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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1020C: Xilinx Spartan-II FPGA – Full Specs, Features & Buying Guide

Product Details

The XC2S200-6FGG1020C is a high-performance, cost-effective Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for commercial-temperature, high-volume applications, this 2.5V logic device delivers 200,000 system gates, 5,292 logic cells, and an impressive 1,020-pin Fine-Pitch BGA (FBGA) package — making it one of the most capable members of the Spartan-II series. Whether you are designing embedded systems, digital signal processing pipelines, or communication interfaces, the XC2S200-6FGG1020C offers a proven, flexible solution.


What Is the XC2S200-6FGG1020C?

The XC2S200-6FGG1020C is part of Xilinx’s Spartan-II FPGA family, a product line built as a superior alternative to mask-programmed ASICs. Unlike ASICs, this FPGA eliminates high upfront tooling costs, long development cycles, and the inherent risk of committing to fixed silicon. Its field-programmability means you can update your design in the system with no hardware replacement — a critical advantage in fast-moving product development environments.

The part number breaks down as follows:

Part Number Segment Meaning
XC2S200 Xilinx Spartan-II, 200K system gates
-6 Speed Grade 6 (fastest, commercial only)
FGG Fine-Pitch Ball Grid Array (Pb-free package)
1020 1,020 pins
C Commercial temperature range (0°C to +85°C)

XC2S200-6FGG1020C Key Specifications

Core Logic Resources

Parameter XC2S200 Value
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56K bits
Delay-Locked Loops (DLL) 4

Device & Package Details

Parameter Value
Part Number XC2S200-6FGG1020C
Manufacturer Xilinx (AMD)
FPGA Family Spartan-II
Technology Node 0.18µm
Core Supply Voltage 2.5V
Package Type Fine-Pitch BGA (FBGA) – Pb-Free
Pin Count 1,020
Speed Grade -6 (fastest in Spartan-II)
Operating Temperature 0°C to +85°C (Commercial)
Max Operating Frequency 263 MHz

XC2S200-6FGG1020C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200 contains 1,176 CLBs arranged in a 28×42 array. Each CLB consists of two slices, and each slice contains two look-up tables (LUTs) and two flip-flops. This structure provides the building blocks for implementing combinatorial logic, sequential circuits, shift registers, and distributed RAM.

Block RAM

With 56K bits of block RAM spread across two columns on either side of the CLB array, the XC2S200-6FGG1020C supports complex data buffering, FIFOs, and memory-mapped storage without consuming logic resources. Each block RAM is fully dual-ported and supports synchronous read and write operations.

Input/Output Blocks (IOBs)

The device supports up to 284 user I/O pins, each configurable for a wide range of I/O standards. The IOBs include programmable input delays, output slew rate control, and optional pull-up or pull-down resistors — essential for interfacing with diverse external peripherals and bus standards.

Delay-Locked Loops (DLLs)

Four on-chip DLLs — one at each corner of the die — provide precise clock distribution, phase alignment, and frequency synthesis. This enables the XC2S200-6FGG1020C to meet demanding timing closure requirements in clocked digital systems.


Spartan-II Family Comparison Table

The table below compares the XC2S200 against other Spartan-II family members to help you choose the right device for your design requirements.

Device Logic Cells System Gates CLB Array Max User I/O Distributed RAM Block RAM
XC2S15 432 15,000 8×12 86 6,144 bits 16K
XC2S30 972 30,000 12×18 92 13,824 bits 24K
XC2S50 1,728 50,000 16×24 176 24,576 bits 32K
XC2S100 2,700 100,000 20×30 176 38,400 bits 40K
XC2S150 3,888 150,000 24×36 260 55,296 bits 48K
XC2S200 5,292 200,000 28×42 284 75,264 bits 56K

The XC2S200 is the largest and most capable device in the Spartan-II family, making the XC2S200-6FGG1020C the top choice when maximum I/O count, logic density, and memory are required.


XC2S200-6FGG1020C Features & Benefits

#### Speed Grade -6: The Fastest Spartan-II Option

The -6 speed grade is the highest performance grade available in the Spartan-II family and is exclusively offered in the commercial temperature range. With a maximum operating frequency of 263 MHz, this variant is ideal for performance-critical digital designs that require fast logic evaluation and short propagation delays.

#### Pb-Free FGG Package for Modern PCB Compliance

The “G” suffix in FGG designates a lead-free (Pb-free) packaging option, complying with RoHS directives and supporting green electronics manufacturing. The 1,020-ball Fine-Pitch BGA footprint maximizes I/O density while keeping the board footprint compact.

#### JTAG Boundary Scan Support

The XC2S200-6FGG1020C supports IEEE 1149.1 JTAG boundary scan for in-circuit testing, simplifying PCB debug and production test procedures.

#### In-System Reconfigurability

One of the defining advantages of the Spartan-II FPGA over ASICs is the ability to reprogram the device in the field. Design updates, bug fixes, and feature additions can be deployed without hardware replacement, dramatically reducing long-term maintenance costs.


Supported I/O Standards

The XC2S200-6FGG1020C IOBs are compatible with a wide array of industry-standard interfaces:

I/O Standard Description
LVTTL Low-Voltage TTL, 3.3V
LVCMOS Low-Voltage CMOS (2.5V, 3.3V)
PCI 3.3V PCI bus interface
GTL / GTL+ Gunning Transceiver Logic
HSTL High-Speed Transceiver Logic
SSTL Stub Series Terminated Logic (2.5V, 3.3V)
CTT Center Tap Terminated

Typical Applications of the XC2S200-6FGG1020C

The XC2S200-6FGG1020C is widely used across industrial, commercial, and embedded system domains:

  • Digital Signal Processing (DSP): FIR/IIR filters, FFT engines, and signal conditioning pipelines
  • Communications: Protocol bridging, serializer/deserializer (SerDes), and packet processing
  • Industrial Control: Motor controllers, sensor fusion, and real-time control loops
  • Embedded Systems: Custom processors, co-processing engines, and hardware accelerators
  • Test & Measurement: Data acquisition, pattern generation, and logic analysis
  • Consumer Electronics: Video processing, display controllers, and audio interfaces

Configuration Modes

The XC2S200-6FGG1020C supports multiple configuration modes to suit different system architectures:

Configuration Mode Description
Master Serial FPGA drives SCK; loads from serial PROM
Slave Serial External controller drives configuration
Master Parallel (SelectMAP) Fast 8-bit parallel configuration bus
JTAG IEEE 1149.1 boundary scan configuration
Slave Parallel (SelectMAP) External parallel byte-wide controller

Design Tools for the XC2S200-6FGG1020C

Xilinx’s legacy ISE Design Suite is the primary development environment for Spartan-II devices, offering synthesis, implementation, simulation, and bitstream generation. For schematic capture and HDL entry, engineers typically use VHDL or Verilog with ISE’s built-in tools or third-party simulators such as ModelSim.

Note: The Vivado Design Suite does not support Spartan-II devices. Use ISE 14.7 or earlier for XC2S200 development.

For a broader selection of Xilinx programmable logic devices — including newer Spartan, Artix, Kintex, and Virtex families — visit our Xilinx FPGA product page.


XC2S200-6FGG1020C vs. Comparable Devices

Parameter XC2S200-6FGG1020C XC2S200-5FGG1020C XC2S150-6FG456C
Speed Grade -6 (fastest) -5 -6
System Gates 200,000 200,000 150,000
Logic Cells 5,292 5,292 3,888
Package FGG1020 (Pb-free) FG1020 (standard) FG456
Temperature Commercial Commercial Commercial
Max Frequency 263 MHz 200 MHz (est.) 263 MHz

Ordering Information

When ordering the XC2S200-6FGG1020C, use the complete part number to ensure you receive the correct speed grade, package, and Pb-free compliance:

Field Value
Full Part Number XC2S200-6FGG1020C
Device XC2S200
Speed Grade -6
Package FGG1020 (Fine-Pitch BGA, Pb-Free, 1020 pins)
Temperature Range C = Commercial (0°C to +85°C)
RoHS Compliance Yes (Pb-Free “G” package)

Frequently Asked Questions (FAQ)

What is the difference between FG1020 and FGG1020?

The FGG1020 designates a Pb-free (lead-free) 1,020-ball Fine-Pitch BGA package. The standard FG1020 uses conventional tin-lead solder balls. For RoHS-compliant designs, always specify the FGG variant.

Is the XC2S200-6FGG1020C still in production?

The Spartan-II family is a mature product line. While Xilinx has transitioned focus to newer device families, the XC2S200 series remains available through authorized distributors and component brokers for legacy design support and production continuity.

Can the XC2S200-6FGG1020C be reprogrammed after installation?

Yes. The XC2S200-6FGG1020C is fully reconfigurable after installation on a PCB. Configuration is stored in external SRAM-based cells, which are reloaded at power-up from a serial PROM or can be updated via JTAG.

What voltage does the XC2S200-6FGG1020C require?

The device requires 2.5V for VCCINT (core supply) and supports VCCO voltages of 2.5V or 3.3V depending on the target I/O standard.


Conclusion

The XC2S200-6FGG1020C remains a capable and versatile FPGA for engineers working with legacy systems or cost-sensitive designs that require proven, reliable programmable logic. With 200,000 system gates, 284 user I/O pins, 56K bits of block RAM, four on-chip DLLs, and the fastest -6 speed grade in the Spartan-II family — all housed in a compact, Pb-free 1,020-ball FBGA — this device delivers substantial capability for its class.

For engineers evaluating next-generation programmable logic solutions alongside legacy Spartan-II components, explore the full range of options on our Xilinx FPGA catalog page.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.