The XC2S200-6FGG1012C is a high-density, cost-effective Field Programmable Gate Array (FPGA) manufactured by Xilinx (now AMD). It belongs to the Spartan-II family and is engineered for high-volume commercial applications where performance, flexibility, and low power consumption matter most. Whether you are an engineer sourcing components for embedded systems, communications hardware, or industrial control boards, the XC2S200-6FGG1012C delivers the logic density and speed you need at a competitive price point.

For a broader selection of programmable logic devices, visit our Xilinx FPGA catalog.

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What Is the XC2S200-6FGG1012C?

The XC2S200-6FGG1012C is a 200,000 system gate FPGA from the Xilinx Spartan-II family, housed in a 1012-ball Fine Pitch Ball Grid Array (FBGA) package. The “-6” in the part number designates the speed grade, indicating the fastest commercially available speed variant within the Spartan-II lineup. The “C” suffix confirms the commercial temperature range (0°C to +85°C).

This device operates on a 2.5V core supply voltage and is fabricated using 0.18µm process technology, delivering an outstanding balance of gate density, clock speed, and power efficiency for its era and application class.

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XC2S200-6FGG1012C Key Specifications at a Glance

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XC2S200-6FGG1012C Package Information

The FGG1012 package is a Fine Pitch Ball Grid Array featuring 1,012 solder balls. This large-format BGA package provides engineers with a significantly expanded I/O capacity compared to smaller Spartan-II package options, making it ideal for complex, multi-interface designs.

Note: The FGG1012 package shares the same 284 user I/O count as the FGG456, but offers enhanced board-level flexibility and improved thermal dissipation for demanding designs.

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Spartan-II Family Comparison: Where Does the XC2S200 Stand?

The XC2S200 is the largest and most capable device in the Spartan-II family. The table below shows how it compares to its siblings:

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Detailed Features of the XC2S200-6FGG1012C

## Logic Architecture

The XC2S200-6FGG1012C is built around a matrix of Configurable Logic Blocks (CLBs), each containing four slices. Every slice includes two Look-Up Tables (LUTs), two flip-flops, and dedicated carry logic. This architecture enables efficient implementation of both combinational and sequential logic circuits.

## Memory Resources

Memory is a critical resource in FPGA design, and the XC2S200 does not disappoint. It offers:

• 75,264 bits of distributed RAM – embedded within the CLB LUTs for small, fast data storage
• 56K bits (56,000 bits) of dedicated Block RAM – organized in two columns of dual-port 4K×1 block RAM modules on opposite sides of the die

These dual-port block RAMs support simultaneous read and write operations, making them ideal for FIFOs, lookup tables, and data buffering applications.

## Clock Management: Delay-Locked Loops (DLLs)

The XC2S200-6FGG1012C integrates four Delay-Locked Loops (DLLs), one at each corner of the die. The DLLs provide:

• Zero-delay clock buffering
• Clock multiplication and division
• Fine-grained phase shifting
• Elimination of clock skew across the device

This robust clock management infrastructure is essential for high-speed synchronous designs.

## Input/Output Blocks (IOBs)

The device supports up to 284 user-programmable I/O pins (not including four dedicated global clock/user input pins). Each IOB features:

• Programmable input delay
• Optional output slew rate control
• Pull-up and pull-down resistors
• 3-state output capability
• Support for multiple I/O standards (LVTTL, LVCMOS, PCI, GTL+, and more)

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Configuration Modes

The XC2S200-6FGG1012C supports multiple configuration modes to suit various system designs:

The device stores 1,335,840 configuration bits and can be reconfigured in the field — a key advantage over mask-programmed ASICs.

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Part Number Decoder: Understanding XC2S200-6FGG1012C

Understanding the Xilinx part numbering convention helps engineers quickly interpret device characteristics:

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XC2S200-6FGG1012C Speed Grade Comparison

The Spartan-II XC2S200 is available in two speed grades. The -6 grade offers the highest performance:

Important: The -6 speed grade is exclusively available in the commercial temperature range and is not offered in the industrial variant.

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Typical Applications for the XC2S200-6FGG1012C

The XC2S200-6FGG1012C is well-suited for a wide range of embedded and digital system applications:

• Communications & Networking – Protocol bridging, data serialization, Ethernet PHY interfaces
• Industrial Automation – Motor control logic, sensor data processing, PLC functions
• Consumer Electronics – Display controllers, video processing pipelines
• Test & Measurement Equipment – Data acquisition, signal conditioning
• Embedded Processing – Soft-core processor implementations (e.g., PicoBlaze)
• ASIC Prototyping – Hardware emulation before tape-out
• Automotive Systems – Legacy designs within commercial temperature range

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XC2S200-6FGG1012C vs. Competing FPGAs

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Ordering Information & Availability

When sourcing the XC2S200-6FGG1012C, it is important to confirm authenticity and supply chain integrity. Key details for purchasing:

⚠️ Note: The XC2S200-6FGG1012C is classified as Not Recommended for New Designs (NRND). For new product development, consider migrating to the Xilinx Spartan-6 family, which offers superior logic density, lower power consumption, and modern toolchain support.

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Design Tools & Software Support

The XC2S200-6FGG1012C is fully supported by the following Xilinx design tools:

• ISE Design Suite – The primary tool for Spartan-II development, covering synthesis, implementation, and bitstream generation
• ISE WebPACK – Free downloadable version supporting Spartan-II devices
• ChipScope Pro – In-system debugging and logic analysis
• CORE Generator – Parameterized IP core generation

For modern FPGA development with newer families, AMD/Xilinx offers the Vivado Design Suite, though Vivado does not support the Spartan-II family.

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Frequently Asked Questions (FAQ)

#### What does the “G” in FGG1012 mean?

The second “G” in FGG indicates that the device is packaged in a Pb-Free (lead-free) BGA package. Standard (non-Pb-free) packaging would be listed as “FG.”

#### Is the XC2S200-6FGG1012C RoHS compliant?

The Pb-Free FGG package meets RoHS requirements. However, always verify with your supplier for the most current compliance documentation.

#### Can the XC2S200-6FGG1012C be used in industrial temperature applications?

No. The -6 speed grade is only available in the commercial temperature range (0°C to +85°C). For industrial temperature requirements (-40°C to +85°C), the -5 speed grade in the industrial variant should be selected.

#### What is the configuration file size for the XC2S200?

The XC2S200 requires 1,335,840 configuration bits to fully program the device.

#### What are the recommended replacements for new designs?

Xilinx recommends transitioning to the Spartan-3, Spartan-3E, or Spartan-6 families for new designs, as these offer improved performance, lower power, and continued toolchain support.

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Summary: Why Choose the XC2S200-6FGG1012C?

The XC2S200-6FGG1012C remains a proven, reliable FPGA for legacy system maintenance, repair, and redesign projects. With 200,000 system gates, 284 user I/O pins, 56K bits of block RAM, and the fastest -6 speed grade in a generous 1012-ball BGA package, it delivers solid performance for commercial-grade embedded and communications applications. Its support for multiple configuration modes and four onboard DLLs make it a versatile solution for a variety of digital design challenges.

For engineers maintaining existing Spartan-II based hardware or exploring the full range of programmable logic options, explore our complete Xilinx FPGA product lineup.