Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1027C: Xilinx Spartan-II FPGA – Full Specifications & Buyer’s Guide

Product Details

The XC2S200-6FGG1027C is a high-density, 2.5V Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume, cost-sensitive applications, this device delivers up to 200,000 system gates, 284 user I/Os, and a fine-pitch BGA package — making it one of the most capable members of the Spartan-II lineup. Whether you are designing embedded systems, digital signal processing boards, or communications hardware, the XC2S200-6FGG1027C offers the logic density, speed, and flexibility your project demands.

For a broader selection of programmable logic devices, explore our full range of Xilinx FPGA products.


What Is the XC2S200-6FGG1027C?

The XC2S200-6FGG1027C belongs to the Xilinx Spartan-II FPGA family — a series of 2.5V programmable gate arrays optimized for low cost and high volume. The part number breaks down as follows:

Code Segment Meaning
XC2S200 Spartan-II device with 200,000 system gates
-6 Speed Grade 6 (fastest in the Spartan-II family)
FGG Fine-pitch BGA (Ball Grid Array) package, Pb-free
1027 1,027-ball package
C Commercial temperature range (0°C to +85°C)

XC2S200-6FGG1027C Key Specifications

General Device Specifications

Parameter Value
Part Number XC2S200-6FGG1027C
Family Spartan-II
Technology 2.5V CMOS FPGA
System Gates 200,000 (logic + RAM)
Logic Cells 5,292
Speed Grade -6 (fastest available)
Package FGG1027 (Fine-pitch BGA, 1027 balls)
Temperature Range Commercial: 0°C to +85°C
Core Voltage (VCCINT) 2.5V

Logic and Memory Resources

Resource XC2S200
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Total Distributed RAM 75,264 bits
Total Block RAM 56K bits
Delay-Locked Loops (DLLs) 4

I/O and Packaging Details

Parameter Value
Package Type Fine-Pitch Ball Grid Array (FBGA)
Total Balls 1,027
User I/O Pins 284
Global Clock Inputs 4 (dedicated, not counted in user I/O)
IOB Standards Supported LVTTL, LVCMOS, SSTL, GTL, PCI, HSTL

XC2S200-6FGG1027C Architecture Overview

Configurable Logic Blocks (CLBs)

The heart of the XC2S200 is its array of 1,176 Configurable Logic Blocks. Each CLB contains look-up tables (LUTs), flip-flops, and carry logic. The 28×42 array provides substantial routing flexibility and supports complex combinational and sequential logic designs.

Input/Output Blocks (IOBs)

The device features 284 programmable I/O pins, each supporting multiple industry-standard voltage interfaces. IOBs include input and output flip-flops, programmable pull-up/pull-down resistors, and slew rate control — essential for signal integrity in high-speed PCB designs.

Block RAM

With 56K bits of dedicated block RAM arranged in two columns flanking the CLB array, the XC2S200 efficiently handles data buffering, FIFO queues, and small embedded memory applications without consuming distributed logic resources.

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops — one at each corner of the die — provide precise clock management, phase shifting, and frequency synthesis. DLLs are critical for eliminating clock skew in synchronous designs operating at high frequencies.


Speed Grade -6: Performance Characteristics

The -6 speed grade is the fastest available in the Spartan-II family and is exclusively offered in the Commercial temperature range. This makes the XC2S200-6FGG1027C the top choice for timing-critical applications where maximum throughput is required.

Speed Grade Availability Temperature Range
-6 Commercial only 0°C to +85°C
-5 Commercial & Industrial 0°C to +85°C / -40°C to +100°C

Spartan-II Family Comparison: Where Does XC2S200 Fit?

Device Logic Cells System Gates CLBs Max User I/O Block RAM
XC2S15 432 15,000 96 86 16K
XC2S30 972 30,000 216 92 24K
XC2S50 1,728 50,000 384 176 32K
XC2S100 2,700 100,000 600 176 40K
XC2S150 3,888 150,000 864 260 48K
XC2S200 5,292 200,000 1,176 284 56K

The XC2S200 is the largest and most capable device in the Spartan-II family, offering the highest gate count, most I/Os, and most block RAM — ideal for the most demanding cost-optimized applications.


Typical Applications for the XC2S200-6FGG1027C

The XC2S200-6FGG1027C is well-suited for a wide range of embedded and industrial applications:

  • Telecommunications equipment – line cards, protocol bridges, and framing logic
  • Industrial automation – motor control interfaces and sensor data acquisition
  • Consumer electronics – display controllers and video processing pipelines
  • Embedded computing – co-processing, glue logic replacement, and bus bridging
  • Medical devices – real-time signal processing and I/O expansion
  • Networking hardware – packet processing and switching fabric control

Configuration and Programming

The XC2S200-6FGG1027C is a SRAM-based FPGA, meaning its configuration is loaded at power-up from an external non-volatile memory source (e.g., Xilinx Platform Flash PROMs or SPI flash). It supports several configuration modes:

Configuration Mode Description
Master Serial FPGA drives clock and loads from serial PROM
Slave Serial External controller drives the configuration
Master Parallel (SelectMAP) 8-bit parallel mode for faster configuration
JTAG (Boundary Scan) IEEE 1149.1 compliant; supports in-system programming

Configuration data is held in internal SRAM and is volatile — the device must be reconfigured each time power is applied. This allows the same board to support multiple bitstream revisions without hardware changes.


Power Supply Requirements

Supply Rail Voltage Purpose
VCCINT 2.5V Core logic and routing
VCCO 2.5V / 3.3V I/O bank output voltage
VREF Varies Reference voltage for certain I/O standards

Proper power sequencing and decoupling capacitor placement are critical for reliable operation of the XC2S200-6FGG1027C in production hardware.


Ordering and Part Number Decoder

Understanding the Xilinx ordering code helps you select exactly the right variant:

XC  2S  200  -6  FGG  1027  C
|   |   |    |   |    |     |
|   |   |    |   |    |     +-- Temperature: C=Commercial, I=Industrial
|   |   |    |   |    +-------- Pin count: 1027 balls
|   |   |    |   +------------- Package: FGG = Fine-Pitch BGA, Pb-Free
|   |   |    +----------------- Speed Grade: -6 (fastest)
|   |   +---------------------- Gate density: 200K
|   +-------------------------- Family: Spartan-II (2S)
+------------------------------ Xilinx product prefix

Why Choose the XC2S200-6FGG1027C?

#### Highest Performance in the Spartan-II Family

The -6 speed grade and 200K gate capacity make this the go-to device when you need maximum logic performance at the Spartan-II price point.

#### Large Package for High Pin-Count Designs

The 1027-ball FGG package accommodates up to 284 user I/Os, giving designers the pin count needed for complex interface-heavy boards.

#### Proven, Mature Architecture

The Spartan-II architecture is well-documented with extensive Xilinx ISE design tool support, a large community of existing designs, and long-term availability in the distribution chain.

#### Cost-Effective Programmable Logic

Compared to higher-end Xilinx families, the Spartan-II series offers significantly lower unit cost while still delivering substantial logic resources — ideal for production volumes.


Frequently Asked Questions (FAQ)

Q: What is the maximum operating frequency of the XC2S200-6FGG1027C? A: Operating frequency depends heavily on the design. The -6 speed grade offers the fastest propagation delays in the Spartan-II family. Consult the Xilinx DS001 datasheet for specific timing parameters.

Q: Is the XC2S200-6FGG1027C RoHS compliant? A: The “G” in the “FGG” package code indicates a Pb-free (lead-free) package, which is RoHS compliant.

Q: What design tools support the XC2S200-6FGG1027C? A: The device is supported by Xilinx ISE Design Suite. Note that newer tools such as Vivado do not support the Spartan-II family.

Q: Can this device be programmed in-system? A: Yes. The XC2S200-6FGG1027C supports JTAG boundary scan for in-system programming and debugging.

Q: What is the difference between XC2S200-6FGG1027C and XC2S200-5FGG1027C? A: The only difference is speed grade. The -6 variant offers faster timing performance but is limited to the commercial temperature range (0°C to +85°C). The -5 variant supports both commercial and industrial temperature ranges.


Summary

The XC2S200-6FGG1027C is the flagship device of Xilinx’s Spartan-II FPGA family — offering 200,000 system gates, 5,292 logic cells, 284 user I/Os, 56K bits of block RAM, and the fastest -6 speed grade in a RoHS-compliant 1027-ball fine-pitch BGA package. It is the optimal choice for engineers who need maximum Spartan-II performance in a high-pin-count form factor for commercial temperature range applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.