The XC2S200-6FGG1004C is a high-performance, cost-effective Field-Programmable Gate Array (FPGA) manufactured by Xilinx (now AMD). Part of the industry-proven Spartan-II family, this device delivers 200,000 system gates in a robust 1004-ball Fine Pitch BGA (FBGA) package, making it an ideal programmable logic solution for high-volume embedded, communications, and industrial applications.

If you are sourcing or evaluating Xilinx Spartan-II FPGAs, explore the full range of options at Xilinx FPGA.

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What Is the XC2S200-6FGG1004C?

The XC2S200-6FGG1004C is a 2.5V programmable gate array from Xilinx’s Spartan-II family. It is designed as a cost-efficient alternative to mask-programmed ASICs, offering in-field reconfigurability without hardware replacement. The part number breaks down as follows:

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XC2S200-6FGG1004C Key Specifications

General Device Parameters

Package & Physical Specifications

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XC2S200-6FGG1004C Architecture & Internal Structure

CLB (Configurable Logic Block) Architecture

The Spartan-II XC2S200 is built around a 28×42 array of Configurable Logic Blocks (CLBs). Each CLB contains:

• Two Slices, each with two 4-input Look-Up Tables (LUTs)
• Dedicated fast-carry logic for arithmetic operations
• Flip-flops for synchronous design
• Distributed RAM capability within each LUT

This architecture enables efficient implementation of both combinational and sequential logic.

Block RAM

The XC2S200 includes 56K bits of Block RAM organized in two columns on opposite sides of the die. Block RAM supports:

• True dual-port access
• Configurable data widths
• Synchronous read and write operations

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops (DLLs) — one at each corner of the die — provide:

• Clock deskewing and duty-cycle correction
• Frequency synthesis (multiplication and division)
• Phase shifting for timing-critical designs

Input/Output Blocks (IOBs)

The XC2S200-6FGG1004C offers up to 284 user I/O pins (plus 4 dedicated global clock inputs). The IOBs support multiple I/O standards for broad system compatibility.

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Supported I/O Standards

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Configuration Modes

The XC2S200-6FGG1004C supports four configuration modes, providing flexible system integration options:

Note: During power-on and throughout configuration, all I/O drivers are held in a high-impedance state.

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XC2S200 Spartan-II Family Comparison

The XC2S200 is the largest device in the Spartan-II family. Here’s how it compares to other family members:

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Why Choose the XC2S200-6FGG1004C?

#### Cost-Effective Alternative to ASICs

The Spartan-II family was specifically engineered as a cost-competitive replacement for mask-programmed ASICs. Unlike ASICs, the XC2S200-6FGG1004C eliminates high NRE (non-recurring engineering) costs, long design cycles, and redesign risk. Design changes can be deployed in the field simply by reprogramming the device.

#### High Speed Grade (-6)

The -6 speed grade is the fastest available in the Spartan-II series, making the XC2S200-6FGG1004C suitable for performance-critical applications. Note that the -6 speed grade is exclusively available in the Commercial temperature range.

#### Large 1004-Ball FBGA Package

The FGG1004 package (Fine Pitch Ball Grid Array, Pb-Free, 1004 pins) provides a high I/O density in a compact footprint, ideal for space-constrained PCB designs with many signal connections.

#### RoHS-Compliant (Pb-Free)

The “G” in the package designation (FGG) confirms this is a Pb-free, RoHS-compliant package, meeting modern environmental manufacturing standards.

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Typical Applications of the XC2S200-6FGG1004C

The XC2S200-6FGG1004C is widely used in:

• Digital Signal Processing (DSP): Filters, FFT engines, and data converters
• Communications: Protocol bridging, line cards, network interface controllers
• Industrial Control: Motor control, PLC logic, sensor interfaces
• Consumer Electronics: Video processing, display controllers
• Embedded Systems: Custom CPU/peripheral interfaces, co-processing
• Test & Measurement Equipment: Pattern generation, data acquisition

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Development Tools & Design Flow

Xilinx (AMD) supports the Spartan-II family through mature toolchains:

Tip: While newer AMD Xilinx tools like Vivado do not support the legacy Spartan-II family, the ISE Design Suite remains the recommended tool for XC2S200 design and programming.

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Ordering Information & Part Number Decoder

Use the table below to decode Xilinx Spartan-II ordering codes:

Full Part Number: XC2S200-6FGG1004C

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XC2S200-6FGG1004C vs. Similar Xilinx FPGAs

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Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1004C used for?

The XC2S200-6FGG1004C is used in applications requiring programmable logic with high I/O count, such as communications equipment, industrial control systems, digital signal processing, and embedded computing.

Is the XC2S200-6FGG1004C still in production?

The Spartan-II family has been discontinued for new designs by Xilinx (PDN2004-01). However, the XC2S200-6FGG1004C remains available through authorized distributors and excess inventory channels for legacy system maintenance and repair.

What is the difference between FGG and FG packages?

The FGG package designation includes the “G” which indicates a Pb-Free (RoHS-compliant) package. The standard FG package uses traditional tin-lead solder balls. Both are electrically identical.

What programming voltage does the XC2S200-6FGG1004C require?

The device operates on a 2.5V core voltage (VCCINT). I/O voltage (VCCO) can vary depending on the I/O standard used (1.5V to 3.3V).

Can the XC2S200-6FGG1004C be used in industrial temperature applications?

No. The -6 speed grade is exclusively available in the Commercial temperature range (0°C to +85°C). For industrial temperature range (-40°C to +85°C), use the -4 or -5 speed grades.