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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1019C: Xilinx Spartan-II FPGA – Complete Product Guide

Product Details

The XC2S200-6FGG1019C is a high-performance, 2.5V field-programmable gate array (FPGA) from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications, this device combines 200,000 system gates with a 1019-ball Fine Pitch BGA (FBGA) package, making it one of the most capable options in the Spartan-II lineup. Whether you’re developing embedded systems, communications hardware, or digital signal processing circuits, the XC2S200-6FGG1019C delivers the logic density, I/O flexibility, and speed you need.


What Is the XC2S200-6FGG1019C?

The XC2S200-6FGG1019C is part of Xilinx’s Spartan-II FPGA family — a series built to offer ASIC-level performance at programmable logic prices. The part number breaks down as follows:

Code Segment Meaning
XC2S200 Spartan-II device with ~200,000 system gates
-6 Speed grade 6 (fastest in the Spartan-II family)
FGG Fine Pitch BGA package (Pb-free / RoHS compliant)
1019 1019-pin package
C Commercial temperature range (0°C to +85°C)

For engineers sourcing programmable logic ICs, the XC2S200-6FGG1019C represents the top-density, highest-speed, commercial-grade variant of the XC2S200 in this large-pin package.


XC2S200-6FGG1019C Key Specifications

Core Logic Resources

Parameter XC2S200 Value
Logic Cells 5,292
System Gates (Logic + RAM) 200,000
CLB Array (Rows × Columns) 28 × 42
Total CLBs 1,176
Max User I/O Pins 284
Distributed RAM (bits) 75,264
Block RAM (bits) 56K
Configuration Bits 1,335,840

Electrical & Timing Characteristics

Parameter Value
Core Supply Voltage 2.5V
I/O Supply Voltage 3.3V (LVTTL, LVCMOS)
Speed Grade -6 (fastest)
Temperature Range Commercial (0°C to +85°C)
Package 1019-ball FBGA (Fine Pitch BGA)
Package Designation FGG1019

XC2S200-6FGG1019C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200 features 1,176 Configurable Logic Blocks arranged in a 28×42 matrix. Each CLB contains:

  • Two logic cells, each with a 4-input look-up table (LUT)
  • Flip-flops with synchronous/asynchronous set and reset
  • Fast carry and arithmetic logic
  • Dedicated distributed RAM support (75,264 bits total)

This architecture enables efficient implementation of counters, state machines, arithmetic units, and data path logic.

Input/Output Blocks (IOBs)

The XC2S200-6FGG1019C supports up to 284 user I/O pins, each programmable to support multiple standards:

I/O Standard Supported
LVTTL
LVCMOS2
PCI (3.3V)
GTL / GTL+
HSTL Class I
SSTL2 / SSTL3

Each IOB includes programmable slew rate, pull-up/pull-down resistors, and a 3-state output option.

Block RAM

The device contains 56Kb of dual-port block RAM, organized in two columns on either side of the CLB array. Block RAM supports:

  • True dual-port access
  • Synchronous read and write
  • Configurable width/depth (e.g., 4K×1, 512×8, 256×16)

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops (DLLs) — one at each corner of the die — provide:

  • Clock deskewing and phase alignment
  • Frequency synthesis (2×, 1.5×, etc.)
  • Clock duty-cycle correction

Spartan-II Family Comparison Table

Device Logic Cells System Gates Total CLBs Max User I/O Block RAM
XC2S15 432 15,000 96 86 16K
XC2S30 972 30,000 216 92 24K
XC2S50 1,728 50,000 384 176 32K
XC2S100 2,700 100,000 600 176 40K
XC2S150 3,888 150,000 864 260 48K
XC2S200 5,292 200,000 1,176 284 56K

The XC2S200 is the largest and most feature-rich device in the Spartan-II family, making the XC2S200-6FGG1019C the premium choice for applications that need maximum gate density.


Configuration Modes

The XC2S200-6FGG1019C supports multiple configuration modes for flexible system integration:

Configuration Mode CCLK Direction Data Width Serial DOUT
Master Serial Output 1-bit Yes
Slave Serial Input 1-bit Yes
Slave Parallel Input 8-bit No
Boundary-Scan (JTAG) N/A 1-bit No

Configuration data can be stored in external serial PROMs or loaded via a microprocessor interface, giving designers maximum flexibility during system bring-up and production testing.


Typical Applications of the XC2S200-6FGG1019C

The XC2S200-6FGG1019C is widely used across industries that demand programmable logic at commercial temperature ranges with high pin counts:

  • Telecommunications: Framing, protocol conversion, and line-card logic
  • Embedded Systems: Custom processor interfaces, glue logic, and bus bridges
  • Industrial Automation: Real-time control, motor drive logic, and sensor interfacing
  • Consumer Electronics: High-speed data path and display controllers
  • Test & Measurement: Pattern generation and data acquisition front ends
  • Networking Equipment: Packet processing and switching logic

Why Choose the XC2S200-6FGG1019C?

#### Speed Grade -6: The Fastest in the Spartan-II Family

The -6 speed grade is the highest-performance option in the Spartan-II lineup and is exclusively available in the commercial temperature range. This makes the XC2S200-6FGG1019C the go-to choice for timing-critical designs operating at commercial ambient conditions.

#### Large 1019-Pin Package for High Connectivity

The FGG1019 fine pitch BGA package provides access to a large number of signal and power pins, making it ideal for designs that require dense board-level interconnects. This package is RoHS-compliant (indicated by the “G” suffix in “FGG”).

#### Cost-Effective Alternative to Mask-Programmed ASICs

As part of the Spartan-II family, the XC2S200-6FGG1019C offers ASIC-competitive pricing with the full flexibility of programmable logic — shortening design cycles, eliminating NRE costs, and supporting in-field updates.


Ordering Information & Part Number Decoder

Field Value
Base Device XC2S200
Speed Grade -6
Package Type FGG (Fine Pitch BGA, Pb-Free)
Pin Count 1019
Temperature C (Commercial: 0°C to +85°C)
Full Part Number XC2S200-6FGG1019C

Note: The “G” in “FGG” indicates a Pb-free / RoHS-compliant package. Standard (non-Pb-free) packages use “FG” without the second “G.”


XC2S200-6FGG1019C vs. Similar Devices

Part Number Speed Grade Package Pins Pb-Free Temp Range
XC2S200-6FGG1019C -6 FBGA 1019 Yes Commercial
XC2S200-6FGG456C -6 FBGA 456 Yes Commercial
XC2S200-5FGG456C -5 FBGA 456 Yes Commercial
XC2S200-6FG456C -6 FBGA 456 No Commercial
XC2S200-5FGG456I -5 FBGA 456 Yes Industrial

The XC2S200-6FGG1019C stands out for its combination of the fastest speed grade, largest pin count, and Pb-free compliance in the commercial range.


Design Tools & Support

Xilinx Spartan-II devices like the XC2S200-6FGG1019C are supported by:

  • ISE Design Suite (Xilinx’s legacy design environment for Spartan-II)
  • JTAG boundary-scan for in-system debugging
  • ChipScope Pro for on-chip logic analysis
  • IBIS models for signal integrity simulation
  • Third-party synthesis tools (Synplify, Precision RTL)

Standard HDL flows using VHDL or Verilog are fully supported, and Xilinx’s UCF (User Constraints File) format allows precise pin and timing assignments.


Frequently Asked Questions (FAQ)

Q: What is the maximum clock frequency of the XC2S200-6FGG1019C? A: The -6 speed grade is the fastest in the Spartan-II family. Achievable internal clock frequencies depend on design complexity, but typical flip-flop-to-flip-flop delays (Tco + Tpd + Tsu) allow operation well above 100 MHz for simple logic paths.

Q: Is the XC2S200-6FGG1019C still in production? A: The Spartan-II family has reached end-of-life status. Designers requiring a pin-compatible upgrade path should consider newer Xilinx FPGA families such as Spartan-6 or the modern Spartan-7 series, which offer significant density, power, and performance improvements.

Q: What configuration PROMs are compatible with the XC2S200? A: Xilinx XC18V series and XCF serial PROMs are commonly used. The device supports Master Serial mode, making it easy to auto-configure on power-up from an external PROM.

Q: Does the XC2S200-6FGG1019C support partial reconfiguration? A: No. Partial reconfiguration is not supported in the Spartan-II family. Full device reconfiguration is required for any design change.


Summary

The XC2S200-6FGG1019C is a proven, high-density Xilinx Spartan-II FPGA delivering 200,000 system gates, 284 user I/O pins, 56Kb of block RAM, and four DLLs — all in a Pb-free 1019-ball FBGA package running at the fastest available -6 speed grade. While the Spartan-II family is legacy, this device remains relevant in maintained systems and is widely available through authorized distributors. For new designs, it also serves as an excellent benchmark when evaluating modern FPGA replacements.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.