The XC2S200-6FGG1025C is a high-performance Field Programmable Gate Array (FPGA) from the Xilinx Spartan-II family. Manufactured by Xilinx (now AMD Xilinx), this device delivers 200,000 system gates and 5,292 logic cells in a large 1025-pin Fine-Pitch Ball Grid Array (FBGA) package, making it one of the most I/O-rich configurations in the Spartan-II lineup. Whether you are sourcing legacy components, supporting an existing design, or evaluating FPGA options for a project, this guide covers everything you need to know about the XC2S200-6FGG1025C.
What Is the XC2S200-6FGG1025C? Overview of the Xilinx Spartan-II FPGA
The XC2S200-6FGG1025C is part of Xilinx’s Spartan-II family — a 2.5V FPGA product line designed as a cost-effective alternative to mask-programmed ASICs. The part number can be decoded as follows:
| Code Segment |
Meaning |
| XC2S200 |
Spartan-II family, 200K system gate device |
| -6 |
Speed grade 6 (fastest available for Spartan-II) |
| FGG |
Fine-Pitch Ball Grid Array package (Pb-free “G” variant) |
| 1025 |
1025 total pins |
| C |
Commercial temperature range (0°C to +85°C) |
The Spartan-II family was designed to shorten product development cycles and reduce cost by eliminating the non-recurring engineering (NRE) fees associated with ASICs. The XC2S200 is the largest and most capable device in the Spartan-II family, and the FGG1025 package provides access to the maximum number of user I/O pins — up to 284 user I/Os.
For a broader overview of Xilinx programmable logic devices, visit our guide on Xilinx FPGA.
XC2S200-6FGG1025C Key Specifications
Core Logic Resources
| Parameter |
XC2S200 Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Max User I/O (FGG1025) |
284 |
| Distributed RAM (bits) |
75,264 |
| Block RAM (bits) |
56K (7 × 8K blocks) |
Electrical & Packaging Specifications
| Parameter |
Value |
| Core Voltage |
2.5V |
| I/O Voltage |
2.5V (Multivolt I/O support) |
| Technology Node |
0.18 µm |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Pin Count |
1025 |
| Package Designation |
FGG1025 (Pb-free) |
| Temperature Range |
Commercial: 0°C to +85°C |
| Speed Grade |
-6 (fastest) |
| Max Clock Frequency |
~263 MHz (internal logic) |
Configuration & Memory
| Parameter |
Value |
| Configuration File Size |
1,335,840 bits |
| Configuration Modes |
Master Serial, Slave Serial, Slave Parallel, Boundary Scan |
| Delay-Locked Loops (DLLs) |
4 (one at each corner of the die) |
| Supported I/O Standards |
16 selectable standards |
XC2S200-6FGG1025C Architecture Deep Dive
Configurable Logic Blocks (CLBs)
The XC2S200 organizes its logic into 1,176 Configurable Logic Blocks arranged in a 28×42 array. Each CLB contains four logic cells, and each logic cell includes:
- A 4-input Look-Up Table (LUT) for implementing combinatorial logic
- A D-type flip-flop or level-sensitive latch for sequential logic
- Fast carry logic for efficient arithmetic operations
This architecture gives the XC2S200-6FGG1025C the flexibility to implement anything from simple glue logic to complex state machines and DSP functions.
Input/Output Blocks (IOBs)
The FGG1025 package unlocks the full 284 user I/O capacity of the XC2S200 device. Each IOB supports:
- Programmable input delay for setup time optimization
- Independently configurable input and output registers
- Support for 16 selectable I/O standards, including LVTTL, LVCMOS, PCI, GTL, SSTL, and more
- Optional internal pull-up or pull-down resistors
- Slew rate control for signal integrity management
Block RAM
The XC2S200 includes 7 block RAM modules, each providing 8K bits of synchronous dual-port RAM, totaling 56K bits of embedded block memory. Block RAM can be configured as:
- Single-port or true dual-port RAM
- Various width/depth combinations (e.g., 16K×1, 8K×2, 4K×4, 2K×9, 1K×18)
Delay-Locked Loops (DLLs)
Four on-chip DLLs — one at each corner of the die — provide clock distribution with minimal skew, clock multiplication, division, and phase shifting. This makes the XC2S200-6FGG1025C well-suited for applications requiring tight clock synchronization.
Spartan-II Family Comparison: Where Does the XC2S200 Fit?
The XC2S200 is the flagship device of the Spartan-II family. The table below shows how it compares to its siblings:
| Device |
Logic Cells |
System Gates |
CLB Array |
Max User I/O |
Dist. RAM (bits) |
Block RAM (bits) |
| XC2S15 |
432 |
15,000 |
8×12 |
86 |
6,144 |
16K |
| XC2S30 |
972 |
30,000 |
12×18 |
92 |
13,824 |
24K |
| XC2S50 |
1,728 |
50,000 |
16×24 |
176 |
24,576 |
32K |
| XC2S100 |
2,700 |
100,000 |
20×30 |
176 |
38,400 |
40K |
| XC2S150 |
3,888 |
150,000 |
24×36 |
260 |
55,296 |
48K |
| XC2S200 |
5,292 |
200,000 |
28×42 |
284 |
75,264 |
56K |
The XC2S200-6FGG1025C occupies the top of the Spartan-II range, delivering the most logic resources, the most memory, and the most I/O pins of any device in the family.
XC2S200-6FGG1025C: Part Number Variants by Package
The XC2S200 device is available in several package options. The FGG1025 is the largest, providing the most I/O:
| Part Number |
Package |
Pin Count |
Max User I/O |
Speed Grade |
Temp Range |
| XC2S200-6FGG1025C |
FGG1025 FBGA |
1025 |
284 |
-6 |
Commercial |
| XC2S200-5FGG456C |
FGG456 FBGA |
456 |
284 |
-5 |
Commercial |
| XC2S200-6FGG456C |
FGG456 FBGA |
456 |
284 |
-6 |
Commercial |
| XC2S200-6FG256C |
FG256 FBGA |
256 |
176 |
-6 |
Commercial |
| XC2S200-6PQ208C |
PQ208 PQFP |
208 |
140 |
-6 |
Commercial |
The FGG1025 package is ideal when maximum I/O count is essential, since it provides the full 284 user I/Os that the XC2S200 silicon supports.
XC2S200-6FGG1025C Applications
#### Industrial Control & Automation
The 284 I/Os and robust logic density of the XC2S200-6FGG1025C make it ideal for PLC interfaces, motor drive control, sensor data acquisition systems, and real-time machine monitoring.
#### Communications & Networking Equipment
With support for multiple I/O standards and four DLLs for precise clocking, this FPGA suits routers, switches, protocol bridges, serial communication front ends, and line card logic in telecom infrastructure.
#### Test & Measurement Instruments
Laboratories and equipment manufacturers use the XC2S200-6FGG1025C in logic analyzers, oscilloscope front ends, signal generators, and automated test equipment (ATE), where its rich I/O and reprogrammability are valuable.
#### Defense & Aerospace (Legacy Systems)
Many long-lived defense and aerospace platforms rely on Spartan-II FPGAs. The XC2S200-6FGG1025C is used in radar signal processing, avionics display logic, and secure data handling systems that require form/fit/function hardware continuity.
#### Medical Devices
Patient monitoring systems, imaging equipment interfaces, and diagnostic instruments benefit from the FPGA’s deterministic timing, multivolt I/O, and the ability to update firmware logic in the field.
#### Prototype Development & ASIC Replacement
The XC2S200-6FGG1025C is a proven ASIC alternative. It eliminates costly mask sets, reduces time to market, and allows field updates after deployment — advantages that make it attractive for low-to-medium volume production runs.
XC2S200-6FGG1025C: Advantages & Limitations
Advantages
| Advantage |
Details |
| Maximum I/O density |
284 user I/Os in the FGG1025 package — the highest available for XC2S200 |
| Fastest speed grade |
-6 is the highest speed grade for Spartan-II, enabling ~263 MHz internal logic operation |
| Reprogrammability |
In-field reconfiguration via JTAG or SPI-based configuration PROMs |
| Flexible I/O standards |
16 selectable standards enable interface with diverse external logic families |
| Integrated memory |
56K bits of block RAM plus 75K+ bits of distributed RAM reduce external memory requirements |
| DLL clock management |
Four on-chip DLLs provide low-skew, phase-adjustable clock distribution |
Limitations
| Limitation |
Details |
| Legacy/obsolete status |
Spartan-II is no longer in production; not recommended for new designs |
| 2.5V core only |
Not compatible with 1.8V or lower-voltage system architectures without level translation |
| Toolchain dependency |
Requires Xilinx ISE Design Suite; not supported by Vivado |
| RoHS non-compliant (standard) |
The non-“G” variants are not Pb-free; FGG designates Pb-free packaging |
Design Tools for the XC2S200-6FGG1025C
The XC2S200-6FGG1025C is supported exclusively by the Xilinx ISE Design Suite (legacy tool). AMD Xilinx’s newer Vivado Design Suite does not support Spartan-II devices. Key ISE features relevant to this device include:
- ISE Webpack — Free version supporting Spartan-II synthesis and implementation
- XPower — Power estimation tool
- IMPACT — Configuration and programming utility for JTAG download
- ChipScope Pro — On-chip logic analyzer for debugging
Designers migrating from Spartan-II to a supported family should consider the Xilinx Spartan-6 or Spartan-7 families, which offer significantly higher density and are supported by modern toolchains.
Configuration Modes Supported by XC2S200-6FGG1025C
| Configuration Mode |
CCLK Direction |
Data Width |
Notes |
| Master Serial |
Output |
1-bit |
Uses external serial PROM |
| Slave Serial |
Input |
1-bit |
Driven by external controller |
| Slave Parallel (SelectMAP) |
Input |
8-bit |
Fast parallel configuration |
| Boundary-Scan (JTAG) |
N/A |
1-bit |
IEEE 1149.1 compliant |
Frequently Asked Questions About the XC2S200-6FGG1025C
Q: What does “6FGG1025C” mean in the part number? “6” is the speed grade, “FGG” indicates a Pb-free Fine-Pitch Ball Grid Array package, “1025” is the pin count, and “C” indicates the commercial temperature range (0°C to +85°C).
Q: Is the XC2S200-6FGG1025C still in production? No. The Spartan-II family has been discontinued. Units available today are sourced from distributor and broker inventory.
Q: What is the maximum number of user I/Os on the XC2S200-6FGG1025C? The FGG1025 package supports the full 284 user I/Os that the XC2S200 silicon provides.
Q: Can I use Vivado to program the XC2S200-6FGG1025C? No. You must use Xilinx ISE Design Suite for design, simulation, and programming of Spartan-II devices.
Q: What is a suitable modern replacement for the XC2S200-6FGG1025C? For new designs, consider the Xilinx Spartan-6 (XC6SLx) or Spartan-7 families, which offer much greater logic density, lower power, and full Vivado support.
Summary: Why the XC2S200-6FGG1025C Remains Relevant
Although the Spartan-II family has reached end-of-life status, the XC2S200-6FGG1025C continues to serve a critical role in legacy system maintenance, repair, and obsolescence management. Its combination of 200,000 system gates, 284 user I/Os in the large FGG1025 package, -6 speed grade performance, and proven Xilinx architecture make it a sought-after component for field-support engineers and manufacturers sustaining long-life products.
If you are working with Xilinx FPGAs across any product generation, understanding the complete landscape of available devices is essential. Explore our comprehensive resource on Xilinx FPGA to learn more about current and legacy Xilinx programmable logic solutions.