The XC2S200-6FGG1013C is a high-performance, cost-effective Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume commercial applications, this device delivers 200,000 system gates, 5,292 logic cells, and is housed in a 1013-ball Fine Pitch BGA (FBGA) package — making it an ideal choice for engineers seeking a powerful, reconfigurable logic solution without the high NRE costs of a traditional ASIC.

Whether you are designing communication systems, industrial controllers, or digital signal processing (DSP) applications, the XC2S200-6FGG1013C offers the programmability, speed, and I/O density required for demanding embedded designs. For a broader selection of programmable logic solutions, explore our full range of Xilinx FPGA products.

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What Is the XC2S200-6FGG1013C? Understanding the Part Number

Breaking down the part number helps engineers quickly identify key characteristics of this device:

The -6 speed grade is the fastest speed grade offered exclusively in the commercial temperature range for the XC2S200 device. The “G” in FGG denotes the Pb-free (RoHS-compliant) packaging option, an important consideration for modern production environments.

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XC2S200-6FGG1013C Key Features and Benefits

High Gate Count and Logic Density

The XC2S200 sits at the top of the Spartan-II family with 200,000 system gates and a 28 × 42 CLB (Configurable Logic Block) array, providing 1,176 total CLBs. This makes the XC2S200-6FGG1013C suitable for complex, logic-intensive designs that demand density without moving to a more expensive FPGA family.

Fast -6 Speed Grade Performance

The -6 speed grade delivers a maximum internal clock frequency of up to 263 MHz, enabling designers to implement high-speed pipelines, fast state machines, and demanding DSP algorithms within a single programmable device.

Pb-Free Fine Pitch BGA Package

The FGG1013 package provides a large number of available I/O pins in a compact, surface-mount footprint — critical for high-pin-count designs where board space is limited. The Pb-free designation ensures compliance with environmental regulations such as RoHS.

Four Delay-Locked Loops (DLLs)

Spartan-II devices, including the XC2S200, integrate four DLLs (one at each corner of the die). These DLLs allow designers to eliminate clock skew, multiply or divide clock frequencies, and shift clock phase — reducing the need for external clock conditioning components.

Distributed and Block RAM

The XC2S200 provides two types of on-chip memory:

• 75,264 bits of distributed RAM embedded within the CLB array
• 56K bits of block RAM organized in dedicated columns on the die

These dual memory resources give designers flexibility when implementing FIFOs, lookup tables, data buffers, and local storage within the FPGA fabric.

Multiple Configuration Modes

The XC2S200-6FGG1013C supports four configuration modes, offering flexibility for various system-level programming approaches:

JTAG Boundary-Scan Support

Full IEEE 1149.1 JTAG boundary-scan support enables in-system testing, debugging, and configuration — a vital feature for production testing and field maintenance.

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XC2S200-6FGG1013C Electrical and Physical Specifications

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Spartan-II Family Comparison: Where Does the XC2S200 Fit?

The XC2S200 is the largest and most capable device in the Spartan-II lineup. The table below shows how it compares to other family members:

The XC2S200-6FGG1013C offers the highest logic density, the most I/O pins, and the largest memory resources within the Spartan-II family — making it the top choice when maximum capacity is required.

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XC2S200-6FGG1013C Architecture Overview

Configurable Logic Blocks (CLBs)

Each CLB in the Spartan-II architecture contains four logic cells, each with a 4-input Look-Up Table (LUT), flip-flop, and carry logic. The 1,176 CLBs in the XC2S200 can be used to implement combinational logic, sequential logic, and distributed memory simultaneously.

Input/Output Blocks (IOBs)

The 284 user-configurable IOBs support a wide range of I/O standards, including LVTTL, LVCMOS33, LVCMOS25, GTL, GTL+, SSTL2, SSTL3, AGP, and CTT. Each IOB includes input and output flip-flops, a 3-state output buffer, and optional pull-up/pull-down resistors.

Routing Hierarchy

A versatile multi-level routing architecture connects CLBs, IOBs, and block RAM. Local, long, and global routing resources minimize signal delays and support high fan-out nets with minimal skew.

Block RAM Architecture

Two columns of dedicated block RAM are placed symmetrically on the die. Each 4K-bit block RAM can be configured as a simple dual-port memory operating in various aspect ratios (4K×1, 2K×2, 1K×4, 512×8, 256×16).

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Typical Applications for the XC2S200-6FGG1013C

The XC2S200-6FGG1013C is designed for commercial-grade, high-volume applications where programmability, speed, and density are critical. Common use cases include:

• Telecommunications & Networking – Line cards, protocol bridges, packet processing
• Digital Signal Processing (DSP) – FIR/IIR filters, FFT engines, audio processing
• Industrial Automation – Motor control, PLCs, sensor interfacing
• Consumer Electronics – Video processing, display controllers, set-top box logic
• Embedded Systems – Co-processor acceleration, custom bus interfaces
• Test & Measurement – Data acquisition, pattern generation, logic analysis

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XC2S200-6FGG1013C vs. ASIC: Why Choose FPGA?

The XC2S200-6FGG1013C eliminates ASIC NRE costs and lengthy development cycles while delivering the performance required for most commercial digital design applications. Its in-system reprogrammability means design changes and feature updates can be deployed in the field with no hardware replacement.

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Development Tools and Design Support

Xilinx supports the Spartan-II family with its ISE Design Suite (the primary toolchain for this legacy device). Key tools include:

• ISE Project Navigator – HDL synthesis, implementation, and bitstream generation
• CORE Generator – IP core instantiation for common functions (FIFOs, memory controllers, DSP blocks)
• ChipScope Pro – In-system logic analysis via JTAG
• XPOWER Estimator – Power analysis and optimization

Hardware support is available via Xilinx’s JTAG-compatible download cables (Parallel Cable IV, Platform Cable USB) for configuration and debugging.

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Ordering Information and Part Number Decoding

Note: The -6 speed grade is exclusively available in the Commercial temperature range. For industrial temperature range (-40°C to +85°C), the -5 speed grade (or lower) is required. Always verify the temperature and speed grade requirements of your application before ordering.

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Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1013C used for?

The XC2S200-6FGG1013C is used in commercial-grade digital design applications including telecommunications, DSP, industrial control, and embedded systems. It is valued for its high gate count, fast -6 speed grade, and large I/O capacity.

What is the core voltage for the XC2S200?

The XC2S200 requires a 2.5V core supply (VCCINT). I/O banks are powered separately via VCCO, which can be 3.3V or 2.5V depending on the I/O standard used.

Is the XC2S200-6FGG1013C RoHS compliant?

Yes. The “G” in the FGG package designation indicates Pb-free, RoHS-compliant packaging.

What is the maximum operating frequency of the XC2S200-6FGG1013C?

At the -6 speed grade, the XC2S200 supports internal clock frequencies up to 263 MHz.

Can the XC2S200 be reconfigured in-system?

Yes. Like all Spartan-II devices, the XC2S200-6FGG1013C supports in-system reconfiguration via JTAG boundary-scan or serial/parallel configuration modes — no hardware replacement required.

What are the alternatives to the XC2S200-6FGG1013C?

Depending on your requirements, consider the XC2S150 (lower density), XC3S200 (Spartan-3, newer generation with improved performance), or higher-density Spartan-3/6 devices for newer designs.

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Summary

The XC2S200-6FGG1013C is the flagship device of Xilinx’s Spartan-II FPGA family, offering 200,000 system gates, 5,292 logic cells, 284 user I/Os, and the fastest available -6 speed grade in a Pb-free 1013-ball BGA package. It is purpose-built for cost-sensitive, high-volume commercial applications requiring robust programmable logic performance without the overhead of ASIC development.

Its combination of distributed RAM, block RAM, four DLLs, flexible I/O standards, and multiple configuration modes makes the XC2S200-6FGG1013C a versatile and reliable choice for engineers across telecommunications, industrial automation, DSP, and embedded system design.