Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1000C: High-Performance Spartan-II FPGA for Advanced Digital Design

Product Details

The XC2S200-6FGG1000C is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-II family, delivering exceptional performance and flexibility for complex digital logic applications. This industrial-grade FPGA combines 200,000 system gates with superior speed characteristics, making it an ideal choice for telecommunications, industrial automation, and embedded systems development.

Overview of XC2S200-6FGG1000C FPGA Technology

The XC2S200-6FGG1000C represents Xilinx’s commitment to cost-effective programmable logic solutions. As part of the Spartan-II family, this FPGA offers a superior alternative to traditional ASICs while avoiding lengthy development cycles and high initial costs. The device features a fine-pitch ball grid array (FGG) package with 1000 balls, providing extensive I/O capabilities and excellent thermal performance for demanding applications.

Key Features of XC2S200 Spartan-II FPGA

Feature Specification
Logic Cells 5,292 programmable logic cells
System Gates 200,000 gates (logic and RAM)
CLB Array 28 x 42 (1,176 total CLBs)
Distributed RAM 75,264 bits
Block RAM 56K bits total memory
Maximum User I/O 284 available I/O pins
Speed Grade -6 (highest performance commercial grade)
Operating Voltage 2.5V core voltage
Package Type FGG1000 – 1000-ball Fine-pitch BGA
Temperature Range Commercial (0°C to +85°C)

Technical Specifications: XC2S200-6FGG1000C Architecture

Core Performance Capabilities

The XC2S200-6FGG1000C FPGA delivers robust processing power through its advanced architecture. With 5,292 logic cells organized in a 28 x 42 configurable logic block (CLB) array, this device provides substantial resources for implementing complex digital designs. The -6 speed grade ensures maximum performance, supporting system frequencies up to 200 MHz in typical applications.

Memory Configuration Table

Memory Type Capacity Application
Distributed RAM 75,264 bits Small, fast memory structures
Block RAM 56K bits Larger data storage, FIFOs, buffers
Total Memory 131,264 bits Combined storage capacity

I/O and Connectivity Features

The FGG1000 package configuration offers exceptional connectivity options with 284 maximum available user I/O pins. This extensive I/O count enables complex interface requirements, supporting multiple communication protocols and high-speed data transmission. The fine-pitch ball grid array ensures reliable signal integrity and optimized board routing.

XC2S200-6FGG1000C Applications and Use Cases

Industrial and Commercial Applications

The XC2S200-6FGG1000C FPGA excels in various demanding applications:

  • Telecommunications Equipment: Protocol converters, digital signal processing, network interface cards
  • Industrial Control Systems: PLC replacement, motor control, sensor interfacing
  • Consumer Electronics: Video/audio processing, display controllers, set-top boxes
  • Automotive Systems: Dashboard controls, infotainment systems, sensor fusion
  • Medical Devices: Diagnostic equipment, imaging systems, patient monitoring
  • Test and Measurement: Logic analyzers, oscilloscopes, data acquisition systems

Programming and Development: XC2S200 FPGA Design Tools

Compatible Design Software

Engineers can develop Xilinx FPGA projects using industry-standard design tools. The XC2S200-6FGG1000C is fully supported by Xilinx ISE Design Suite, offering:

  • Schematic and HDL-based design entry (VHDL, Verilog)
  • Comprehensive synthesis and implementation tools
  • Timing analysis and constraint management
  • Bitstream generation and device programming
  • Simulation and verification capabilities

Configuration and Programming Options

Configuration Method Description Typical Use
JTAG Boundary Scan Industry-standard programming interface Development and debugging
Master Serial Mode Direct configuration from serial PROM Production deployment
Slave Serial Mode Configuration via external controller System integration
SelectMAP Parallel configuration interface Fast reconfiguration

XC2S200-6FGG1000C Package Information

Physical Characteristics

The FGG1000 package provides a compact, high-density solution optimized for complex designs requiring extensive I/O capabilities. The fine-pitch ball grid array configuration ensures:

  • Superior electrical performance with reduced inductance
  • Excellent thermal dissipation characteristics
  • Compact footprint for space-constrained applications
  • Reliable solder ball connections for manufacturing
  • RoHS compliant lead-free construction (indicated by “FGG” designation)

Power Requirements

Power Parameter Typical Value Maximum Value
Core Voltage (VCCINT) 2.5V ± 5% 2.5V
I/O Voltage (VCCO) 1.8V – 3.3V Varies by bank
Static Power Application dependent Design specific
Dynamic Power Frequency/utilization dependent See datasheet

Why Choose XC2S200-6FGG1000C for Your Design?

Advantages Over Traditional ASICs

The XC2S200-6FGG1000C FPGA offers compelling advantages for modern electronic designs:

  1. No NRE Costs: Eliminate expensive mask sets and fabrication setup fees
  2. Rapid Prototyping: Implement and test designs in hours instead of months
  3. Field Upgradability: Update functionality without hardware changes
  4. Risk Reduction: Modify designs post-deployment to fix bugs or add features
  5. Lower Volume Economics: Cost-effective for production runs from 1 to 100,000+ units

Performance Comparison Table

Feature XC2S200-6FGG1000C XC2S150 XC2S100
Logic Cells 5,292 3,888 2,700
System Gates 200,000 150,000 100,000
Total CLBs 1,176 864 600
Block RAM 56K bits 48K bits 40K bits
Max User I/O 284 260 176

Ordering Information and Availability

Part Number Breakdown: XC2S200-6FGG1000C

Understanding the Xilinx part numbering system:

  • XC2S200: Device family and gate count (Spartan-II, 200K gates)
  • -6: Speed grade (commercial, highest performance)
  • FGG: Package type (Fine-pitch Ball Grid Array, lead-free)
  • 1000: Pin count (1000-ball package)
  • C: Temperature range (Commercial: 0°C to +85°C)

Temperature Grades Available

Grade Temperature Range Typical Applications
C (Commercial) 0°C to +85°C Standard electronics, consumer products
I (Industrial) -40°C to +100°C Automotive, industrial automation

Design Considerations for XC2S200-6FGG1000C Implementation

Best Practices for FPGA Development

When implementing designs with the XC2S200-6FGG1000C, consider these engineering guidelines:

  • Power Distribution: Implement proper decoupling with multiple capacitors per power pin
  • Clock Management: Utilize the four on-chip Delay-Locked Loops (DLLs) for clock distribution
  • I/O Standards: Select appropriate I/O voltage standards for interface compatibility
  • Thermal Management: Ensure adequate airflow or heatsinking for high-utilization designs
  • Signal Integrity: Follow PCB layout guidelines for high-speed differential pairs

XC2S200 FPGA Family Comparison

Spartan-II Family Members Overview

Device Logic Cells System Gates CLB Array Max I/O Block RAM
XC2S15 432 15,000 8 x 12 86 16K
XC2S30 972 30,000 12 x 18 92 24K
XC2S50 1,728 50,000 16 x 24 176 32K
XC2S100 2,700 100,000 20 x 30 176 40K
XC2S150 3,888 150,000 24 x 36 260 48K
XC2S200 5,292 200,000 28 x 42 284 56K

Frequently Asked Questions About XC2S200-6FGG1000C

Is the XC2S200-6FGG1000C still available?

While the Spartan-II family is considered mature technology, the XC2S200 devices remain available through authorized distributors and specialty electronics suppliers for legacy system support and cost-sensitive applications.

What development tools support the XC2S200-6FGG1000C?

The primary development environment is Xilinx ISE Design Suite (versions supporting Spartan-II). Third-party synthesis tools from Synopsys and Mentor Graphics also support this device family.

Can the XC2S200-6FGG1000C be used in new designs?

While newer FPGA families offer more features and better performance-per-watt, the XC2S200-6FGG1000C remains suitable for cost-sensitive applications, legacy system upgrades, and educational purposes where proven, reliable technology is preferred.

Conclusion: XC2S200-6FGG1000C for Reliable FPGA Solutions

The XC2S200-6FGG1000C field-programmable gate array delivers a proven combination of performance, flexibility, and cost-effectiveness. With 200,000 system gates, 284 I/O pins, and the fastest -6 speed grade, this Spartan-II FPGA continues to serve engineers seeking reliable programmable logic solutions for industrial, telecommunications, and embedded applications.

Whether you’re maintaining existing systems, developing cost-optimized products, or learning FPGA design principles, the XC2S200-6FGG1000C provides the resources and performance needed for successful implementation. Its mature ecosystem, extensive documentation, and proven track record make it a dependable choice for mission-critical applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.