The XC2S200-6FGG1021C is a high-density, 2.5V field-programmable gate array (FPGA) from Xilinx’s Spartan-II family. Featuring 200,000 system gates, 5,292 logic cells, and housed in a 1,020-ball Fine Pitch BGA (FBGA) package, this device delivers exceptional programmable logic performance for commercial-temperature-range applications. Whether you’re designing digital control systems, embedded processors, or high-speed communication interfaces, the XC2S200-6FGG1021C provides the flexibility and I/O density to meet demanding engineering requirements.

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What Is the XC2S200-6FGG1021C? — Part Number Breakdown

Understanding the part number helps engineers confirm they are ordering the correct device.

Note: The “-6” speed grade is exclusively available for the Commercial temperature range (“C” suffix), making the XC2S200-6FGG1021C ideal for desktop, industrial-adjacent, and embedded commercial applications.

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XC2S200-6FGG1021C Key Specifications

Core Logic & Memory Specifications

Performance & Timing

Package & I/O Specifications

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XC2S200-6FGG1021C Architecture Overview

## Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1021C contains 1,176 CLBs arranged in a 28×42 array. Each CLB consists of two slices, and each slice contains two 4-input Look-Up Tables (LUTs), two flip-flops, and dedicated carry logic. This architecture enables efficient implementation of arithmetic functions, shift registers, and ROM-style logic without external memory.

## Dedicated Block RAM

With 56K bits of block RAM organized in two columns on opposite sides of the die, the XC2S200-6FGG1021C supports true dual-port operation with independent clocking. Block RAM can be configured as 16K×1, 8K×2, 4K×4, 2K×8, or 1K×16 — making it versatile for FIFOs, lookup tables, and local data buffers.

## Delay-Locked Loop (DLL)

Four on-chip Delay-Locked Loops eliminate clock distribution delays and enable clock frequency synthesis, phase shifting, and duty-cycle correction. The DLLs are positioned at the four corners of the die for symmetric, low-skew clock delivery across all CLBs and IOBs.

## Input/Output Blocks (IOBs)

The XC2S200-6FGG1021C’s IOBs support a wide range of single-ended and differential I/O standards, including PCI 3.3V, LVTTL, LVCMOS, GTL/GTL+, SSTL2/3, HSTL, and AGP. Each IOB features programmable drive strength, slew-rate control, optional pull-up/pull-down resistors, and input delay elements for hold-time management.

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Spartan-II Family Comparison Table

The table below positions the XC2S200 at the top of the Spartan-II product line.

The XC2S200 offers the largest gate count and highest I/O density in the Spartan-II family, making the XC2S200-6FGG1021C — with its spacious 1,020-ball package — the best choice when maximum I/O utilization is a design priority.

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XC2S200-6FGG1021C Configuration & Programming

## Supported Configuration Modes

The Spartan-II supports multiple configuration modes to fit different system architectures:

Configuration data is stored in SRAM-based cells, meaning the device must be reconfigured on every power-up. Xilinx XCF serial PROMs or standard Flash/EEPROM devices can be used for autonomous boot.

## Design Tools

The XC2S200-6FGG1021C is supported by the Xilinx ISE Design Suite (recommended for legacy Spartan-II designs). HDL-based design entry using VHDL or Verilog is fully supported, along with schematic-based flows. For those maintaining or migrating existing designs, ISE WebPACK provides a free path for Spartan-II development.

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Typical Applications for the XC2S200-6FGG1021C

The large I/O count of the FGG1021 package makes this device especially well-suited for I/O-intensive designs:

• Communications equipment — Framer/deframer logic, protocol bridging, line-card control
• Industrial control systems — Motor drive controllers, sensor fusion, real-time signal processing
• Test & measurement — Pattern generators, data capture, logic analyzers
• Embedded processor support — Custom peripheral fabric, bus interface logic, co-processing
• Consumer electronics — Video processing pipelines, display controllers, interface bridging
• Networking equipment — Packet switching logic, memory controllers, protocol offload

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XC2S200-6FGG1021C vs. Alternative Part Numbers

Engineers frequently compare package variants of the XC2S200. The following table clarifies the differences:

The FGG1021 package provides a larger board footprint with wider ball pitch, which can ease PCB routing and improve signal integrity in high-I/O designs compared to the denser FGG456 variant.

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Absolute Maximum Ratings

These are stress ratings only. Operating the device beyond these values can cause permanent damage.

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Why Choose the XC2S200-6FGG1021C?

The XC2S200-6FGG1021C combines the largest capacity in the Spartan-II lineup with the fastest available speed grade (-6) and a high-ball-count package that simplifies PCB layout for I/O-heavy systems. Its 0.18µm process technology delivers a favorable power-performance balance for 2.5V logic environments, and JTAG boundary scan support streamlines board-level testing and debug.

For engineers working with Xilinx FPGA solutions across telecommunications, industrial automation, and embedded design, the XC2S200-6FGG1021C remains a reliable, well-documented choice with broad toolchain support.

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Frequently Asked Questions (FAQ)

Q: What is the XC2S200-6FGG1021C? The XC2S200-6FGG1021C is a Xilinx Spartan-II 2.5V FPGA with 200,000 system gates, 5,292 logic cells, speed grade -6, housed in a 1,020-ball Fine Pitch BGA package, rated for commercial temperatures (0°C to +85°C).

Q: What is the maximum operating frequency of the XC2S200-6FGG1021C? The device supports system frequencies up to approximately 263 MHz depending on design implementation and timing constraints.

Q: Is the XC2S200-6FGG1021C RoHS compliant? The “GG” in the part number indicates a Pb-free (lead-free) package option. Confirm RoHS compliance with your distributor at time of purchase, as this may vary by lot.

Q: Can the XC2S200-6FGG1021C be used in industrial temperature applications? No. The “C” suffix denotes Commercial temperature range only (0°C to +85°C). For industrial range (−40°C to +100°C), look for part numbers with an “I” suffix and speed grade -5, such as the XC2S200-5FGG456I.

Q: What design software is used for the XC2S200-6FGG1021C? Xilinx ISE Design Suite is the primary tool. HDL design entry (VHDL/Verilog) and schematic entry are supported. Xilinx ISE WebPACK provides a no-cost option.

Q: What are common substitutes for the XC2S200-6FGG1021C? Functional alternatives within the same package class include the XC2S200-5FGG456C (smaller package) or upgrading to Spartan-3 family devices for newer designs with higher capacity.