The XC2S200-6FGG1037C is a high-density, 2.5V field-programmable gate array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume, cost-sensitive applications, this device delivers up to 200,000 system gates, 284 user I/O pins, and a 1037-ball Fine-Pitch BGA (FGG) package — making it one of the most capable members of the Spartan-II lineup. Whether you are a hardware engineer, procurement specialist, or embedded systems designer, this guide covers everything you need to know about the XC2S200-6FGG1037C specifications, features, ordering information, and applications.
What Is the XC2S200-6FGG1037C?
The XC2S200-6FGG1037C is part of Xilinx’s Spartan-II FPGA family, a 2.5V programmable logic device built on an advanced 0.18 µm process technology. It is the largest device in the Spartan-II family, offering the highest gate count and I/O density in the series.
Part Number Breakdown
Understanding the part number helps confirm compatibility and ordering accuracy:
| Field |
Code |
Description |
| Device Family |
XC2S |
Spartan-II FPGA |
| Gate Count |
200 |
200,000 system gates |
| Speed Grade |
-6 |
Fastest commercial speed grade |
| Package Type |
FGG |
Fine-Pitch Ball Grid Array (Pb-free) |
| Pin Count |
1037 |
1,037 solder balls |
| Temperature Range |
C |
Commercial (0°C to +85°C) |
Note: The “G” in “FGG” denotes a Pb-free (RoHS-compliant) package, which is the lead-free version of the standard FG package.
XC2S200-6FGG1037C Key Specifications
Core Logic Resources
| Parameter |
XC2S200 Specification |
| Logic Cells |
5,292 |
| System Gates (Logic + RAM) |
200,000 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM (bits) |
75,264 |
| Block RAM (bits) |
56K (56,000 bits) |
| Delay-Locked Loops (DLLs) |
4 |
Electrical & Timing Specifications
| Parameter |
Value |
| Core Supply Voltage (VCCINT) |
2.5V |
| I/O Supply Voltage (VCCO) |
1.5V – 3.3V |
| Speed Grade |
-6 (fastest in Spartan-II family) |
| Operating Temperature |
0°C to +85°C (Commercial) |
| Technology Node |
0.18 µm |
| Configuration Width |
Serial / Parallel SelectMAP |
Package Information
| Parameter |
Value |
| Package |
FGG1037 (Fine-Pitch BGA) |
| Total Pins / Balls |
1,037 |
| RoHS / Pb-free |
Yes (FGG = Pb-free variant) |
| Mounting Type |
Surface Mount |
Spartan-II Family Comparison Table
The XC2S200 is the flagship device in the Spartan-II lineup. The table below compares all family members to help you select the right device for your design:
| Device |
Logic Cells |
System Gates |
CLB Array |
Total CLBs |
Max User I/O |
Distributed RAM |
Block RAM |
| XC2S15 |
432 |
15,000 |
8×12 |
96 |
86 |
6,144 bits |
16K |
| XC2S30 |
972 |
30,000 |
12×18 |
216 |
92 |
13,824 bits |
24K |
| XC2S50 |
1,728 |
50,000 |
16×24 |
384 |
176 |
24,576 bits |
32K |
| XC2S100 |
2,700 |
100,000 |
20×30 |
600 |
176 |
38,400 bits |
40K |
| XC2S150 |
3,888 |
150,000 |
24×36 |
864 |
260 |
55,296 bits |
48K |
| XC2S200 |
5,292 |
200,000 |
28×42 |
1,176 |
284 |
75,264 bits |
56K |
XC2S200-6FGG1037C Architecture & Key Features
Configurable Logic Blocks (CLBs)
The XC2S200 features a 28×42 array of CLBs, each containing two slices. Every slice includes two 4-input Look-Up Tables (LUTs), two storage elements (flip-flops or latches), dedicated carry logic, and wide-function multiplexers. This flexible architecture supports efficient implementation of both combinatorial and registered logic.
Block RAM
The device integrates 56K bits of block RAM arranged in two columns along opposite sides of the die. Each block RAM supports true dual-port operation, configurable width/depth ratios, and synchronous operation — ideal for FIFOs, buffers, and on-chip data storage.
Delay-Locked Loops (DLLs)
Four Delay-Locked Loops are placed at the four corners of the die. DLLs provide zero-propagation-delay clock distribution, clock frequency synthesis (multiply/divide), and phase shifting — ensuring precise, low-skew clocking across the entire device.
Input/Output Blocks (IOBs)
The XC2S200 offers 284 user-configurable I/O pins supporting a wide range of interface standards, including LVTTL, LVCMOS (1.8V, 2.5V, 3.3V), PCI, GTL, GTL+, SSTL, and HSTL. Each IOB features programmable input delay, output slew-rate control, and optional weak pull-up/pull-down resistors.
Configuration Options
The device supports multiple configuration modes for maximum design flexibility:
| Configuration Mode |
Description |
| Master Serial |
FPGA loads config from serial PROM |
| Slave Serial |
Config driven by external source |
| Master Parallel (SelectMAP) |
Parallel byte-wide configuration |
| Slave Parallel (SelectMAP) |
Byte-wide, externally controlled |
| JTAG (Boundary Scan) |
IEEE 1149.1 compliant |
Why Choose the XC2S200-6FGG1037C?
✅ Highest Gate Count in Spartan-II Family
With 200,000 system gates and 5,292 logic cells, the XC2S200 is the most powerful device in the Spartan-II series — ideal for complex logic designs that require maximum capacity.
✅ Fastest Commercial Speed Grade (-6)
The -6 speed grade is the fastest available in the Spartan-II Commercial temperature range, ensuring the lowest propagation delays and highest system clock frequencies.
✅ Large BGA Package for High I/O Density
The FGG1037 package provides access to 284 user I/Os in a compact, surface-mount form factor — essential for signal-dense PCB designs.
✅ RoHS-Compliant (Pb-free)
The “FGG” variant is fully RoHS and Pb-free compliant, meeting international environmental regulations for electronics manufacturing.
✅ Cost-Effective Alternative to ASICs
The Spartan-II family was specifically designed as a superior, programmable alternative to mask-programmed ASICs, offering faster time-to-market, re-programmability, and significantly reduced NRE costs.
Typical Applications of the XC2S200-6FGG1037C
The XC2S200-6FGG1037C is widely used in industries requiring high-density, cost-optimized programmable logic:
| Industry |
Application Examples |
| Telecommunications |
Protocol bridging, line cards, signal routing |
| Industrial Automation |
Motor control, PLC logic replacement, sensor interfacing |
| Consumer Electronics |
Video processing, display controllers |
| Medical Devices |
Data acquisition, signal conditioning |
| Embedded Computing |
Custom processor peripherals, memory controllers |
| Test & Measurement |
Pattern generation, data capture |
| Automotive |
(Industrial-grade variants) ECU interfaces, diagnostics |
XC2S200-6FGG1037C vs. XC2S200-6FG1037C: What’s the Difference?
A common question when ordering is the difference between FGG and FG packages:
| Feature |
XC2S200-6FG1037C |
XC2S200-6FGG1037C |
| Package Type |
Fine-Pitch BGA |
Fine-Pitch BGA |
| Lead (Pb) Content |
Standard (contains lead) |
Pb-free / RoHS compliant |
| RoHS Compliance |
No |
Yes |
| Pin Count |
1,037 |
1,037 |
| Functionality |
Identical |
Identical |
The FGG variant is the preferred choice for modern designs requiring RoHS compliance for export and sale in the EU, UK, China, and other regulated markets.
Ordering Information & Part Number Guide
When sourcing the XC2S200-6FGG1037C, ensure you verify the complete part number to avoid receiving incompatible variants. Key parameters to confirm:
- Device: XC2S200 (200K gates, Spartan-II)
- Speed Grade: -6 (commercial, fastest grade)
- Package: FGG1037 (Pb-free, 1037-ball Fine-Pitch BGA)
- Temperature: C (Commercial: 0°C to +85°C)
For a broader selection of Spartan-II and other Xilinx programmable logic devices, explore the full range of Xilinx FPGA products available from trusted distributors.
Frequently Asked Questions (FAQ)
What is the XC2S200-6FGG1037C used for?
The XC2S200-6FGG1037C is a programmable logic device used in telecommunications, industrial automation, embedded computing, medical equipment, and consumer electronics for custom digital logic implementation.
Is the XC2S200-6FGG1037C RoHS compliant?
Yes. The “FGG” package designation indicates a Pb-free, RoHS-compliant package. It is safe for use in environmentally regulated markets globally.
What is the maximum operating frequency of the XC2S200-6FGG1037C?
The maximum frequency depends on the implemented logic design, but the -6 speed grade is the fastest available in the Spartan-II Commercial range, with typical toggle frequencies exceeding 200 MHz for simple register paths.
What tools are used to program the XC2S200-6FGG1037C?
Xilinx ISE Design Suite (version 14.7 is the last version to support Spartan-II) is used for synthesis, implementation, and bitstream generation. JTAG-based programming cables (Xilinx Platform Cable USB) are used for device configuration.
Is the XC2S200-6FGG1037C still in production?
The Spartan-II family has reached end-of-life status. However, the XC2S200-6FGG1037C remains widely available through authorized distributors and component brokers for maintenance, repair, and legacy system upgrades.
Summary
The XC2S200-6FGG1037C is the premium configuration of Xilinx’s Spartan-II FPGA family — combining the highest logic density (200,000 system gates), the fastest commercial speed grade (-6), 284 user I/Os, 56K bits of block RAM, and a 1037-ball Pb-free BGA package. It remains a reliable, proven choice for engineers maintaining legacy designs or developing new cost-optimized solutions where programmable logic flexibility is essential.
| Summary Specification |
Value |
| Part Number |
XC2S200-6FGG1037C |
| Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| User I/O |
284 |
| Block RAM |
56K bits |
| Speed Grade |
-6 (Commercial) |
| Package |
FGG1037 (Pb-free BGA) |
| Operating Temp |
0°C to +85°C |
| Core Voltage |
2.5V |
| RoHS Compliant |
Yes |