The XC2S200-6FGG1009C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Featuring 200,000 system gates, a -6 speed grade, and housed in a 1009-pin Fine-Pitch Ball Grid Array (FBGA) package, this device is engineered to deliver robust reconfigurable logic for embedded systems, telecommunications, industrial automation, and signal processing applications. As an AMD/Xilinx product, the XC2S200-6FGG1009C offers engineers a cost-effective, ASIC-alternative solution without sacrificing logic density or I/O flexibility.
For a broader overview of the Spartan family lineup, visit Xilinx FPGA.
What Is the XC2S200-6FGG1009C? Understanding the Part Number
Breaking down the part number helps engineers quickly decode the device’s capabilities:
| Part Number Segment |
Meaning |
| XC2S |
Xilinx Spartan-II FPGA family |
| 200 |
200,000 system gate equivalent |
| -6 |
Speed grade -6 (fastest commercial grade) |
| FGG |
Fine-Pitch Ball Grid Array (FBGA) package type |
| 1009 |
1009 total pin count |
| C |
Commercial temperature range (0°C to +85°C) |
The -6 speed grade is the fastest available in the XC2S200 family and is exclusively offered in the Commercial temperature range, making the XC2S200-6FGG1009C ideal for high-speed digital applications operating within standard commercial environments.
XC2S200-6FGG1009C Key Specifications
Core Logic Resources
| Parameter |
Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array Size |
28 × 42 |
| Total CLBs |
1,176 |
| Flip-Flops |
5,292 |
| Maximum Distributed RAM (bits) |
75,264 |
Memory Resources
| Parameter |
Value |
| Block RAM (bits) |
57,344 |
| Block RAM Blocks |
14 |
| Block RAM per Block (bits) |
4,096 |
Performance & Electrical Characteristics
| Parameter |
Value |
| Speed Grade |
-6 (fastest) |
| Maximum System Frequency |
263 MHz |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
1.5V – 3.3V (multi-standard) |
| Process Technology |
0.18µm CMOS |
| Logic Levels |
2.5V |
Package & Physical Details
| Parameter |
Value |
| Package Type |
Fine-Pitch BGA (FBGA / FGG) |
| Total Pin Count |
1,009 |
| Temperature Range |
Commercial: 0°C to +85°C |
| RoHS Compliance |
Refer to distributor listing |
| Manufacturer |
Xilinx (AMD) |
| Part Status |
Not Recommended for New Designs (NRND) |
XC2S200-6FGG1009C Architecture Overview
Configurable Logic Blocks (CLBs)
The Spartan-II CLB is the fundamental programmable logic unit of the XC2S200-6FGG1009C. Each CLB contains four Logic Cells (LCs), and every logic cell consists of a 4-input Look-Up Table (LUT), a D-type flip-flop, and dedicated carry logic. The 28×42 CLB array totaling 1,176 blocks allows designers to implement complex combinational and sequential logic with high efficiency and minimal routing congestion.
Block RAM (BRAM)
The XC2S200-6FGG1009C integrates 14 block RAM modules, each providing 4,096 bits of dual-port synchronous memory, totaling 57,344 bits of on-chip storage. This embedded memory supports true dual-port access and can be configured in various width-by-depth combinations, making it ideal for FIFOs, look-up tables, and data buffers.
Digital Clock Manager (DCM)
The device includes Delay-Locked Loops (DLLs) for precise clock management. These allow zero clock-skew distribution, frequency synthesis, and phase shifting, which are critical for high-speed synchronous designs.
I/O Blocks (IOBs)
The XC2S200-6FGG1009C supports a wide range of programmable I/O standards, giving designers flexibility to interface with various external logic families and peripherals.
Supported I/O Standards
| I/O Standard |
Description |
| LVTTL |
Low-Voltage TTL (3.3V) |
| LVCMOS33 |
Low-Voltage CMOS 3.3V |
| LVCMOS25 |
Low-Voltage CMOS 2.5V |
| LVCMOS18 |
Low-Voltage CMOS 1.8V |
| LVCMOS15 |
Low-Voltage CMOS 1.5V |
| PCI |
3.3V PCI bus standard |
| SSTL2 / SSTL3 |
Stub Series Terminated Logic |
| GTL / GTLP |
Gunning Transceiver Logic |
| HSTL |
High-Speed Transceiver Logic |
This multi-standard I/O capability makes the XC2S200-6FGG1009C highly compatible across modern system designs.
Configuration Modes
The XC2S200-6FGG1009C supports multiple configuration modes, offering design flexibility for various system integration scenarios:
| Configuration Mode |
CCLK Direction |
Data Width |
DOUT Available |
| Master Serial |
Output |
1-bit |
Yes |
| Slave Serial |
Input |
1-bit |
Yes |
| Slave Parallel (SelectMAP) |
Input |
8-bit |
No |
| Boundary-Scan (JTAG) |
N/A |
1-bit |
No |
Configuration data is stored externally and loaded into the FPGA at power-up or on demand, allowing for in-field reprogramming — a key advantage over mask-programmed ASICs.
XC2S200-6FGG1009C Applications
The combination of 200K system gates, high-speed -6 grade performance, abundant I/O pins, and the large 1009-pin package makes the XC2S200-6FGG1009C well-suited for demanding applications across multiple industries:
Communications & Networking
High-speed serial and parallel data processing, protocol bridging (UART, SPI, I2C, PCI), and network packet filtering benefit from the device’s 263MHz maximum clock frequency and flexible I/O standards.
Industrial Automation & Control
Motor control, PLC replacement, sensor data acquisition, and real-time feedback loops are ideal use cases. The FPGA’s deterministic timing and reconfigurability provide an edge over traditional microcontrollers.
Signal Processing & DSP
Distributed RAM and block RAM resources enable the implementation of FIR filters, FFT engines, and real-time audio/video signal chains without external memory bottlenecks.
Medical & Imaging Systems
Reliable low-latency logic makes the XC2S200-6FGG1009C suitable for diagnostic imaging pipelines, patient monitoring interfaces, and medical device controllers.
Embedded Systems & SoC Prototyping
Engineers use Spartan-II devices to prototype ASIC designs or implement soft-core processors (e.g., PicoBlaze) for cost-sensitive embedded platforms.
XC2S200-6FGG1009C vs. Similar Spartan-II Variants
| Part Number |
Gates |
I/O Pins |
Package |
Speed Grade |
| XC2S200-6FG256C |
200K |
176 |
256-ball FBGA |
-6 |
| XC2S200-6FGG456C |
200K |
284 |
456-ball FBGA |
-6 |
| XC2S200-6FGG1009C |
200K |
High |
1009-ball FBGA |
-6 |
| XC2S200-5FGG456C |
200K |
284 |
456-ball FBGA |
-5 |
| XC2S150-6FG456C |
150K |
260 |
456-ball FBGA |
-6 |
The FGG1009 package variant offers the highest I/O pin count within the XC2S200 product line, making it the preferred choice when maximum connectivity is required.
Design Tools & Software Support
Xilinx Spartan-II FPGAs are supported by the following EDA toolchains:
| Tool |
Vendor |
Notes |
| ISE Design Suite |
AMD/Xilinx |
Primary tool for Spartan-II; supports synthesis, place & route |
| ModelSim |
Mentor/Siemens |
HDL simulation |
| Synplify Pro |
Synopsys |
RTL synthesis |
| ChipScope Pro |
Xilinx |
On-chip logic analysis |
| VHDL / Verilog |
IEEE Standard |
Supported HDL languages |
Note: The XC2S200-6FGG1009C is not supported by Vivado (Vivado requires 28nm and newer devices). Designers should use Xilinx ISE 14.7 — the last version with Spartan-II support.
Ordering Information & Availability
| Field |
Detail |
| Manufacturer Part Number |
XC2S200-6FGG1009C |
| Manufacturer |
Xilinx, Inc. (now AMD) |
| Product Family |
Spartan-II |
| Product Category |
FPGAs – Field Programmable Gate Arrays |
| Lifecycle Status |
Not Recommended for New Designs (NRND) |
| Replacement Suggestion |
Xilinx Spartan-3, Spartan-6, or equivalent |
Because the XC2S200-6FGG1009C is an NRND (Not Recommended for New Designs) part, it is primarily available through authorized component brokers and distributors with excess inventory. Lead times and pricing can vary significantly — always request a formal quote from verified suppliers.
Frequently Asked Questions (FAQ)
What does the “6” in XC2S200-6FGG1009C mean?
The -6 designates the speed grade. In the Spartan-II family, -6 is the fastest available commercial speed grade, supporting system frequencies up to 263 MHz. It is only available in the commercial temperature range (0°C to +85°C).
What is the core operating voltage of the XC2S200-6FGG1009C?
The device operates at a core voltage (VCCINT) of 2.5V. I/O banks can be powered independently at voltages ranging from 1.5V to 3.3V depending on the target I/O standard.
Is the XC2S200-6FGG1009C still in production?
No. This part carries NRND (Not Recommended for New Designs) status. It remains available through secondary market distributors, but engineers starting new projects should evaluate the Spartan-6 or newer families.
What configuration memory does the XC2S200-6FGG1009C use?
The device is volatile SRAM-based and requires external configuration on every power cycle. Commonly used configuration devices include the Xilinx XCF Platform Flash PROM series.
Can I use Vivado to program the XC2S200-6FGG1009C?
No. Vivado does not support Spartan-II devices. Use Xilinx ISE Design Suite 14.7, which is freely available for download and provides full support for this device.
Summary
The XC2S200-6FGG1009C is a proven, high-density Xilinx Spartan-II FPGA delivering 200,000 system gates, 5,292 logic cells, 57,344 bits of block RAM, and the fastest -6 speed grade in a large 1009-pin FBGA package. While designated NRND for new designs, it continues to serve legacy system maintenance, spare-part supply chains, and existing production lines effectively. Engineers requiring maximum I/O connectivity within the XC2S200 silicon will find the FGG1009 package uniquely positioned for high pin-count applications.
For engineers exploring the full range of Xilinx programmable logic options, Xilinx FPGA offers comprehensive product resources and sourcing support.
