Overview of XC2S150E-6FTG256I Field Programmable Gate Array
The XC2S150E-6FTG256I is a powerful Field Programmable Gate Array (FPGA) from AMD’s (formerly Xilinx) renowned Spartan-IIE family. This advanced programmable logic device delivers exceptional performance with 150,000 system gates, making it an ideal solution for diverse embedded applications including industrial automation, telecommunications, and digital signal processing systems.
As a member of the Spartan-IIE series, the XC2S150E-6FTG256I combines high-density logic resources with cost-effective implementation, offering engineers a versatile platform for complex digital designs. The device features a compact 256-pin Fine-Pitch Ball Grid Array (FTBGA) package, optimizing board space while maintaining robust performance characteristics.
Key Technical Specifications
Core Performance Parameters
| Specification |
Value |
| System Gates |
150,000 gates |
| Logic Cells |
3,888 configurable logic cells |
| Block RAM |
72 Kbits |
| Maximum User I/O |
182 pins |
| Distributed RAM |
49,152 bits |
| Speed Grade |
-6 (Industrial temperature range) |
| Maximum Operating Frequency |
357 MHz |
| Package Type |
256-pin FTBGA (Fine-Pitch Ball Grid Array) |
| Core Voltage |
1.8V |
| I/O Voltage Standards |
2.5V / 3.3V compatible |
| Technology Node |
0.15μm process |
Package and Environmental Specifications
| Parameter |
Details |
| Package Designation |
FTG256 |
| Total Pin Count |
256 pins |
| Operating Temperature Range |
Industrial (-40°C to +100°C) |
| RoHS Compliance |
Lead-free, RoHS compliant |
| Moisture Sensitivity Level |
MSL 3 |
| Package Dimensions |
17mm x 17mm (typical) |
Advanced Features and Capabilities
Configurable Logic Architecture
The XC2S150E-6FTG256I incorporates AMD’s proven CLB (Configurable Logic Block) architecture, providing designers with maximum flexibility. Each logic cell can be programmed to implement combinatorial or sequential logic functions, enabling efficient implementation of complex digital designs.
Memory Resources
This Xilinx FPGA offers dual memory architecture:
- Block RAM: 72 Kbits of dedicated block RAM for efficient data storage
- Distributed RAM: 49,152 bits spread across logic cells for flexible memory implementation
- Supports synchronous and asynchronous memory operations
I/O Capabilities
With 182 user-configurable I/O pins, the XC2S150E-6FTG256I supports multiple voltage standards and offers:
- LVTTL, LVCMOS compatibility (3.3V, 2.5V, 1.8V)
- PCI 33MHz and 66MHz compliance
- GTL, GTL+, HSTL support
- Programmable slew rate control
- Individual pin tristate capability
Clock Management
The device features four Digital Delay Locked Loops (DLLs) providing:
- Clock de-skewing
- Frequency synthesis and division
- Phase shifting capabilities
- Improved clock distribution across the device
Application Areas
Industrial Automation and Control
The XC2S150E-6FTG256I excels in industrial environments where reliability and performance are critical:
- Motor control systems
- Factory automation controllers
- Process control interfaces
- Industrial networking equipment
- PLC (Programmable Logic Controller) implementations
Telecommunications Infrastructure
Telecommunications applications benefit from the device’s high-speed capabilities:
- Base station controllers
- Digital signal processing modules
- Protocol converters
- Network interface cards
- Broadband access equipment
Embedded Computing Systems
Perfect for embedded applications requiring customizable logic:
- Custom peripheral controllers
- High-speed data acquisition systems
- Image processing units
- Cryptographic accelerators
- Real-time control systems
Consumer Electronics
Consumer applications leveraging FPGA flexibility:
- Digital video processing
- Audio/video transcoding
- Gaming console peripherals
- Smart home automation hubs
- Connected IoT devices
Design and Development Support
Compatible Design Tools
| Tool Category |
Compatible Software |
| Design Entry |
Vivado Design Suite, ISE Design Suite |
| Simulation |
ModelSim, Vivado Simulator |
| Synthesis |
Xilinx Synthesis Technology (XST) |
| Programming |
iMPACT, Vivado Hardware Manager |
| Language Support |
VHDL, Verilog, SystemVerilog |
Configuration Options
The XC2S150E-6FTG256I supports multiple configuration modes:
- Master Serial mode
- Slave Serial mode
- JTAG boundary-scan programming
- SelectMAP parallel configuration
- Flash-based boot loading
Electrical Characteristics
Power Consumption
| Operating Mode |
Typical Power |
| Static Power |
Low leakage design |
| Dynamic Power |
Dependent on design utilization |
| I/O Power |
Varies with voltage standard |
| Recommended Core Supply |
1.8V ± 5% |
Absolute Maximum Ratings
- Core supply voltage: -0.5V to +2.5V
- I/O supply voltage: -0.5V to +4.0V
- Storage temperature: -65°C to +150°C
- Junction temperature: 125°C maximum
Quality and Reliability
Manufacturing Standards
The XC2S150E-6FTG256I is manufactured following stringent quality protocols:
- ISO 9001 certified production facilities
- Full electrical and functional testing
- RoHS and REACH compliant materials
- Conflict-free sourcing standards
Reliability Metrics
| Parameter |
Specification |
| MTBF |
>1,000,000 hours at 55°C |
| Package Reliability |
Complies with JEDEC standards |
| ESD Protection |
HBM Class 1C (>2000V) |
| Latch-up Immunity |
>100mA per JESD78 |
Ordering Information and Package Marking
Part Number Breakdown
XC2S150E-6FTG256I decodes as:
- XC2S = Spartan-IIE family
- 150E = 150,000 system gates, extended features
- -6 = Speed grade (industrial temperature)
- FTG256 = Fine-pitch BGA, 256 pins
- I = Industrial temperature range (-40°C to +100°C)
Package Options and Variants
| Part Number |
Package |
Temperature Range |
Status |
| XC2S150E-6FTG256I |
256-FTBGA |
Industrial |
Available |
| XC2S150E-6FTG256C |
256-FTBGA |
Commercial |
Available |
| XC2S150E-6PQG208I |
208-PQFP |
Industrial |
Available |
| XC2S150E-6FGG256I |
256-FBGA |
Industrial |
Available |
Pin Configuration and Pinout
Functional Pin Groups
| Pin Group |
Quantity |
Function |
| User I/O |
182 |
Configurable input/output pins |
| Dedicated Input |
4 |
Global clock inputs |
| Power Supply (VCCINT) |
Multiple |
1.8V core power |
| Power Supply (VCCIO) |
Multiple |
I/O bank power supplies |
| Ground (GND) |
Multiple |
Ground connections |
| Configuration |
Several |
JTAG and configuration pins |
I/O Banking Structure
The device organizes I/O pins into 8 separate banks, each supporting independent voltage standards for maximum flexibility in mixed-voltage system designs.
PCB Design Considerations
Layout Recommendations
When designing PCBs with the XC2S150E-6FTG256I:
- Use minimum 0.5mm pitch for BGA footprint
- Implement proper power plane partitioning
- Ensure adequate decoupling capacitors (0.1µF and 10µF recommended)
- Route high-speed signals with controlled impedance
- Maintain thermal relief for ground connections
Thermal Management
- Typical junction-to-ambient thermal resistance: θJA = 25°C/W (with airflow)
- Consider heatsink for designs exceeding 70% logic utilization
- Maintain adequate PCB copper coverage for heat dissipation
- Use thermal vias for improved heat transfer
Competitive Advantages
Why Choose XC2S150E-6FTG256I?
- Cost-Effective Performance: Delivers excellent price-to-performance ratio for mid-density applications
- Proven Reliability: Decades of field deployment across industries
- Extensive Ecosystem: Comprehensive development tools and IP library support
- Flexible I/O: Supports 16 different I/O standards for versatile system integration
- Low Power Design: Optimized architecture minimizes power consumption
- Wide Availability: Multiple package options for different design requirements
Programming and Configuration
Configuration Memory Size
- Configuration bitstream size: approximately 1.87 Mbits
- Configuration time (slave serial @ 10MHz): ~187ms
- Supports partial reconfiguration for dynamic function updates
Security Features
- Bitstream encryption support
- Readback protection capabilities
- Design security through configuration locking
Support and Documentation
Available Resources
Engineers working with the XC2S150E-6FTG256I have access to:
- Comprehensive datasheets (DS077)
- User guides and application notes
- Reference designs and IP cores
- Technical support forums
- PCB design files and footprints
- IBIS models for signal integrity analysis
Frequently Asked Questions
Q: Is the XC2S150E-6FTG256I suitable for automotive applications? A: While the industrial temperature range (-40°C to +100°C) supports automotive environments, designers should verify compliance with specific automotive standards (AEC-Q100) for critical applications.
Q: What is the difference between -6 and -7 speed grades? A: The -6 speed grade offers industrial temperature range operation, while -7 typically indicates commercial temperature range with slightly different timing characteristics.
Q: Can this FPGA be used in safety-critical systems? A: The device can be incorporated into safety systems with proper design practices, redundancy, and validation procedures as required by industry standards.
Q: What development boards are compatible? A: Several third-party development boards support Spartan-IIE devices, including evaluation kits from AMD and authorized partners.
Conclusion
The XC2S150E-6FTG256I represents a robust, cost-effective FPGA solution for engineers requiring reliable programmable logic in industrial and embedded applications. With its comprehensive feature set, proven architecture, and extensive development tool support, this device continues to serve as a dependable choice for diverse digital design requirements.
Whether you’re developing industrial control systems, telecommunications infrastructure, or custom embedded solutions, the XC2S150E-6FTG256I delivers the performance, flexibility, and reliability needed for successful product deployment.
For more information about Xilinx FPGA products and technical support, consult the manufacturer’s official documentation and authorized distributors.
