The XC2S200-6FGG1024C is a high-performance Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Built on 0.18µm CMOS technology and operating at 2.5V, this device delivers 200,000 system gates in a compact, lead-free 1024-ball Fine-Pitch BGA (FBGA) package — making it an ideal choice for engineers seeking a cost-effective, programmable alternative to mask-programmed ASICs. Whether you are designing communication systems, embedded controllers, or digital signal processing applications, the XC2S200-6FGG1024C offers the density, speed, and flexibility to meet demanding design requirements.
What Is the XC2S200-6FGG1024C?
The XC2S200-6FGG1024C belongs to Xilinx’s Spartan-II FPGA series — a family purpose-built for high-volume, cost-sensitive applications. The part number breaks down as follows:
| Code Segment |
Meaning |
| XC2S200 |
Spartan-II device with 200K system gates |
| -6 |
Speed grade 6 (fastest available in the Spartan-II family, Commercial range only) |
| FGG |
Fine-Pitch Ball Grid Array (Pb-free “G” suffix) |
| 1024 |
1024-pin package |
| C |
Commercial temperature range (0°C to +85°C) |
For more Xilinx FPGA options across families and packages, visit Xilinx FPGA.
XC2S200-6FGG1024C Key Specifications
General Device Parameters
| Parameter |
Value |
| Manufacturer |
Xilinx (AMD) |
| Series |
Spartan-II |
| Part Number |
XC2S200-6FGG1024C |
| Technology |
0.18µm CMOS |
| Core Supply Voltage (VCCINT) |
2.5V |
| I/O Supply Voltage (VCCO) |
1.5V – 3.3V |
| Speed Grade |
-6 (Fastest) |
| Temperature Range |
Commercial: 0°C to +85°C |
| Package |
1024-Ball Fine-Pitch BGA (FGG1024) |
| RoHS / Pb-Free |
Yes (G suffix) |
Logic & Memory Resources
| Resource |
XC2S200 Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Total Distributed RAM |
75,264 bits |
| Total Block RAM |
56K bits |
| Block RAM Modules |
14 × 4K bits |
Timing & Performance
| Parameter |
Value |
| Maximum Frequency |
Up to 200+ MHz (speed-grade dependent) |
| DLL Clock Skew Elimination |
Yes (4 DLLs) |
| Setup Time (flip-flop) |
As low as 0.5 ns (speed grade -6) |
| Clock-to-Output |
As low as 1.6 ns |
XC2S200-6FGG1024C Architecture Overview
Configurable Logic Blocks (CLBs)
The XC2S200 contains 1,176 CLBs arranged in a 28×42 array. Each CLB includes two slices, and each slice contains two 4-input Look-Up Tables (LUTs), two flip-flops, dedicated carry logic, and wide-function multiplexers. This architecture enables highly efficient implementation of both combinational and sequential logic.
Block RAM
The device features 56K bits of block RAM organized into 14 dual-port RAM modules of 4K bits each. These on-chip memory resources are essential for FIFO buffers, lookup tables, and embedded processor data memory — all with synchronous, pipelined access.
Delay-Locked Loops (DLLs)
Four dedicated Delay-Locked Loops (DLLs) — one at each corner of the die — provide zero-skew clock distribution, clock phase shifting, and frequency synthesis. DLLs significantly reduce clock skew across the entire device, a critical advantage for high-speed synchronous designs.
Input/Output Blocks (IOBs)
The XC2S200-6FGG1024C supports up to 284 user I/Os. Each IOB supports multiple I/O standards including:
| Supported I/O Standard |
Voltage |
| LVTTL |
3.3V |
| LVCMOS3 |
3.3V |
| LVCMOS2 |
2.5V |
| PCI (33 MHz / 66 MHz) |
3.3V |
| SSTL2 (Class I & II) |
2.5V |
| SSTL3 (Class I & II) |
3.3V |
| GTL / GTL+ |
– |
| LVDS (Transmit) |
– |
| AGP |
– |
XC2S200-6FGG1024C vs. Other Spartan-II Devices
Understanding how the XC2S200 fits within the Spartan-II family helps engineers select the right density for their design.
| Device |
Logic Cells |
System Gates |
CLB Array |
Max User I/O |
Block RAM |
| XC2S15 |
432 |
15,000 |
8×12 |
86 |
16K |
| XC2S30 |
972 |
30,000 |
12×18 |
92 |
24K |
| XC2S50 |
1,728 |
50,000 |
16×24 |
176 |
32K |
| XC2S100 |
2,700 |
100,000 |
20×30 |
176 |
40K |
| XC2S150 |
3,888 |
150,000 |
24×36 |
260 |
48K |
| XC2S200 |
5,292 |
200,000 |
28×42 |
284 |
56K |
The XC2S200 is the highest-density member of the Spartan-II family, making it the preferred choice when maximum logic resources and I/O capacity are required within this product line.
Ordering Information & Part Number Decoder
Xilinx uses a structured naming convention for Spartan-II devices. Here is how to decode the full part number:
XC2S200 - 6 - FGG - 1024 - C
| | | | |
Device Speed Package Pins Temp
Available Packages for XC2S200
| Package Code |
Package Type |
Pin Count |
| PQ(G)208 |
Plastic Quad Flat Pack (PQFP) |
208 |
| FG(G)256 |
Fine-Pitch BGA |
256 |
| FG(G)456 |
Fine-Pitch BGA |
456 |
| FGG1024 |
Fine-Pitch BGA (Pb-Free) |
1024 |
The FGG1024 package provides the highest pin count available for the XC2S200, offering the maximum number of accessible user I/Os — ideal for designs requiring extensive external bus connectivity.
Configuration & Programming
Configuration Modes
The XC2S200-6FGG1024C supports multiple configuration modes, allowing flexible integration into a variety of system architectures:
| Mode |
Description |
| Master Serial |
FPGA loads from a serial PROM |
| Slave Serial |
External controller drives the FPGA |
| Master Parallel (SelectMAP) |
High-speed 8-bit parallel configuration |
| Slave Parallel (SelectMAP) |
External controller, 8-bit parallel |
| Boundary Scan (JTAG) |
IEEE 1149.1 JTAG configuration |
Configuration Memory
The Spartan-II FPGA uses SRAM-based configuration cells, meaning the design is volatile and must be reloaded on every power-up. This is typically handled using a dedicated serial or parallel PROM, or a microcontroller-based configuration scheme. The Xilinx XCF-series Platform Flash PROMs are recommended companion devices.
Key Features Summary
- 200,000 system gates — largest in the Spartan-II family
- 5,292 logic cells in a 28×42 CLB array
- 56K bits of block RAM across 14 dual-port modules
- 284 maximum user I/Os supporting multiple voltage standards
- Four DLLs for zero-skew clock distribution and synthesis
- Speed grade -6 — fastest available for Commercial temperature range
- 2.5V core operation with multi-voltage I/O support (1.5V–3.3V)
- 1024-ball FGG package for maximum pin accessibility
- Pb-free / RoHS compliant packaging
- JTAG boundary scan support (IEEE 1149.1)
- In-system reconfigurability — no hardware replacement required for design updates
Typical Applications of the XC2S200-6FGG1024C
The XC2S200-6FGG1024C is widely deployed across a broad range of industries and use cases:
| Application Area |
Use Case |
| Telecommunications |
Line-card control, protocol bridging, framing logic |
| Industrial Automation |
Motor control, sensor interfaces, PLC logic |
| Consumer Electronics |
Set-top boxes, digital displays, media controllers |
| Embedded Systems |
Co-processing, bus bridges, glue logic replacement |
| Test & Measurement |
Pattern generation, data capture, interface emulation |
| Medical Devices |
Signal acquisition, data path control |
| Networking |
Packet processing, interface aggregation |
Design Tools & Support
Xilinx Spartan-II devices are supported by the Xilinx ISE Design Suite (recommended for legacy Spartan-II designs). Key development tools include:
- ISE Project Navigator — RTL synthesis and implementation
- ISim / ModelSim — functional and timing simulation
- ChipScope Pro — on-chip logic analysis
- iMPACT — JTAG programming and configuration
Note: The Spartan-II family is not supported by AMD’s newer Vivado Design Suite. Engineers should use ISE 14.7 for full Spartan-II compatibility.
Frequently Asked Questions (FAQ)
Q: Is the XC2S200-6FGG1024C still in production? The XC2S200 series has been marked as “Not Recommended for New Designs” (NRND) by AMD/Xilinx. However, it remains available through authorized distributors for legacy support and long-lifecycle applications.
Q: What is the difference between FGG1024 and FG1024 packages? The extra “G” in FGG1024 indicates a Pb-free (RoHS-compliant) package. The FG1024 (without the second G) uses standard tin-lead solder balls.
Q: Can this FPGA replace mask-programmed ASICs? Yes. The Spartan-II family was specifically designed as a cost-effective, reprogrammable alternative to ASICs, eliminating NRE (Non-Recurring Engineering) costs and allowing field upgrades.
Q: What voltage does the XC2S200-6FGG1024C require? The core (VCCINT) requires 2.5V. The I/O banks (VCCO) support 1.5V to 3.3V depending on the I/O standard used.
Conclusion
The XC2S200-6FGG1024C is the top-of-the-line member of Xilinx’s Spartan-II FPGA family, combining 200,000 system gates, 5,292 logic cells, 56K bits of block RAM, and 284 user I/Os in a compact 1024-ball Pb-free BGA package. Its -6 speed grade delivers the highest performance available in this family, and its broad I/O standard support makes it a versatile solution for communications, industrial, and embedded applications. While it carries NRND status, it remains a dependable choice for legacy designs and long-lifecycle industrial systems.
