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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1036C: Xilinx Spartan-II FPGA – Full Specifications & Datasheet Guide

Product Details

The XC2S200-6FGG1036C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume, cost-sensitive applications, this device offers 200,000 system gates, 5,292 logic cells, and is housed in a 1036-ball Fine Pitch Ball Grid Array (FBGA) package — making it one of the largest pin-count variants in the Spartan-II lineup. Whether you are designing embedded systems, telecommunications hardware, or industrial control boards, the XC2S200-6FGG1036C delivers reliable programmable logic at 2.5V operation.

For engineers sourcing programmable logic solutions, explore our full range of Xilinx FPGA products.


What Is the XC2S200-6FGG1036C?

The XC2S200-6FGG1036C belongs to Xilinx’s Spartan-II 2.5V FPGA family, a series well-known as a cost-effective alternative to mask-programmed ASICs. The part number can be decoded as follows:

Part Number Segment Meaning
XC2S200 Spartan-II device with 200K system gates
-6 Speed grade 6 (fastest in the family, Commercial range only)
FGG Fine Pitch Ball Grid Array (Pb-Free package)
1036 1036-pin package
C Commercial temperature range (0°C to +85°C)

The “G” in FGG denotes a Pb-free (RoHS-compliant lead-free) package, making this part suitable for modern manufacturing environments with environmental compliance requirements.


XC2S200-6FGG1036C Key Specifications

Core Logic Resources

Parameter XC2S200 Value
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM Bits 75,264 bits
Block RAM Bits 56K bits

Electrical & Performance Specifications

Parameter Value
Supply Voltage (VCC) 2.5V
Technology Node 0.18 µm
Maximum System Clock Up to 263 MHz
Speed Grade -6 (fastest available)
Operating Temperature 0°C to +85°C (Commercial)
Package Type FGG1036 (1036-ball FBGA)
Package Compliance Pb-Free (RoHS)

XC2S200-6FGG1036C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200 features a 28×42 array of Configurable Logic Blocks (CLBs), totaling 1,176 CLBs. Each CLB contains two slices, and each slice includes two 4-input Look-Up Tables (LUTs), two flip-flops, and dedicated carry logic. This structure enables efficient implementation of both combinational and sequential logic designs.

Block RAM & Distributed RAM

The device provides a total of 56K bits of dedicated Block RAM organized in two columns on opposite sides of the die. Additionally, 75,264 bits of distributed RAM are available through the LUTs in the CLB array. Together, these resources make the XC2S200-6FGG1036C well-suited for buffering, FIFO implementations, and small on-chip memory storage.

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops (DLLs) — one at each corner of the die — provide clock deskewing, frequency synthesis, and phase shifting capabilities. DLLs allow designers to distribute high-speed, low-skew clocks across the device without external components.

Input/Output Blocks (IOBs)

The XC2S200-6FGG1036C supports up to 284 user I/O pins (excluding four dedicated global clock inputs). Each IOB supports a variety of programmable I/O standards, including LVTTL, LVCMOS2, PCI, GTL, SSTL, and HSTL, offering broad compatibility with external interfaces and memory buses.


Configuration Modes

The Spartan-II family, including the XC2S200-6FGG1036C, supports multiple configuration modes for maximum design flexibility:

Configuration Mode CCLK Direction Data Width Serial DOUT
Master Serial Output 1 bit Yes
Slave Serial Input 1 bit Yes
Slave Parallel Input 8 bits No
Boundary-Scan (JTAG) N/A 1 bit No

Configuration bitstream size for the XC2S200 is approximately 1,335,840 bits.


Spartan-II Family Comparison

The table below positions the XC2S200-6FGG1036C within the broader Spartan-II product family:

Device Logic Cells System Gates CLB Array Total CLBs Max User I/O Dist. RAM (bits) Block RAM
XC2S15 432 15,000 8×12 96 86 6,144 16K
XC2S30 972 30,000 12×18 216 92 13,824 24K
XC2S50 1,728 50,000 16×24 384 176 24,576 32K
XC2S100 2,700 100,000 20×30 600 176 38,400 40K
XC2S150 3,888 150,000 24×36 864 260 55,296 48K
XC2S200 5,292 200,000 28×42 1,176 284 75,264 56K

The XC2S200 is the largest and most capable device in the Spartan-II family, offering the highest gate count, logic cell density, and I/O resources.


Typical Applications of the XC2S200-6FGG1036C

The XC2S200-6FGG1036C FPGA is widely used in a range of industrial and commercial applications:

  • Telecommunications equipment – line cards, protocol converters, and multiplexers
  • Industrial control systems – motor controllers, PLC expansions, and sensor interfacing
  • Embedded processing – co-processors for microcontroller-based platforms
  • Signal processing – filtering, FFT engines, and digital modulation
  • Prototyping & development – ASIC prototyping and algorithm verification
  • Networking hardware – packet processing and interface bridging
  • Medical devices – real-time data acquisition and signal conditioning

Why Choose the Spartan-II XC2S200-6FGG1036C?

Cost-Effective Programmable Logic

As a direct replacement for mask-programmed ASICs, the Spartan-II XC2S200-6FGG1036C significantly reduces non-recurring engineering (NRE) costs and shortens design cycles. Unlike ASICs, it can be reprogrammed in the field without hardware replacement.

High-Speed -6 Speed Grade

The -6 speed grade is the fastest available in the Spartan-II commercial range, supporting system clock speeds up to 263 MHz. This makes the XC2S200-6FGG1036C suitable for applications requiring high-throughput data processing.

Large 1036-Pin FGG Package

The 1036-ball FGG package provides an exceptionally high pin count, giving PCB designers maximum signal routing flexibility. This is especially beneficial in complex multi-interface designs where I/O density is critical.

Pb-Free & RoHS Compliant

The double “G” in FGG confirms the lead-free packaging, meeting international environmental standards including RoHS and WEEE directives. This makes the part compliant for global distribution and manufacturing.


XC2S200-6FGG1036C vs. Alternatives

Feature XC2S200-6FGG1036C XC2S200-6FG456C XC2S200-6PQ208C
Package FGG1036 (FBGA) FG456 (FBGA) PQ208 (PQFP)
Pin Count 1036 456 208
Pb-Free Yes Yes No (standard)
Max User I/O 284 284 284
Speed Grade -6 -6 -6
Best For High-density PCB designs Mid-density designs Through-hole/legacy PCBs

Design Tools & Software Support

The XC2S200-6FGG1036C is supported by Xilinx’s legacy ISE Design Suite, which includes:

  • ISE Project Navigator – HDL synthesis and implementation
  • FPGA Editor – manual place-and-route and debug
  • ChipScope Pro – on-chip logic analyzer
  • iMPACT – device programming and configuration

Note: The Spartan-II family is not supported in Vivado Design Suite. Designers should use ISE 14.7, the final release of the ISE toolchain, which is available for Windows and Linux.


Ordering Information

Parameter Detail
Manufacturer Xilinx (now AMD)
Part Number XC2S200-6FGG1036C
Series Spartan-II
Package 1036-Ball FBGA (Pb-Free)
Speed Grade -6
Temperature Range Commercial (0°C to +85°C)
RoHS Status Compliant
Lifecycle Status Not Recommended for New Designs (NRND)

Frequently Asked Questions (FAQ)

What does the -6 speed grade mean on the XC2S200-6FGG1036C?

The -6 speed grade indicates the fastest timing performance in the Spartan-II commercial family. It is exclusively available in the commercial temperature range (0°C to +85°C) and supports clock frequencies up to 263 MHz.

Is the XC2S200-6FGG1036C RoHS compliant?

Yes. The “G” suffix in FGG confirms the device is packaged in a Pb-free (lead-free) ball grid array, meeting RoHS and WEEE compliance requirements.

What is the difference between FGG1036 and FG456 packages?

The FGG1036 package has 1036 solder balls, while the FG456 has 456 balls. Despite the different pin count, both packages expose the same maximum 284 user I/Os. The larger 1036-ball package offers greater PCB routing flexibility and mechanical stability in high-density applications.

Can I use Vivado for XC2S200-6FGG1036C development?

No. Vivado does not support the Spartan-II family. You must use Xilinx ISE 14.7 for HDL synthesis, implementation, and bitstream generation for this device.

Is the XC2S200-6FGG1036C still in production?

The Spartan-II family, including the XC2S200-6FGG1036C, is classified as Not Recommended for New Designs (NRND). It is available through authorized distributors and excess inventory channels for legacy system maintenance.


Summary

The XC2S200-6FGG1036C is the flagship device of the Xilinx Spartan-II FPGA family, combining 200,000 system gates, a 28×42 CLB array, 284 user I/Os, and four DLLs in a Pb-free 1036-ball FBGA package. With its fastest -6 speed grade and comprehensive I/O standard support, it remains a capable solution for legacy system maintenance and cost-sensitive programmable logic applications.

For a broader selection of Xilinx programmable logic devices, visit our Xilinx FPGA product catalog.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.