The XC2S200-6FGG1014C is a high-density, 2.5V Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Built on an advanced 0.18-micron process technology, this device offers 200,000 system gates and 5,292 logic cells — making it a powerful yet cost-effective solution for engineers seeking a programmable alternative to mask-programmed ASICs. Whether you’re designing embedded systems, DSP pipelines, or communications hardware, the XC2S200-6FGG1014C delivers the logic density, I/O count, and reprogrammability that modern designs demand.

For a broader selection of compatible devices, explore our full range of Xilinx FPGA products available for immediate sourcing.

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What Is the XC2S200-6FGG1014C?

The part number breaks down as follows:

This device is part of Xilinx’s Spartan-II family — a generation of FPGAs specifically designed for high-volume, cost-sensitive applications where the flexibility of a programmable device is essential.

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XC2S200-6FGG1014C Key Specifications

Core Logic Resources

Electrical & Process Specifications

Package Information

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XC2S200-6FGG1014C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200 organizes its logic into a 28×42 array of Configurable Logic Blocks. Each CLB contains four logic cells, with each cell pairing a function generator (LUT) with a storage element (flip-flop). This architecture enables efficient implementation of combinational and registered logic, arithmetic functions, and distributed memory — giving designers maximum flexibility per gate.

SelectRAM™ Hierarchical Memory

One of the standout features of the Spartan-II family is its SelectRAM™ memory architecture, which delivers two tiers of on-chip storage:

• Distributed RAM: 75,264 bits derived from LUTs configured as 16-bit-per-LUT RAM.
• Block RAM: 56K bits of dedicated synchronous block RAM, arranged in two columns flanking the CLB core.

This hierarchical approach allows designers to choose the right memory type — distributed for small, fast lookup tables or block RAM for larger FIFOs and data buffers.

Input/Output Blocks (IOBs)

The XC2S200-6FGG1014C provides up to 284 user-configurable I/O pins, each supported by a programmable IOB. Key IOB features include:

• Programmable drive strength
• Slew rate control (fast/slow)
• Optional pull-up, pull-down, or keeper circuits
• Support for multiple I/O standards (LVCMOS, LVTTL, etc.)
• 3-state output enables

Delay-Locked Loops (DLLs)

Four on-chip DLLs — one at each corner of the die — provide robust clock management capabilities, including:

• Zero-delay clock buffering
• Clock frequency synthesis and multiplication
• Phase shifting for timing margin optimization
• Duty cycle correction

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Spartan-II Family Comparison Table

The XC2S200 is the largest and highest-density device in the Spartan-II family, offering the most logic resources, I/O pins, and on-chip memory of any device in the series.

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Speed Grade Comparison for XC2S200

The -6 speed grade is the fastest available for the XC2S200, exclusively offered in the commercial temperature range. It is the optimal choice for applications where maximum clock performance is the primary design requirement.

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Key Features of the XC2S200-6FGG1014C

• 200,000 System Gates — the highest gate count in the Spartan-II family
• 5,292 Logic Cells across a 28×42 CLB array
• -6 Speed Grade offering the fastest propagation delays in the family (up to 263 MHz)
• 284 User I/O Pins with programmable drive strength and standard support
• 75,264 bits of Distributed SelectRAM™ for fast, distributed logic-based storage
• 56K bits of Block RAM organized in dedicated synchronous columns
• 4 Delay-Locked Loops (DLLs) for advanced clock management
• 2.5V Core Voltage using 0.18-micron CMOS process
• FGG1014 Fine-Pitch BGA Package — Pb-free for RoHS compliance
• Commercial Temperature Range (0°C to +85°C)
• Unlimited Reprogrammability via JTAG or serial configuration interface
• Boundary Scan (JTAG IEEE 1149.1) support for in-system testing

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Design Tools & Configuration

Supported EDA Tools

The XC2S200-6FGG1014C is supported by Xilinx’s legacy ISE Design Suite, which provides a complete RTL-to-bitstream design flow including:

• Synthesis (XST or third-party tools)
• Implementation (Map, Place & Route)
• Timing Analysis
• Bitstream Generation

Third-party tools such as Synopsys Design Compiler, Mentor Precision, and Cadence Genus are also compatible for synthesis.

Configuration Modes

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Typical Applications

The XC2S200-6FGG1014C is widely deployed across industries that demand high logic density, programmability, and I/O flexibility:

Communications & Networking

Protocol bridging, line card control, packet processing, and interface glue logic for legacy and modern communication systems.

Industrial Automation

Real-time motor control, sensor fusion, PLC replacement, and factory automation controllers benefit from the device’s high I/O count and deterministic timing.

Test & Measurement Equipment

Arbitrary waveform generation, data acquisition front ends, and automated test equipment (ATE) leverage the FPGA’s reprogrammability for multi-standard support.

Embedded Processing & SoC Prototyping

The XC2S200 can implement soft-core processors (such as PicoBlaze) alongside custom peripherals — making it a proven choice for rapid SoC prototyping.

Signal Processing

With 1,176 CLBs and abundant block RAM, this device efficiently implements FIR filters, FFT engines, and real-time DSP pipelines.

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Ordering Information Decoder

Full Part Number: XC2S200-6FGG1014C

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Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1014C used for?

The XC2S200-6FGG1014C is used in applications requiring programmable logic with high I/O density, including communications hardware, industrial control systems, embedded processing, and signal processing pipelines.

What is the supply voltage for the XC2S200-6FGG1014C?

The device operates on a 2.5V core supply voltage, consistent with all Spartan-II family members.

Is the XC2S200-6FGG1014C RoHS compliant?

Yes. The “G” in the “FGG” package designation indicates a Pb-free (lead-free) package, confirming RoHS compliance.

What is the maximum clock frequency of the XC2S200-6FGG1014C?

With the -6 speed grade, the XC2S200 achieves a maximum system clock frequency of 263 MHz.

What configuration tools are compatible with the XC2S200-6FGG1014C?

The device is compatible with Xilinx ISE Design Suite and supports both JTAG and serial/parallel PROM-based configuration modes.

How many I/O pins does the XC2S200-6FGG1014C have?

The XC2S200 supports up to 284 user I/O pins. The FGG1014 package provides 1,014 total balls, with many dedicated to power and ground planes to ensure signal integrity at high frequencies.

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Summary

The XC2S200-6FGG1014C stands as the most capable device in the Xilinx Spartan-II lineup, combining 200,000 system gates, 284 I/O pins, abundant on-chip memory, and the fastest -6 speed grade in a Pb-free 1014-ball BGA package. Its 0.18-micron process technology and 2.5V operation make it a cost-efficient workhorse for high-density programmable logic applications — offering ASIC-level performance without ASIC-level NRE costs. Backed by JTAG boundary scan, four on-chip DLLs, and a mature ISE tool flow, this FPGA remains a reliable choice for engineers maintaining or extending legacy designs as well as new development on proven, well-documented architecture.