Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1034C: Xilinx Spartan-II FPGA – Full Specifications & Buying Guide

Product Details

The XC2S200-6FGG1034C is a high-density, commercial-grade Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Featuring 200,000 system gates, 5,292 logic cells, and housed in a 1034-pin Fine-Pitch Ball Grid Array (FBGA) package, this device delivers powerful programmable logic capabilities at a cost-effective price point. Whether you are designing telecom equipment, industrial controllers, or embedded systems, the XC2S200-6FGG1034C offers the flexibility, performance, and I/O density required for complex digital designs.


What Is the XC2S200-6FGG1034C?

The XC2S200-6FGG1034C is part of Xilinx’s Spartan-II FPGA family, a line of 2.5V programmable logic devices built on a 0.18µm CMOS process. The part number breaks down as follows:

Part Number Segment Meaning
XC2S200 Spartan-II device with ~200,000 system gates
-6 Speed grade -6 (fastest available for commercial range)
FGG Fine-Pitch Ball Grid Array (FBGA) package type
1034 1034 total pins
C Commercial temperature range (0°C to +85°C)

As a Xilinx FPGA, the XC2S200-6FGG1034C combines a flexible programmable fabric with a rich set of embedded memory resources, making it one of the most capable devices in the Spartan-II lineup.


XC2S200-6FGG1034C Key Specifications

General Device Specifications

Parameter Value
Manufacturer Xilinx (AMD)
Product Family Spartan-II
Part Number XC2S200-6FGG1034C
Technology Node 0.18µm CMOS
Core Supply Voltage (VCCINT) 2.5V
I/O Supply Voltage (VCCO) 1.5V – 3.3V (configurable per bank)
Temperature Range Commercial: 0°C to +85°C
Speed Grade -6 (fastest commercial grade)

Logic and Memory Resources

Resource XC2S200 Value
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Distributed RAM 75,264 bits
Block RAM 56K bits (56,000 bits)
Maximum User I/O 284
Delay-Locked Loops (DLLs) 4

Package and Physical Specifications

Parameter Value
Package Type Fine-Pitch Ball Grid Array (FBGA)
Package Code FGG1034
Total Pin Count 1,034
Maximum User I/O Pins 284
RoHS Compliance Non-RoHS (standard packaging)
Configuration File Size 1,335,840 bits

XC2S200-6FGG1034C Performance Overview

Speed and Timing

The -6 speed grade is the highest performance speed grade available for commercial-temperature Spartan-II devices. Key timing highlights include:

  • System Clock Frequency: Up to 200–263 MHz depending on design complexity
  • DLL Clock Skew Elimination: 4 on-chip Delay-Locked Loops (DLLs) reduce clock distribution skew
  • Logic Path Delay: Industry-competitive propagation delays for the 0.18µm node

Note: The -6 speed grade is exclusively available in the Commercial temperature range (C suffix). Industrial temperature variants use the -5 speed grade.


I/O Standards Support

The XC2S200-6FGG1034C supports 16 selectable I/O standards, offering outstanding interface flexibility:

I/O Standard Type
LVCMOS 2.5V / 3.3V / 1.8V Single-ended
LVTTL Single-ended
PCI 3.3V Single-ended
SSTL2 Class I & II Differential
SSTL3 Class I & II Differential
GTL / GTL+ Open-drain
CTT Single-ended
AGP Single-ended
HSTL Class I Differential

XC2S200-6FGG1034C Architecture and Internal Structure

Configurable Logic Blocks (CLBs)

The Spartan-II CLB architecture is the heart of the XC2S200-6FGG1034C. Each CLB contains:

  • Two slices, each with two 4-input Look-Up Tables (LUTs)
  • Flip-flops that can function as D-type registers or level-sensitive latches
  • Fast carry logic for high-speed arithmetic operations
  • Multiplexers for wide function implementation

With 1,176 CLBs arranged in a 28×42 array, the device can implement substantial digital logic, from simple glue logic to complex state machines and data paths.


Block RAM

The XC2S200-6FGG1034C includes 56K bits of dedicated Block RAM, organized in two columns along the edges of the CLB array. Key Block RAM features:

  • True dual-port operation
  • Configurable aspect ratios (e.g., 16K × 1, 8K × 2, 4K × 4, 2K × 8, 1K × 16)
  • Synchronous read/write with optional output registers
  • Independent read/write port widths

Delay-Locked Loops (DLLs)

Four on-chip DLLs — one at each corner of the die — provide:

  • Zero-delay clock buffering
  • Clock frequency synthesis (multiply and divide)
  • Phase shifting for interface timing alignment
  • Duty-cycle correction

Input/Output Blocks (IOBs)

Each IOB on the XC2S200-6FGG1034C contains:

  • Three registers (two data, one clock enable) configurable as flip-flops or latches
  • Programmable pull-up and pull-down resistors
  • Optional slew rate control
  • Selectable I/O standard per I/O bank

Configuration Modes

The XC2S200-6FGG1034C supports multiple configuration modes, enabling flexible system integration:

Configuration Mode CCLK Direction Data Width Serial DOUT
Master Serial Output 1-bit Yes
Slave Serial Input 1-bit Yes
Slave Parallel Input 8-bit No
Boundary-Scan (JTAG) N/A 1-bit No

Configuration data is stored in an external PROM or downloaded via JTAG for development and testing.


Spartan-II Family Comparison

The table below shows where the XC2S200 ranks within the full Spartan-II family:

Device Logic Cells System Gates CLB Array Max User I/O Block RAM
XC2S15 432 15,000 8×12 86 16K
XC2S30 972 30,000 12×18 92 24K
XC2S50 1,728 50,000 16×24 176 32K
XC2S100 2,700 100,000 20×30 176 40K
XC2S150 3,888 150,000 24×36 260 48K
XC2S200 5,292 200,000 28×42 284 56K

The XC2S200-6FGG1034C is the largest and highest-density device in the Spartan-II family, offering the maximum logic, memory, and I/O resources available.


Applications of the XC2S200-6FGG1034C

The XC2S200-6FGG1034C is widely used across many industries due to its versatile architecture and large I/O count. Common application areas include:

Telecommunications

  • Line card interfaces
  • Protocol conversion (SONET, SDH, Ethernet)
  • Signal switching and routing fabrics

Industrial Automation

  • Motor control and servo drives
  • Real-time sensor data acquisition
  • Programmable logic controller (PLC) replacement

Embedded Systems and SoC Prototyping

  • CPU/peripheral glue logic
  • Memory controllers and bus bridges
  • Custom co-processor acceleration

Consumer Electronics

  • Display controllers
  • Image and video processing pipelines
  • Set-top box logic

Military and Aerospace (Evaluation)

  • Signal processing front-ends
  • Radar interface logic (consult manufacturer for qualified parts)

Design Tools and Software Support

The XC2S200-6FGG1034C is supported by Xilinx ISE (Integrated Software Environment):

Tool Version Notes
Xilinx ISE Design Suite 14.7 (final) Full support for Spartan-II devices
ModelSim / XSIM Via ISE Functional and timing simulation
iMPACT Via ISE JTAG configuration and programming
CORE Generator Via ISE IP core instantiation

Important: Xilinx Vivado does not support Spartan-II FPGAs. ISE 14.7 is the required design environment.


Ordering Information and Part Number Guide

Field XC2S200-6FGG1034C
Device Type XC2S200
Speed Grade -6
Package FGG (Fine-Pitch BGA, Pb-free option)
Pin Count 1034
Temperature C = Commercial (0°C to +85°C)

Pb-free variants carry a “G” in the package code (e.g., FGG vs. FG), confirming RoHS-compliant packaging for the lead-free version.


Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1034C used for?

The XC2S200-6FGG1034C is used in digital design applications requiring a large number of I/O pins (up to 284), substantial logic capacity (200,000 gates), and embedded memory. Typical use cases include telecom interfaces, industrial control systems, and embedded system prototyping.

Is the XC2S200-6FGG1034C still in production?

The Spartan-II family was discontinued per Xilinx PDN2004-01. However, the XC2S200-6FGG1034C remains available through authorized distributors and component brokers for legacy system maintenance and replacement purposes.

What is the difference between FG and FGG packages?

The FGG designation indicates a Pb-free (lead-free) Ball Grid Array package, compliant with RoHS requirements. The standard FG package uses conventional tin-lead solder balls.

Can I replace the XC2S200-6FGG1034C with a newer device?

For new designs, Xilinx recommends migrating to newer families such as Spartan-3, Spartan-6, or Artix-7, which offer superior performance, lower power, and active support. However, for legacy board replacements, a functionally equivalent XC2S200 variant in the FGG1034 package is the correct direct replacement.

What programming software does the XC2S200-6FGG1034C require?

This device requires Xilinx ISE 14.7, which is the final and fully supported release for Spartan-II devices. Vivado does not support this FPGA family.


Summary

The XC2S200-6FGG1034C is the flagship device of the Xilinx Spartan-II FPGA family, offering 200,000 system gates, 5,292 logic cells, 56K bits of block RAM, and up to 284 user I/O pins in a 1034-pin Fine-Pitch BGA package. Its -6 speed grade ensures maximum commercial performance, while its support for 16 I/O standards and four on-chip DLLs makes it highly adaptable to a broad range of digital design challenges. For engineers working with legacy systems or sourcing components for end-of-life board repairs, the XC2S200-6FGG1034C remains a reliable, well-documented, and widely stocked solution.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.