The XC2S200-6FGG1000C is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-II family, delivering exceptional performance and flexibility for complex digital logic applications. This industrial-grade FPGA combines 200,000 system gates with superior speed characteristics, making it an ideal choice for telecommunications, industrial automation, and embedded systems development.
Overview of XC2S200-6FGG1000C FPGA Technology
The XC2S200-6FGG1000C represents Xilinx’s commitment to cost-effective programmable logic solutions. As part of the Spartan-II family, this FPGA offers a superior alternative to traditional ASICs while avoiding lengthy development cycles and high initial costs. The device features a fine-pitch ball grid array (FGG) package with 1000 balls, providing extensive I/O capabilities and excellent thermal performance for demanding applications.
Key Features of XC2S200 Spartan-II FPGA
| Feature |
Specification |
| Logic Cells |
5,292 programmable logic cells |
| System Gates |
200,000 gates (logic and RAM) |
| CLB Array |
28 x 42 (1,176 total CLBs) |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits total memory |
| Maximum User I/O |
284 available I/O pins |
| Speed Grade |
-6 (highest performance commercial grade) |
| Operating Voltage |
2.5V core voltage |
| Package Type |
FGG1000 – 1000-ball Fine-pitch BGA |
| Temperature Range |
Commercial (0°C to +85°C) |
Technical Specifications: XC2S200-6FGG1000C Architecture
Core Performance Capabilities
The XC2S200-6FGG1000C FPGA delivers robust processing power through its advanced architecture. With 5,292 logic cells organized in a 28 x 42 configurable logic block (CLB) array, this device provides substantial resources for implementing complex digital designs. The -6 speed grade ensures maximum performance, supporting system frequencies up to 200 MHz in typical applications.
Memory Configuration Table
| Memory Type |
Capacity |
Application |
| Distributed RAM |
75,264 bits |
Small, fast memory structures |
| Block RAM |
56K bits |
Larger data storage, FIFOs, buffers |
| Total Memory |
131,264 bits |
Combined storage capacity |
I/O and Connectivity Features
The FGG1000 package configuration offers exceptional connectivity options with 284 maximum available user I/O pins. This extensive I/O count enables complex interface requirements, supporting multiple communication protocols and high-speed data transmission. The fine-pitch ball grid array ensures reliable signal integrity and optimized board routing.
XC2S200-6FGG1000C Applications and Use Cases
Industrial and Commercial Applications
The XC2S200-6FGG1000C FPGA excels in various demanding applications:
- Telecommunications Equipment: Protocol converters, digital signal processing, network interface cards
- Industrial Control Systems: PLC replacement, motor control, sensor interfacing
- Consumer Electronics: Video/audio processing, display controllers, set-top boxes
- Automotive Systems: Dashboard controls, infotainment systems, sensor fusion
- Medical Devices: Diagnostic equipment, imaging systems, patient monitoring
- Test and Measurement: Logic analyzers, oscilloscopes, data acquisition systems
Programming and Development: XC2S200 FPGA Design Tools
Compatible Design Software
Engineers can develop Xilinx FPGA projects using industry-standard design tools. The XC2S200-6FGG1000C is fully supported by Xilinx ISE Design Suite, offering:
- Schematic and HDL-based design entry (VHDL, Verilog)
- Comprehensive synthesis and implementation tools
- Timing analysis and constraint management
- Bitstream generation and device programming
- Simulation and verification capabilities
Configuration and Programming Options
| Configuration Method |
Description |
Typical Use |
| JTAG Boundary Scan |
Industry-standard programming interface |
Development and debugging |
| Master Serial Mode |
Direct configuration from serial PROM |
Production deployment |
| Slave Serial Mode |
Configuration via external controller |
System integration |
| SelectMAP |
Parallel configuration interface |
Fast reconfiguration |
XC2S200-6FGG1000C Package Information
Physical Characteristics
The FGG1000 package provides a compact, high-density solution optimized for complex designs requiring extensive I/O capabilities. The fine-pitch ball grid array configuration ensures:
- Superior electrical performance with reduced inductance
- Excellent thermal dissipation characteristics
- Compact footprint for space-constrained applications
- Reliable solder ball connections for manufacturing
- RoHS compliant lead-free construction (indicated by “FGG” designation)
Power Requirements
| Power Parameter |
Typical Value |
Maximum Value |
| Core Voltage (VCCINT) |
2.5V ± 5% |
2.5V |
| I/O Voltage (VCCO) |
1.8V – 3.3V |
Varies by bank |
| Static Power |
Application dependent |
Design specific |
| Dynamic Power |
Frequency/utilization dependent |
See datasheet |
Why Choose XC2S200-6FGG1000C for Your Design?
Advantages Over Traditional ASICs
The XC2S200-6FGG1000C FPGA offers compelling advantages for modern electronic designs:
- No NRE Costs: Eliminate expensive mask sets and fabrication setup fees
- Rapid Prototyping: Implement and test designs in hours instead of months
- Field Upgradability: Update functionality without hardware changes
- Risk Reduction: Modify designs post-deployment to fix bugs or add features
- Lower Volume Economics: Cost-effective for production runs from 1 to 100,000+ units
Performance Comparison Table
| Feature |
XC2S200-6FGG1000C |
XC2S150 |
XC2S100 |
| Logic Cells |
5,292 |
3,888 |
2,700 |
| System Gates |
200,000 |
150,000 |
100,000 |
| Total CLBs |
1,176 |
864 |
600 |
| Block RAM |
56K bits |
48K bits |
40K bits |
| Max User I/O |
284 |
260 |
176 |
Ordering Information and Availability
Part Number Breakdown: XC2S200-6FGG1000C
Understanding the Xilinx part numbering system:
- XC2S200: Device family and gate count (Spartan-II, 200K gates)
- -6: Speed grade (commercial, highest performance)
- FGG: Package type (Fine-pitch Ball Grid Array, lead-free)
- 1000: Pin count (1000-ball package)
- C: Temperature range (Commercial: 0°C to +85°C)
Temperature Grades Available
| Grade |
Temperature Range |
Typical Applications |
| C (Commercial) |
0°C to +85°C |
Standard electronics, consumer products |
| I (Industrial) |
-40°C to +100°C |
Automotive, industrial automation |
Design Considerations for XC2S200-6FGG1000C Implementation
Best Practices for FPGA Development
When implementing designs with the XC2S200-6FGG1000C, consider these engineering guidelines:
- Power Distribution: Implement proper decoupling with multiple capacitors per power pin
- Clock Management: Utilize the four on-chip Delay-Locked Loops (DLLs) for clock distribution
- I/O Standards: Select appropriate I/O voltage standards for interface compatibility
- Thermal Management: Ensure adequate airflow or heatsinking for high-utilization designs
- Signal Integrity: Follow PCB layout guidelines for high-speed differential pairs
XC2S200 FPGA Family Comparison
Spartan-II Family Members Overview
| Device |
Logic Cells |
System Gates |
CLB Array |
Max I/O |
Block RAM |
| XC2S15 |
432 |
15,000 |
8 x 12 |
86 |
16K |
| XC2S30 |
972 |
30,000 |
12 x 18 |
92 |
24K |
| XC2S50 |
1,728 |
50,000 |
16 x 24 |
176 |
32K |
| XC2S100 |
2,700 |
100,000 |
20 x 30 |
176 |
40K |
| XC2S150 |
3,888 |
150,000 |
24 x 36 |
260 |
48K |
| XC2S200 |
5,292 |
200,000 |
28 x 42 |
284 |
56K |
Frequently Asked Questions About XC2S200-6FGG1000C
Is the XC2S200-6FGG1000C still available?
While the Spartan-II family is considered mature technology, the XC2S200 devices remain available through authorized distributors and specialty electronics suppliers for legacy system support and cost-sensitive applications.
What development tools support the XC2S200-6FGG1000C?
The primary development environment is Xilinx ISE Design Suite (versions supporting Spartan-II). Third-party synthesis tools from Synopsys and Mentor Graphics also support this device family.
Can the XC2S200-6FGG1000C be used in new designs?
While newer FPGA families offer more features and better performance-per-watt, the XC2S200-6FGG1000C remains suitable for cost-sensitive applications, legacy system upgrades, and educational purposes where proven, reliable technology is preferred.
Conclusion: XC2S200-6FGG1000C for Reliable FPGA Solutions
The XC2S200-6FGG1000C field-programmable gate array delivers a proven combination of performance, flexibility, and cost-effectiveness. With 200,000 system gates, 284 I/O pins, and the fastest -6 speed grade, this Spartan-II FPGA continues to serve engineers seeking reliable programmable logic solutions for industrial, telecommunications, and embedded applications.
Whether you’re maintaining existing systems, developing cost-optimized products, or learning FPGA design principles, the XC2S200-6FGG1000C provides the resources and performance needed for successful implementation. Its mature ecosystem, extensive documentation, and proven track record make it a dependable choice for mission-critical applications.