Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XC2S200-6FGG1006C: Xilinx Spartan-II FPGA – Full Specifications & Buying Guide

Product Details

The XC2S200-6FGG1006C is a high-density field-programmable gate array (FPGA) from the Xilinx Spartan-II family, designed for high-volume applications that demand a versatile, cost-effective programmable logic solution. With 200,000 system gates, a 1006-pin Fine-Pitch BGA (FBGA) package, and operating at 2.5V, this device is an ideal alternative to mask-programmed ASICs — offering field upgradability, rapid development cycles, and proven 0.18μm technology.

Whether you’re an engineer sourcing components for embedded systems, communications equipment, or industrial designs, this guide covers everything you need to know about the XC2S200-6FGG1006C.


What Is the XC2S200-6FGG1006C?

The XC2S200-6FGG1006C is part of Xilinx’s Spartan-II FPGA family, a product line engineered to deliver ASIC-like performance at programmable logic cost points. The part number breaks down as follows:

Part Number Segment Meaning
XC2S200 Spartan-II device with 200K system gates
-6 Speed grade 6 (fastest commercial grade)
FGG Fine-Pitch Ball Grid Array (FBGA) package type
1006 1006 total pins
C Commercial temperature range (0°C to +85°C)

This makes it one of the largest package variants in the XC2S200 lineup, providing a maximum number of available I/O pins for complex, multi-interface designs. For a broader selection of Xilinx programmable logic devices, visit Xilinx FPGA.


XC2S200-6FGG1006C Key Specifications

Core Device Specifications

Parameter Value
Manufacturer Xilinx (now AMD)
Product Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42 (1,176 CLBs)
Maximum Distributed RAM 75,264 bits
Block RAM 56 Kbits (14 × 4,096-bit blocks)
User I/O Pins 284
Total Package Pins 1,006
Package Type 1006-Pin FBGA (Fine-Pitch BGA)
Process Technology 0.18μm
Core Voltage 2.5V
Speed Grade -6 (Commercial, fastest available)
Temperature Range 0°C to +85°C (Commercial)
Configuration Bits 1,335,840
Delay-Locked Loops (DLLs) 4

XC2S200-6FGG1006C Architecture Overview

Configurable Logic Blocks (CLBs)

The Spartan-II architecture is built around a regular, flexible array of Configurable Logic Blocks (CLBs). The XC2S200 features a 28×42 array of CLBs, delivering 1,176 total CLBs. Each CLB contains four logic cells — each with a 4-input look-up table (LUT), a storage element (flip-flop), and dedicated carry logic.

Input/Output Blocks (IOBs)

Surrounding the CLB array is a perimeter of programmable Input/Output Blocks (IOBs). The XC2S200-6FGG1006C provides 284 user I/O pins, supporting a wide variety of single-ended and differential I/O standards.

Supported I/O Standards

I/O Standard Type
LVTTL Single-Ended
LVCMOS2 Single-Ended
PCI (3.3V, 66 MHz) Single-Ended
GTL / GTL+ Single-Ended
HSTL (Class I, III) Single-Ended
SSTL2 (Class I, II) Single-Ended
SSTL3 (Class I, II) Single-Ended
AGP Single-Ended

Block RAM

The XC2S200 contains 56 Kbits of block RAM organized as 14 fully synchronous, dual-port 4,096-bit RAM blocks. Each block RAM features independent control signals for each port, and the data width of each port can be configured independently.

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops (DLLs) — one at each corner of the die — provide clock deskewing, frequency synthesis, and phase shifting. The DLL can eliminate clock distribution delay and synchronize the internal clock to an external reference, enabling zero-skew designs.


XC2S200-6FGG1006C Configuration Modes

The XC2S200-6FGG1006C supports four standard configuration modes. Configuration data is stored externally (in a PROM or other non-volatile storage) and loaded at power-up.

Configuration Mode Pre-Config Pull-ups CCLK Direction Data Width Serial DOUT
Master Serial No Output 1-bit Yes
Slave Serial Yes Input 1-bit Yes
Slave Parallel Yes Input 8-bit No
Boundary-Scan (JTAG) Yes N/A 1-bit No

Speed and Timing Performance

The -6 speed grade is the fastest commercial grade available for the XC2S200, making it optimal for timing-critical designs. The -6 grade is exclusively available in the commercial temperature range (0°C to +85°C).

Performance Parameter Value
Maximum System Frequency Up to 200+ MHz (design-dependent)
Internal Clock Speed 263 MHz (maximum)
Speed Grade -6 (Fastest Commercial)
Temperature Grade Commercial (0°C to +85°C)

XC2S200-6FGG1006C vs. Other XC2S200 Package Variants

Xilinx offers the XC2S200 in multiple package options. The FGG1006 is the largest, enabling the full 284 user I/Os.

Part Number Package Total Pins User I/Os
XC2S200-6FG256C FBGA 256 140
XC2S200-6PQ208C PQFP 208 140
XC2S200-6FGG456C FBGA 456 176
XC2S200-6FGG1006C FBGA 1,006 284

The FGG1006 package is the optimal choice when your design requires the maximum user I/O count of 284 pins.


Typical Applications for the XC2S200-6FGG1006C

The Spartan-II XC2S200-6FGG1006C is widely deployed across industries requiring flexible, high-I/O programmable logic:

  • Telecommunications equipment — line cards, protocol bridging, SONET/SDH framing
  • Embedded processing systems — coprocessing, bus bridging, glue logic elimination
  • Industrial control — motor control interfaces, sensor fusion, real-time control planes
  • Networking and switching — packet processing, crossbar switching, traffic management
  • Test and measurement — signal capture, pattern generation, logic analysis
  • Consumer electronics — high-volume products requiring rapid time-to-market
  • Military and aerospace legacy designs — long lifecycle component in existing systems

Why Choose the XC2S200-6FGG1006C Over a Custom ASIC?

Feature XC2S200-6FGG1006C (FPGA) Mask-Programmed ASIC
NRE (Non-Recurring Engineering) Cost None Very High
Development Time Weeks Months to Years
Field Upgradability Yes — in-system reprogrammable No
Prototype Risk Very Low Very High
Volume Cost Moderate Low (at very high volumes)
Design Change Flexibility Unlimited iterations Respin required (costly)

The XC2S200-6FGG1006C gives engineering teams the freedom to iterate, upgrade, and ship without the economic burden of ASIC tape-out costs.


Development Tools & Design Support

Xilinx ISE Design Suite

The XC2S200-6FGG1006C is fully supported by the Xilinx ISE Design Suite (the appropriate legacy toolchain for Spartan-II devices). ISE provides:

  • HDL synthesis (VHDL / Verilog)
  • Place-and-route for Spartan-II architecture
  • Timing analysis and simulation
  • Configuration file (bitstream) generation

Boundary-Scan (JTAG) Support

The device includes full IEEE 1149.1 JTAG boundary-scan support, enabling in-circuit testing, configuration, and debugging via standard JTAG interfaces.


Ordering Information & RoHS Status

Parameter Details
Manufacturer Xilinx, Inc. (AMD)
Part Number XC2S200-6FGG1006C
RoHS Compliance Not RoHS Compliant (Standard Packaging)
Pb-Free Alternative XC2S200-6FGG1006G (Pb-free version)
Temperature Range Commercial: 0°C to +85°C
Package 1006-Pin Fine-Pitch BGA

Note: The “G” suffix in the part number (e.g., XC2S200-6FGG1006GC) denotes the Pb-free (RoHS-compliant) version. For new designs requiring RoHS compliance, specify the “G” variant.


Frequently Asked Questions (FAQ)

What does the -6 speed grade mean for the XC2S200-6FGG1006C?

The -6 speed grade is the fastest speed grade available for the XC2S200 in the commercial temperature range. It indicates tighter timing parameters (shorter propagation delays), allowing the device to operate at higher clock frequencies compared to -5 grade devices.

Is the XC2S200-6FGG1006C still in production?

The Spartan-II family has been declared end-of-life (EOL) by Xilinx/AMD. The XC2S200-6FGG1006C is available through authorized distributors and component brokers from existing inventory. Engineers sourcing this part for legacy system maintenance should verify stock availability and consider last-time-buy orders.

What is the maximum I/O count of the XC2S200-6FGG1006C?

In the FGG1006 package, the XC2S200-6FGG1006C provides 284 user I/O pins (not including 4 dedicated global clock inputs), making it the highest I/O variant of the XC2S200.

Can the XC2S200-6FGG1006C be reprogrammed in the field?

Yes. Like all Xilinx Spartan-II FPGAs, the XC2S200-6FGG1006C is SRAM-based and fully reprogrammable in the field. Configuration data is loaded from external non-volatile storage (PROM or flash) at power-up, and designs can be updated without hardware replacement.

What I/O voltage standards does the XC2S200-6FGG1006C support?

The device supports a wide range of standards including LVTTL, LVCMOS2, PCI (3.3V), GTL/GTL+, HSTL (Class I and III), SSTL2 (Class I and II), SSTL3 (Class I and II), and AGP.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.