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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
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Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1025C: Complete Guide to Xilinx Spartan-II FPGA Specifications, Features & Applications

Product Details

The XC2S200-6FGG1025C is a high-performance Field Programmable Gate Array (FPGA) from the Xilinx Spartan-II family. Manufactured by Xilinx (now AMD Xilinx), this device delivers 200,000 system gates and 5,292 logic cells in a large 1025-pin Fine-Pitch Ball Grid Array (FBGA) package, making it one of the most I/O-rich configurations in the Spartan-II lineup. Whether you are sourcing legacy components, supporting an existing design, or evaluating FPGA options for a project, this guide covers everything you need to know about the XC2S200-6FGG1025C.


What Is the XC2S200-6FGG1025C? Overview of the Xilinx Spartan-II FPGA

The XC2S200-6FGG1025C is part of Xilinx’s Spartan-II family — a 2.5V FPGA product line designed as a cost-effective alternative to mask-programmed ASICs. The part number can be decoded as follows:

Code Segment Meaning
XC2S200 Spartan-II family, 200K system gate device
-6 Speed grade 6 (fastest available for Spartan-II)
FGG Fine-Pitch Ball Grid Array package (Pb-free “G” variant)
1025 1025 total pins
C Commercial temperature range (0°C to +85°C)

The Spartan-II family was designed to shorten product development cycles and reduce cost by eliminating the non-recurring engineering (NRE) fees associated with ASICs. The XC2S200 is the largest and most capable device in the Spartan-II family, and the FGG1025 package provides access to the maximum number of user I/O pins — up to 284 user I/Os.

For a broader overview of Xilinx programmable logic devices, visit our guide on Xilinx FPGA.


XC2S200-6FGG1025C Key Specifications

Core Logic Resources

Parameter XC2S200 Value
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Max User I/O (FGG1025) 284
Distributed RAM (bits) 75,264
Block RAM (bits) 56K (7 × 8K blocks)

Electrical & Packaging Specifications

Parameter Value
Core Voltage 2.5V
I/O Voltage 2.5V (Multivolt I/O support)
Technology Node 0.18 µm
Package Type Fine-Pitch Ball Grid Array (FBGA)
Pin Count 1025
Package Designation FGG1025 (Pb-free)
Temperature Range Commercial: 0°C to +85°C
Speed Grade -6 (fastest)
Max Clock Frequency ~263 MHz (internal logic)

Configuration & Memory

Parameter Value
Configuration File Size 1,335,840 bits
Configuration Modes Master Serial, Slave Serial, Slave Parallel, Boundary Scan
Delay-Locked Loops (DLLs) 4 (one at each corner of the die)
Supported I/O Standards 16 selectable standards

XC2S200-6FGG1025C Architecture Deep Dive

Configurable Logic Blocks (CLBs)

The XC2S200 organizes its logic into 1,176 Configurable Logic Blocks arranged in a 28×42 array. Each CLB contains four logic cells, and each logic cell includes:

  • A 4-input Look-Up Table (LUT) for implementing combinatorial logic
  • A D-type flip-flop or level-sensitive latch for sequential logic
  • Fast carry logic for efficient arithmetic operations

This architecture gives the XC2S200-6FGG1025C the flexibility to implement anything from simple glue logic to complex state machines and DSP functions.

Input/Output Blocks (IOBs)

The FGG1025 package unlocks the full 284 user I/O capacity of the XC2S200 device. Each IOB supports:

  • Programmable input delay for setup time optimization
  • Independently configurable input and output registers
  • Support for 16 selectable I/O standards, including LVTTL, LVCMOS, PCI, GTL, SSTL, and more
  • Optional internal pull-up or pull-down resistors
  • Slew rate control for signal integrity management

Block RAM

The XC2S200 includes 7 block RAM modules, each providing 8K bits of synchronous dual-port RAM, totaling 56K bits of embedded block memory. Block RAM can be configured as:

  • Single-port or true dual-port RAM
  • Various width/depth combinations (e.g., 16K×1, 8K×2, 4K×4, 2K×9, 1K×18)

Delay-Locked Loops (DLLs)

Four on-chip DLLs — one at each corner of the die — provide clock distribution with minimal skew, clock multiplication, division, and phase shifting. This makes the XC2S200-6FGG1025C well-suited for applications requiring tight clock synchronization.


Spartan-II Family Comparison: Where Does the XC2S200 Fit?

The XC2S200 is the flagship device of the Spartan-II family. The table below shows how it compares to its siblings:

Device Logic Cells System Gates CLB Array Max User I/O Dist. RAM (bits) Block RAM (bits)
XC2S15 432 15,000 8×12 86 6,144 16K
XC2S30 972 30,000 12×18 92 13,824 24K
XC2S50 1,728 50,000 16×24 176 24,576 32K
XC2S100 2,700 100,000 20×30 176 38,400 40K
XC2S150 3,888 150,000 24×36 260 55,296 48K
XC2S200 5,292 200,000 28×42 284 75,264 56K

The XC2S200-6FGG1025C occupies the top of the Spartan-II range, delivering the most logic resources, the most memory, and the most I/O pins of any device in the family.


XC2S200-6FGG1025C: Part Number Variants by Package

The XC2S200 device is available in several package options. The FGG1025 is the largest, providing the most I/O:

Part Number Package Pin Count Max User I/O Speed Grade Temp Range
XC2S200-6FGG1025C FGG1025 FBGA 1025 284 -6 Commercial
XC2S200-5FGG456C FGG456 FBGA 456 284 -5 Commercial
XC2S200-6FGG456C FGG456 FBGA 456 284 -6 Commercial
XC2S200-6FG256C FG256 FBGA 256 176 -6 Commercial
XC2S200-6PQ208C PQ208 PQFP 208 140 -6 Commercial

The FGG1025 package is ideal when maximum I/O count is essential, since it provides the full 284 user I/Os that the XC2S200 silicon supports.


XC2S200-6FGG1025C Applications

#### Industrial Control & Automation

The 284 I/Os and robust logic density of the XC2S200-6FGG1025C make it ideal for PLC interfaces, motor drive control, sensor data acquisition systems, and real-time machine monitoring.

#### Communications & Networking Equipment

With support for multiple I/O standards and four DLLs for precise clocking, this FPGA suits routers, switches, protocol bridges, serial communication front ends, and line card logic in telecom infrastructure.

#### Test & Measurement Instruments

Laboratories and equipment manufacturers use the XC2S200-6FGG1025C in logic analyzers, oscilloscope front ends, signal generators, and automated test equipment (ATE), where its rich I/O and reprogrammability are valuable.

#### Defense & Aerospace (Legacy Systems)

Many long-lived defense and aerospace platforms rely on Spartan-II FPGAs. The XC2S200-6FGG1025C is used in radar signal processing, avionics display logic, and secure data handling systems that require form/fit/function hardware continuity.

#### Medical Devices

Patient monitoring systems, imaging equipment interfaces, and diagnostic instruments benefit from the FPGA’s deterministic timing, multivolt I/O, and the ability to update firmware logic in the field.

#### Prototype Development & ASIC Replacement

The XC2S200-6FGG1025C is a proven ASIC alternative. It eliminates costly mask sets, reduces time to market, and allows field updates after deployment — advantages that make it attractive for low-to-medium volume production runs.


XC2S200-6FGG1025C: Advantages & Limitations

Advantages

Advantage Details
Maximum I/O density 284 user I/Os in the FGG1025 package — the highest available for XC2S200
Fastest speed grade -6 is the highest speed grade for Spartan-II, enabling ~263 MHz internal logic operation
Reprogrammability In-field reconfiguration via JTAG or SPI-based configuration PROMs
Flexible I/O standards 16 selectable standards enable interface with diverse external logic families
Integrated memory 56K bits of block RAM plus 75K+ bits of distributed RAM reduce external memory requirements
DLL clock management Four on-chip DLLs provide low-skew, phase-adjustable clock distribution

Limitations

Limitation Details
Legacy/obsolete status Spartan-II is no longer in production; not recommended for new designs
2.5V core only Not compatible with 1.8V or lower-voltage system architectures without level translation
Toolchain dependency Requires Xilinx ISE Design Suite; not supported by Vivado
RoHS non-compliant (standard) The non-“G” variants are not Pb-free; FGG designates Pb-free packaging

Design Tools for the XC2S200-6FGG1025C

The XC2S200-6FGG1025C is supported exclusively by the Xilinx ISE Design Suite (legacy tool). AMD Xilinx’s newer Vivado Design Suite does not support Spartan-II devices. Key ISE features relevant to this device include:

  • ISE Webpack — Free version supporting Spartan-II synthesis and implementation
  • XPower — Power estimation tool
  • IMPACT — Configuration and programming utility for JTAG download
  • ChipScope Pro — On-chip logic analyzer for debugging

Designers migrating from Spartan-II to a supported family should consider the Xilinx Spartan-6 or Spartan-7 families, which offer significantly higher density and are supported by modern toolchains.


Configuration Modes Supported by XC2S200-6FGG1025C

Configuration Mode CCLK Direction Data Width Notes
Master Serial Output 1-bit Uses external serial PROM
Slave Serial Input 1-bit Driven by external controller
Slave Parallel (SelectMAP) Input 8-bit Fast parallel configuration
Boundary-Scan (JTAG) N/A 1-bit IEEE 1149.1 compliant

Frequently Asked Questions About the XC2S200-6FGG1025C

Q: What does “6FGG1025C” mean in the part number? “6” is the speed grade, “FGG” indicates a Pb-free Fine-Pitch Ball Grid Array package, “1025” is the pin count, and “C” indicates the commercial temperature range (0°C to +85°C).

Q: Is the XC2S200-6FGG1025C still in production? No. The Spartan-II family has been discontinued. Units available today are sourced from distributor and broker inventory.

Q: What is the maximum number of user I/Os on the XC2S200-6FGG1025C? The FGG1025 package supports the full 284 user I/Os that the XC2S200 silicon provides.

Q: Can I use Vivado to program the XC2S200-6FGG1025C? No. You must use Xilinx ISE Design Suite for design, simulation, and programming of Spartan-II devices.

Q: What is a suitable modern replacement for the XC2S200-6FGG1025C? For new designs, consider the Xilinx Spartan-6 (XC6SLx) or Spartan-7 families, which offer much greater logic density, lower power, and full Vivado support.


Summary: Why the XC2S200-6FGG1025C Remains Relevant

Although the Spartan-II family has reached end-of-life status, the XC2S200-6FGG1025C continues to serve a critical role in legacy system maintenance, repair, and obsolescence management. Its combination of 200,000 system gates, 284 user I/Os in the large FGG1025 package, -6 speed grade performance, and proven Xilinx architecture make it a sought-after component for field-support engineers and manufacturers sustaining long-life products.

If you are working with Xilinx FPGAs across any product generation, understanding the complete landscape of available devices is essential. Explore our comprehensive resource on Xilinx FPGA to learn more about current and legacy Xilinx programmable logic solutions.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.