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XC2S200-6FGG1011C: Xilinx Spartan-II FPGA Complete Specifications & Datasheet Guide

Product Details

The XC2S200-6FGG1011C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. With 200,000 system gates, 5,292 logic cells, and a 1011-ball Fine-Pitch Ball Grid Array (FGG) package, this device delivers robust programmable logic capability at a cost-effective price point. Whether you are maintaining legacy systems, prototyping digital designs, or sourcing replacement components, the XC2S200-6FGG1011C remains a reliable choice in the Spartan-II lineup.

For a broader overview of Xilinx programmable logic solutions, visit Xilinx FPGA.


What Is the XC2S200-6FGG1011C?

The XC2S200-6FGG1011C is a member of the Xilinx Spartan-II FPGA family, originally developed as a cost-optimized alternative to mask-programmed ASICs. The part number breaks down as follows:

Part Number Segment Meaning
XC2S200 Spartan-II device with 200K system gates
-6 Speed grade 6 (fastest available, commercial range only)
FGG Fine-Pitch Ball Grid Array (BGA) package type
1011 Number of package pins/balls (1011-ball BGA)
C Commercial temperature range (0°C to +85°C)

This combination makes the XC2S200-6FGG1011C the highest pin-count package variant of the XC2S200, offering maximum I/O flexibility for complex PCB designs.


XC2S200-6FGG1011C Key Specifications

Core Device Parameters

Parameter Value
Device Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56K bits (56,000 bits)
Technology Node 0.18 µm
Core Voltage (VCCINT) 2.5V
Speed Grade -6
Max System Clock 200+ MHz (up to 263 MHz internal)

Package Information

Parameter Value
Package Type FGG (Fine-Pitch Ball Grid Array)
Pin Count 1011 balls
Temperature Range Commercial (0°C to +85°C)
RoHS Status Non-RoHS Compliant (standard)
Configuration File Size 1,335,840 bits

XC2S200-6FGG1011C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1011C contains 1,176 Configurable Logic Blocks arranged in a 28×42 matrix. Each CLB includes two slices, and each slice contains two 4-input Look-Up Tables (LUTs) that can be used either as logic elements or as 16-bit distributed RAM. This flexible structure allows engineers to implement complex combinational and sequential logic efficiently.

SelectRAM Hierarchical Memory

One of the standout features of the XC2S200-6FGG1011C is its dual-layer memory architecture known as SelectRAM:

Memory Type Capacity Location
Distributed RAM 75,264 bits Embedded in CLB LUTs
Block RAM 56,000 bits (56K) Dedicated columns beside CLBs

Block RAM supports true dual-port operation at full speed, making it ideal for FIFOs, data buffers, and lookup tables in high-throughput designs.

Input/Output Blocks (IOBs)

The XC2S200-6FGG1011C supports 284 maximum user I/Os across its 1011-ball package. Each IOB features:

  • Registered input, output, and three-state paths
  • Support for 16 selectable I/O standards
  • Programmable pull-up and pull-down resistors
  • Optional slew-rate control for reduced signal noise

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops (DLLs) — one at each corner of the die — enable precise clock management. The DLLs provide:

  • Zero clock skew distribution across the device
  • Clock frequency synthesis (multiply and divide)
  • Phase shifting for interface timing alignment

Supported I/O Standards

The XC2S200-6FGG1011C supports a wide range of industry-standard I/O voltage levels, making it highly interoperable with external components:

I/O Standard Type
LVTTL Single-ended
LVCMOS2 Single-ended
PCI (3.3V) Single-ended
GTL Single-ended open-drain
GTL+ Single-ended open-drain
SSTL2 Class I & II Stub Series Terminated Logic
HSTL Class I, II, III, IV High-Speed Transceiver Logic
CTT Center-Tap Terminated
AGP Accelerated Graphics Port

Configuration Modes

The XC2S200-6FGG1011C supports five standard configuration modes, giving designers flexibility in how the device is programmed at system startup:

Configuration Mode CCLK Direction Data Width Notes
Master Serial Output 1-bit Standard serial PROM
Slave Serial Input 1-bit Daisy-chain capable
Slave Parallel (SelectMAP) Input 8-bit Fast parallel loading
Boundary-Scan (JTAG) N/A 1-bit IEEE 1149.1 compliant

XC2S200 Spartan-II Family Comparison

The table below shows how the XC2S200 compares to other members of the Spartan-II family, helping you select the right device for your application:

Device Logic Cells System Gates CLB Array Max User I/O Distributed RAM Block RAM
XC2S15 432 15,000 8×12 86 6,144 bits 16K
XC2S30 972 30,000 12×18 92 13,824 bits 24K
XC2S50 1,728 50,000 16×24 176 24,576 bits 32K
XC2S100 2,700 100,000 20×30 176 38,400 bits 40K
XC2S150 3,888 150,000 24×36 260 55,296 bits 48K
XC2S200 5,292 200,000 28×42 284 75,264 bits 56K

The XC2S200 is the largest and most capable device in the Spartan-II family, and the FGG1011 package provides access to the maximum 284 user I/Os.


XC2S200-6FGG1011C vs Other XC2S200 Package Variants

The XC2S200 is available in multiple packages. The FGG1011 is the largest, offering the highest I/O count:

Part Number Package Pin Count Max User I/O
XC2S200-6PQ208C PQFP 208 140
XC2S200-6FG256C FBGA 256 176
XC2S200-6FG456C FBGA 456 176
XC2S200-6FGG1011C Fine-Pitch BGA 1011 284

If your design requires the maximum number of I/O pins from the XC2S200, the XC2S200-6FGG1011C is the only variant that delivers the full 284-pin I/O capacity.


Design Tools for the XC2S200-6FGG1011C

The XC2S200-6FGG1011C is supported by the Xilinx ISE Design Suite (Integrated Software Environment). Since the Spartan-II family predates the Vivado era, designers must use ISE for synthesis, implementation, and bitstream generation.

Tool Version Recommended Purpose
Xilinx ISE 14.7 (final release) Synthesis, Place & Route, Bitstream
ModelSim Any ISE-compatible RTL and gate-level simulation
ChipScope Pro Bundled with ISE In-system logic analysis
IMPACT Bundled with ISE Device programming via JTAG

Note: Xilinx Vivado does not support Spartan-II devices. ISE 14.7 remains freely available from AMD Xilinx for legacy design support.


Common Applications of the XC2S200-6FGG1011C

Thanks to its large gate count, generous I/O capacity, and on-chip memory resources, the XC2S200-6FGG1011C is used across a wide range of applications:

Digital Signal Processing (DSP)

The combination of distributed RAM, block RAM, and high CLB density makes this FPGA well-suited for implementing FIR filters, FFT engines, and other real-time DSP functions.

Industrial Control Systems

Legacy industrial systems and PLCs often rely on Spartan-II FPGAs for their proven reliability. The commercial temperature grade (-6 speed) suits controlled indoor environments, while the 284-pin I/O count accommodates complex sensor and actuator interfaces.

Communications & Networking

With support for HSTL and SSTL I/O standards and DLL-based clock management, the XC2S200-6FGG1011C handles high-speed serial and parallel data interfaces common in telecom line cards and networking switches.

Prototyping & ASIC Emulation

As Xilinx designed the Spartan-II as a direct ASIC alternative, the XC2S200-6FGG1011C is ideal for prototyping complex digital circuits before committing to an ASIC production run.

Test & Measurement Equipment

Scientific instruments and automated test equipment (ATE) benefit from the flexible I/O standards and reprogrammable nature of the XC2S200-6FGG1011C.


Ordering Information & Availability

The XC2S200-6FGG1011C is an obsolete/legacy product — it is no longer in active production by AMD Xilinx. However, it remains available through authorized independent distributors and excess inventory channels.

Attribute Detail
Manufacturer AMD Xilinx (formerly Xilinx, Inc.)
Part Number XC2S200-6FGG1011C
Product Status Obsolete / Legacy / Not Recommended for New Designs
Lead-Free Option XC2S200-6FGG1011G (Pb-free variant)
Datasheet Spartan-II DS001 (available at AMD documentation portal)

When sourcing obsolete components like the XC2S200-6FGG1011C, always purchase from reputable distributors to ensure authenticity and avoid counterfeit parts.


Frequently Asked Questions (FAQ)

What does the -6 speed grade mean on the XC2S200-6FGG1011C?

The -6 speed grade is the fastest speed grade available for the XC2S200. It is exclusively available in the commercial temperature range (0°C to +85°C). A higher speed grade number means faster propagation delays and higher maximum operating frequency.

Is the XC2S200-6FGG1011C RoHS compliant?

The standard XC2S200-6FGG1011C (ending in C) is not RoHS compliant. For RoHS-compliant (lead-free) versions, look for the XC2S200-6FGG1011GC variant, which includes a “G” in the ordering code to denote Pb-free packaging.

Can I use Vivado to program the XC2S200-6FGG1011C?

No. Xilinx Vivado does not support Spartan-II devices. You must use the Xilinx ISE 14.7 design suite for all synthesis, implementation, and programming operations on the XC2S200-6FGG1011C.

What is the configuration file size for the XC2S200?

The XC2S200 requires a configuration bitstream of 1,335,840 bits (~167 KB).

What are the best alternatives to the XC2S200-6FGG1011C?

If the XC2S200-6FGG1011C is unavailable, consider these modern alternatives:

  • XC3S200 – Spartan-3 family, 200K gates, lower power, available new
  • XC3S400 – Spartan-3, higher gate count, better I/O density
  • XC6SLX9 – Spartan-6, much higher performance, actively supported in ISE and partial Vivado flow

Summary

The XC2S200-6FGG1011C is the flagship package of Xilinx’s Spartan-II FPGA series, delivering 200,000 system gates, 5,292 logic cells, 284 user I/Os, and 56K bits of block RAM in a 1011-ball fine-pitch BGA package. While classified as a legacy component not recommended for new designs, it continues to serve critical roles in legacy system maintenance, ASIC prototyping, and industrial applications. Its -6 speed grade ensures maximum performance within the Spartan-II architecture, and its wide I/O standard support makes it versatile across diverse system requirements.

For more information on Xilinx programmable logic devices and the full Spartan FPGA lineup, explore the complete Xilinx FPGA portfolio.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.