The XC2S200-6FGG1030C is a high-performance, cost-effective Field-Programmable Gate Array (FPGA) from Xilinx’s industry-renowned Spartan-II family. Featuring 200,000 system gates, 5,292 logic cells, and a large 1030-ball Fine Pitch BGA package, this device is engineered to deliver maximum programmable logic density for commercial-grade embedded systems, telecommunications, industrial automation, and consumer electronics applications. If you are searching for a reliable, proven Xilinx FPGA solution with a well-documented ecosystem, the XC2S200-6FGG1030C is an outstanding choice.
What Is the XC2S200-6FGG1030C?
The XC2S200-6FGG1030C is a member of Xilinx’s Spartan-II 2.5V FPGA family — a series that was designed as a superior, low-cost alternative to mask-programmed ASICs. Unlike fixed-function ASICs, this FPGA can be reprogrammed in the field without any hardware replacement, giving engineers the flexibility to upgrade designs after production deployment.
The part number breaks down as follows:
| Part Number Segment |
Meaning |
| XC2S200 |
Spartan-II family, 200K system gates |
| -6 |
Speed grade 6 (fastest in the Spartan-II lineup) |
| FGG |
Fine Pitch Ball Grid Array (BGA), Pb-Free packaging |
| 1030 |
1030-pin package |
| C |
Commercial temperature range (0°C to +85°C) |
XC2S200-6FGG1030C Key Specifications
Core Logic Resources
| Specification |
Value |
| Device Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Delay-Locked Loops (DLLs) |
4 |
Electrical & Timing Characteristics
| Specification |
Value |
| Core Supply Voltage |
2.5V |
| I/O Standard Support |
LVTTL, LVCMOS, GTL, SSTL, HSTL, PCI |
| Speed Grade |
-6 (Commercial only) |
| Maximum System Performance |
Up to 200 MHz |
| Process Technology |
0.18µm |
| Operating Temperature |
0°C to +85°C (Commercial) |
Package Information
| Specification |
Value |
| Package Type |
Fine Pitch Ball Grid Array (FBGA) |
| Package Code |
FGG1030 |
| Pin Count |
1,030 |
| Pb-Free (RoHS) |
Yes (“GG” suffix indicates Pb-Free) |
| Mounting Type |
Surface Mount |
XC2S200-6FGG1030C Architecture & Features
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG1030C is built around a 28×42 array of Configurable Logic Blocks (CLBs), yielding 1,176 total CLBs and 5,292 logic cells. Each CLB contains four logic cells, and each logic cell includes a 4-input Look-Up Table (LUT), a D-type flip-flop, and carry logic. This architecture allows efficient implementation of both combinatorial and sequential logic.
Block RAM and Distributed RAM
The device offers two types of memory resources for maximum design flexibility:
- Distributed RAM: 75,264 bits — implemented using CLB LUTs, suitable for small, fast memory structures embedded throughout the logic fabric.
- Block RAM: 56K bits — two dedicated block RAM columns provide large, synchronous, dual-port memory ideal for FIFOs, data buffers, and look-up tables.
Delay-Locked Loops (DLLs)
Four on-chip Delay-Locked Loops (DLLs), one at each corner of the die, enable clock deskewing, frequency synthesis, and phase shifting. This ensures high-integrity clock distribution across the entire device, critical for high-speed system design.
Input/Output Blocks (IOBs)
The XC2S200-6FGG1030C supports up to 284 user I/O pins, each configurable to support a wide range of I/O standards. The IOBs include programmable pull-up/pull-down resistors, input delay elements, and slew rate control, allowing seamless interfacing with external components operating at different voltage levels.
XC2S200-6FGG1030C vs. Other Spartan-II Family Members
| Device |
Logic Cells |
System Gates |
CLB Array |
Max User I/O |
Block RAM |
| XC2S15 |
432 |
15,000 |
8×12 |
86 |
16K |
| XC2S30 |
972 |
30,000 |
12×18 |
92 |
24K |
| XC2S50 |
1,728 |
50,000 |
16×24 |
176 |
32K |
| XC2S100 |
2,700 |
100,000 |
20×30 |
176 |
40K |
| XC2S150 |
3,888 |
150,000 |
24×36 |
260 |
48K |
| XC2S200 |
5,292 |
200,000 |
28×42 |
284 |
56K |
The XC2S200 is the largest and most capable device in the Spartan-II family, providing the highest gate count, most logic cells, greatest I/O capacity, and largest memory resources — making it the best choice for designs that have outgrown smaller Spartan-II devices.
Supported I/O Standards
The XC2S200-6FGG1030C supports a comprehensive list of I/O standards, enabling easy integration into diverse system architectures:
| I/O Standard |
Description |
| LVTTL |
Low-Voltage TTL (3.3V) |
| LVCMOS2 |
Low-Voltage CMOS (2.5V) |
| LVCMOS18 |
Low-Voltage CMOS (1.8V) |
| GTL / GTL+ |
Gunning Transceiver Logic |
| HSTL Class I / II |
High-Speed Transceiver Logic |
| SSTL2 Class I / II |
Stub Series Terminated Logic (2.5V) |
| SSTL3 Class I / II |
Stub Series Terminated Logic (3.3V) |
| PCI |
3.3V / 5V tolerant PCI interface |
| AGP |
Accelerated Graphics Port |
Configuration Modes
The XC2S200-6FGG1030C can be configured using several industry-standard methods:
- Master Serial Mode — single-device configuration via a serial PROM
- Slave Serial Mode — daisy-chain or microprocessor-driven configuration
- Master Parallel Mode — fast parallel configuration for time-critical startup
- Slave Parallel (SelectMAP) Mode — byte-wide parallel interface for processor-based configuration
- Boundary Scan (JTAG) — IEEE 1149.1-compliant JTAG interface for in-circuit programming and testing
Typical Applications for the XC2S200-6FGG1030C
The XC2S200-6FGG1030C is well-suited for a broad range of demanding applications across multiple industries:
Telecommunications & Networking
- Line card controllers
- Protocol converters (SONET, Ethernet bridging)
- Framing and synchronization engines
Industrial Automation & Control
- Motor drive controllers
- PLC I/O expansion modules
- Real-time sensor data processing
Consumer Electronics
- Set-top box logic controllers
- Display interface bridging
- Audio and video signal processing
Embedded Computing & Data Acquisition
- Co-processing acceleration alongside microcontrollers/DSPs
- High-speed ADC/DAC interfacing
- Custom RISC/CISC soft-processor implementations (e.g., MicroBlaze-compatible)
Why Choose the XC2S200-6FGG1030C?
Fastest Commercial Speed Grade
The -6 speed grade is the highest performance option in the Spartan-II lineup, available exclusively for the commercial temperature range. It enables system clock frequencies up to 200 MHz, making it ideal for latency-sensitive designs.
Pb-Free, RoHS-Compliant Packaging
The “GG” suffix in the part number confirms Pb-free (lead-free) ball grid array packaging, meeting international RoHS environmental compliance regulations. This is essential for products targeting European and Asian markets.
Large Pin Count for High I/O Density Designs
The 1030-pin FGG package provides an exceptionally large number of accessible I/O pins relative to the die size, enabling designs that require dense, high-bandwidth external bus connections.
Proven, Stable Ecosystem
The Spartan-II family is supported by Xilinx ISE Design Suite, with extensive application notes, reference designs, and community resources available — reducing development time and risk.
Ordering Information & Part Number Decoder
| Field |
Value |
| Full Part Number |
XC2S200-6FGG1030C |
| Manufacturer |
Xilinx (now AMD) |
| Series |
Spartan-II |
| Package |
1030-Ball FBGA |
| Speed Grade |
-6 |
| Temperature Range |
Commercial (0°C to +85°C) |
| RoHS Status |
Compliant (Pb-Free) |
| Mounting |
Surface Mount Technology (SMT) |
Frequently Asked Questions (FAQ)
What is the XC2S200-6FGG1030C used for?
The XC2S200-6FGG1030C is used in applications requiring a large, reprogrammable logic device — such as telecom equipment, industrial controllers, data acquisition systems, and embedded computing platforms.
What does the -6 speed grade mean?
The -6 speed grade indicates the fastest timing class in the Spartan-II family. It is exclusively available for commercial-temperature (0°C to +85°C) devices and supports the highest achievable system frequencies.
Is the XC2S200-6FGG1030C RoHS compliant?
Yes. The double “GG” in the package code (FGG1030) signifies a Pb-free, RoHS-compliant package suitable for environmentally regulated markets.
What software is used to program the XC2S200-6FGG1030C?
Xilinx ISE Design Suite is the primary development environment for Spartan-II devices. The device can be programmed using JTAG via iMPACT software or through configuration PROMs using one of the supported configuration modes.
What is the difference between FG and FGG packages?
The standard “FG” designation refers to a standard BGA package, while “FGG” indicates the Pb-free (lead-free) version of the same package. Electrically and mechanically, they are equivalent.
Conclusion
The XC2S200-6FGG1030C represents the pinnacle of the Xilinx Spartan-II FPGA family — combining the maximum available logic resources (200K gates, 5,292 cells), the fastest commercial speed grade (-6), Pb-free packaging, and a high-density 1030-pin BGA footprint. It is a powerful, flexible solution for engineers who need proven programmable logic performance across telecommunications, industrial, and embedded computing designs. Whether you are prototyping a new product or sustaining an existing design in production, the XC2S200-6FGG1030C delivers the capacity and reliability your project demands.
