly efficient implementation of arithmetic, counters, state machines, and custom logic functions.

Distributed RAM and Block RAM

One of the standout features of the Spartan-II family is its flexible memory architecture:

• Distributed RAM: 75,264 bits — derived from the LUT-based logic fabric, ideal for small, fast, shallow memory structures embedded within your design.
• Block RAM: 56K bits — dedicated synchronous dual-port RAM blocks suitable for FIFOs, lookup tables, and larger data buffers.

Input/Output Blocks (IOBs) and User I/O

The XC2S200-6FGG1040C supports up to 284 user I/O pins, each with a fully programmable Input/Output Block (IOB). Key IOB capabilities include programmable output drive strength, slew rate control (fast/slow), optional pull-up/pull-down/keeper latches, and support for multiple I/O standards including LVTTL, LVCMOS, SSTL, and GTL.

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops (DLLs), one at each corner of the die, provide precise clock management. DLLs eliminate clock distribution skew and enable clock multiplication and division — critical for synchronous digital systems.

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XC2S200-6FGG1040C Speed Grade and Timing Performance

The -6 speed grade is the fastest available for the XC2S200 in the commercial temperature range. Higher speed grades translate directly to lower propagation delays and higher maximum operating frequencies.

Note: The -6 speed grade is exclusively available in the commercial temperature range and is not offered in industrial variants.

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XC2S200-6FGG1040C Package Information: FGG1040 FBGA

The FGG1040 package is a 1040-ball Fine-Pitch Ball Grid Array in a Pb-free configuration. This package type offers significant advantages over traditional QFP options:

The FBGA package is the preferred choice for production designs requiring maximum I/O density and superior thermal management.

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Spartan-II Family Comparison: XC2S200 vs. Other Devices

Understanding how the XC2S200 fits within the Spartan-II family helps you make the right device selection for your project.

The XC2S200 is the largest and most capable device in the Spartan-II family, making it ideal for designs that have outgrown smaller devices but do not yet require the additional cost of higher-end families.

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Typical Applications for the XC2S200-6FGG1040C

Digital Signal Processing (DSP)

The device’s large distributed RAM and CLB array make it an efficient platform for implementing FIR filters, FFT engines, and data compression algorithms at the logic level without requiring an external DSP chip.

Communications and Networking

With up to 284 user I/O pins and high-speed DLLs, the XC2S200-6FGG1040C excels in interface bridging, protocol conversion, line-card logic, and parallel bus controllers for networking equipment.

Industrial Control Systems

The Spartan-II architecture supports robust finite state machine (FSM) implementations, making it ideal for motor controllers, robotics, PLC replacement, and industrial automation logic.

Video and Image Processing

Block RAM resources enable efficient line-buffer and frame-buffer implementations for real-time video pipeline processing, resolution scaling, and pattern recognition pre-processing.

Embedded System Acceleration

Designers frequently use the XC2S200 to offload compute-intensive tasks from embedded processors, implementing custom hardware accelerators for tasks like encryption, checksumming, and data formatting.

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Configuration Modes for the XC2S200-6FGG1040C

The XC2S200-6FGG1040C supports several standard configuration modes:

Xilinx’s ISE Design Suite is the primary development tool for Spartan-II devices, supporting synthesis, simulation, implementation, and bitstream generation. Note that Vivado does not support Spartan-II devices.

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Why Choose the XC2S200-6FGG1040C?

Cost-Effective ASIC Replacement

The Spartan-II family was specifically engineered as a cost-competitive alternative to mask-programmed ASICs. The XC2S200 eliminates high NRE (Non-Recurring Engineering) costs, long tape-out cycles, and inherent inflexibility of ASICs — while delivering comparable density and performance for most applications.

In-Field Reconfigurability

Unlike ASICs or standard logic ICs, the XC2S200-6FGG1040C can be reprogrammed in the field without hardware replacement. This dramatically extends product life cycles and enables post-deployment bug fixes or feature additions.

Proven, Mature Architecture

The Spartan-II family has a massive installed base and extensive community support. Its maturity means excellent documentation, proven silicon reliability, and broad availability of reference designs.

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Ordering Information: XC2S200-6FGG1040C and Alternative Part Numbers

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Frequently Asked Questions (FAQ) About the XC2S200-6FGG1040C

What does the “G” in FGG1040 mean?

The “G” suffix in FGG indicates this is a Pb-free (lead-free) package, compliant with RoHS environmental directives. This is the standard for modern electronic manufacturing.

What design tools are compatible with the XC2S200-6FGG1040C?

Xilinx ISE Design Suite (version 14.x and earlier) fully supports the Spartan-II family. Vivado does not support Spartan-II devices; ISE is required for this part.

Can I use the XC2S200-6FGG1040C in an industrial temperature application?

No. The -6 speed grade is exclusively offered in the commercial temperature range (0°C to +85°C). For industrial temperature applications (-40°C to +85°C), select the -5I or -4I speed grade variants.

What is the core supply voltage for the XC2S200-6FGG1040C?

The internal core voltage (VCCINT) is 2.5V. I/O voltage (VCCO) is configurable per bank to support multiple interface standards.

How many I/O pins does the XC2S200-6FGG1040C have?

The XC2S200-6FGG1040C in the FGG1040 package provides up to 284 user I/O pins, plus four dedicated global clock/user input pins.

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Conclusion: Is the XC2S200-6FGG1040C Right for Your Design?

The XC2S200-6FGG1040C remains a powerful and versatile choice for designers who need high logic density, abundant I/O, proven silicon, and a cost-effective alternative to ASICs. Its -6 speed grade, Pb-free 1040-pin FBGA package, 200K system gates, and rich memory resources make it suitable for a wide range of demanding digital design applications — from communications and DSP to industrial automation and embedded acceleration.

Whether you are sourcing parts for a legacy design or evaluating programmable logic for a new project, the XC2S200-6FGG1040C delivers the performance and flexibility that the Xilinx Spartan-II family is known for.