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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1015C: Xilinx Spartan-II FPGA – Full Specifications, Features & Buying Guide

Product Details

The XC2S200-6FGG1015C is a high-performance, cost-effective Field Programmable Gate Array (FPGA) manufactured by Xilinx (now AMD), part of the renowned Spartan-II family. With 200,000 system gates, a 1015-ball Fine-Pitch BGA (FBGA) package, and a commercial-grade -6 speed rating, this FPGA is engineered to deliver reliable programmable logic performance for a wide range of embedded and digital design applications. Whether you are designing communication systems, industrial control units, or signal processing hardware, the XC2S200-6FGG1015C offers the flexibility and gate density needed to bring your design to life.


What Is the XC2S200-6FGG1015C? Understanding the Part Number

Before diving into specifications, it helps to decode the part number itself:

Code Segment Meaning
XC2S200 Xilinx Spartan-II, 200K system gates
-6 Speed Grade 6 (fastest available; commercial range only)
FGG Fine-Pitch BGA package, Pb-free (RoHS-compliant “G”)
1015 1015-pin ball count
C Commercial temperature range (0°C to +85°C)

The “G” in FGG denotes a Pb-free, RoHS-compliant package — an important distinction for designs targeting environmental compliance standards in the EU and other regulated markets.


XC2S200-6FGG1015C Key Specifications at a Glance

Parameter Value
Manufacturer Xilinx (AMD)
Product Family Spartan-II
Part Number XC2S200-6FGG1015C
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM Bits 75,264
Block RAM Bits 56K
Package Type Fine-Pitch BGA (FGG) – Pb-free
Pin Count 1015
Speed Grade -6 (fastest in family)
Operating Voltage 2.5V (VCCINT)
Temperature Range Commercial (0°C to +85°C)
Technology Node 0.18µm
Configuration Bits 1,335,840

XC2S200-6FGG1015C Core Architecture and Features

Configurable Logic Blocks (CLBs)

The XC2S200 features a 28 × 42 CLB array totaling 1,176 CLBs. Each CLB contains four logic cells organized into two slices, with each slice incorporating two function generators (look-up tables), two storage elements, and carry and control logic. This structure makes the device highly efficient for arithmetic operations, memory addressing, and complex logic functions.

Block RAM and Distributed Memory

One of the key differentiators of the XC2S200 is its generous on-chip memory architecture:

Memory Type Total Capacity
Distributed RAM 75,264 bits
Block RAM 56K bits (56,000 bits)
Total On-Chip Memory ~131K bits

Two columns of dedicated Block RAM are placed symmetrically on opposite sides of the die, providing high-bandwidth, dual-port memory access without consuming CLB resources.

Input/Output Blocks (IOBs)

The XC2S200-6FGG1015C provides up to 284 user-configurable I/O pins, not counting the four dedicated global clock/user input pins. Each IOB supports:

  • Programmable input delay (eliminates hold-time violations)
  • 3.3V PCI-compliant I/O
  • Multiple I/O standards including LVTTL, LVCMOS, PCI, GTL, SSTL, and more
  • Slew rate and drive strength control

Delay-Locked Loops (DLLs)

The device includes four Delay-Locked Loops (DLLs), one at each corner of the die. DLLs enable:

  • Zero-propagation-delay clock distribution
  • Clock phase shifting and frequency synthesis
  • Duty-cycle correction for clock signals

This makes the XC2S200-6FGG1015C especially suited for clocking-intensive applications and high-speed synchronous designs.


Configuration Modes Supported

The XC2S200-6FGG1015C supports multiple configuration modes, providing flexibility in how the device is programmed during system startup:

Configuration Mode CCLK Direction Data Width Serial DOUT
Master Serial Output 1-bit Yes
Slave Serial Input 1-bit Yes
Slave Parallel Input 8-bit No
Boundary-Scan (JTAG) N/A 1-bit No

All I/O drivers remain in a high-impedance state during power-on and throughout the configuration process, ensuring safe operation during system initialization.


Speed Grade -6: Why It Matters

The -6 speed grade is the fastest speed grade available in the Spartan-II family and is exclusively available in the commercial temperature range. A higher speed grade indicates lower propagation delays across logic paths, enabling:

  • Higher maximum operating frequencies
  • Tighter setup and hold time margins
  • Superior performance in time-critical signal paths

For engineers designing high-throughput data pipelines, fast communication interfaces, or real-time processing systems, the -6 grade provides the performance headroom needed to close timing with ease.


XC2S200 Spartan-II Family Comparison

To give context on where the XC2S200 sits within the Spartan-II family:

Device Logic Cells System Gates CLB Array Max User I/O Block RAM
XC2S15 432 15,000 8×12 86 16K
XC2S30 972 30,000 12×18 92 24K
XC2S50 1,728 50,000 16×24 176 32K
XC2S100 2,700 100,000 20×30 176 40K
XC2S150 3,888 150,000 24×36 260 48K
XC2S200 5,292 200,000 28×42 284 56K

The XC2S200 is the largest and most capable device in the Spartan-II family, making it the ideal choice for applications demanding maximum logic capacity within the Spartan-II platform.


XC2S200-6FGG1015C Applications

Thanks to its large gate count, rich I/O complement, and high-speed -6 grade, the XC2S200-6FGG1015C is widely used across several industries:

#### Industrial Automation

Real-time sensor processing, motor control, and machine vision systems benefit from the FPGA’s parallel processing capability and flexible I/O.

#### Telecommunications and Networking

The on-chip DLLs and wide I/O bus support high-speed serial and parallel communication protocols including UART, SPI, I2C, and custom interfaces.

#### Digital Signal Processing (DSP)

The distributed RAM and CLB resources allow efficient implementation of FIR/IIR filters, FFT engines, and digital modulators/demodulators.

#### Embedded Systems and SoC Prototyping

Designers use the XC2S200-6FGG1015C to prototype complex SoC designs, soft-processor implementations (MicroBlaze-compatible), and co-processing accelerators.

#### Test and Measurement

The large I/O count and configurable logic make it ideal for logic analyzers, protocol testing, and hardware emulation platforms.


Why Choose the XC2S200-6FGG1015C Over Mask-Programmed ASICs?

The Spartan-II family, including the XC2S200-6FGG1015C, was designed by Xilinx as a superior alternative to mask-programmed ASICs. Key advantages include:

Factor ASIC XC2S200-6FGG1015C FPGA
NRE Cost Very high None
Design Cycle Months Days to weeks
Field Upgradability Not possible Yes, in-system reprogrammable
Risk High (respin cost) Low (iterate freely)
Volume Flexibility High volume only Any volume

The ability to reprogram the device in the field without hardware replacement makes the XC2S200-6FGG1015C especially valuable in products that require firmware updates or feature additions post-deployment.


Pb-Free and RoHS Compliance

The FGG package designation confirms this is a Pb-free (lead-free) package, making the XC2S200-6FGG1015C compliant with the EU RoHS Directive. This is critical for products sold in the European Union and other markets with strict environmental regulations on hazardous substances in electronic components.


Ordering Information and Availability

When sourcing the XC2S200-6FGG1015C, confirm the following identifiers with your distributor:

Field Value
Full Part Number XC2S200-6FGG1015C
Manufacturer Xilinx / AMD
Package 1015-ball Fine-Pitch BGA (Pb-free)
Speed Grade -6 (Commercial)
Temperature Range 0°C to +85°C
RoHS Status Compliant (Pb-free)

This component may also be sourced through authorized distributors such as Digi-Key, Mouser, and Arrow Electronics. Always verify authenticity when purchasing from the secondary market.


Frequently Asked Questions (FAQ)

Q: What is the difference between XC2S200-6FGG1015C and XC2S200-5FGG1015C?
A: The main difference is the speed grade. The -6 grade offers faster propagation delays and higher operating frequency than the -5 grade, and is available in the commercial temperature range only.

Q: Is the XC2S200-6FGG1015C still in production?
A: The Spartan-II family has reached end-of-life status with Xilinx/AMD. Units are available through authorized distributors and reputable component brokers. Always verify your source.

Q: What software tools does Xilinx support for programming this device?
A: Xilinx ISE Design Suite supports the Spartan-II family for design entry, synthesis, place-and-route, and bitstream generation. Note that Vivado does not support legacy Spartan-II devices.

Q: Can the XC2S200-6FGG1015C be configured via JTAG?
A: Yes. The device supports Boundary-Scan (JTAG) configuration mode, allowing programming through the standard JTAG interface.

Q: What are common replacement or alternative parts?
A: Designers migrating from Spartan-II may consider Xilinx Spartan-3 or Spartan-6 families for newer designs. For drop-in replacements within the same family, review XC2S150-6FGG456C for a lower gate count option.


Conclusion: Is the XC2S200-6FGG1015C Right for Your Design?

The XC2S200-6FGG1015C remains a capable and widely deployed FPGA for embedded, industrial, and communication applications. Its 200K system gates, 284 user I/Os, 56K Block RAM, and -6 speed grade in a 1015-ball Pb-free BGA package make it one of the most feature-rich devices in the Spartan-II lineup. If you are maintaining legacy hardware, prototyping a new digital system, or need a cost-effective programmable logic solution, this device deserves a close look.

For a broader overview of Xilinx programmable logic solutions and to explore the full range of available FPGA families, visit Xilinx FPGA for comprehensive product guides and sourcing support.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.