Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S100E-6FT256I: High-Performance Spartan-IIE FPGA for Industrial Applications

Product Details

Overview of XC2S100E-6FT256I FPGA

The XC2S100E-6FT256I is a powerful Field-Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Spartan-IIE family, designed to deliver exceptional performance for industrial-grade applications. This advanced programmable logic device combines 100,000 system gates with low-power 1.8V operation, making it an ideal choice for embedded systems, digital signal processing, and custom logic implementations.

As part of the second-generation ASIC replacement technology, the XC2S100E-6FT256I offers engineers and designers a flexible, cost-effective alternative to traditional mask-programmed ASICs, with the added benefit of unlimited in-system reprogrammability.

Technical Specifications

Core Architecture Features

Specification Value
Family Spartan-IIE 1.8V FPGA
System Gates 100,000 gates
Logic Cells 2,700 cells
Maximum Frequency 357 MHz
Process Technology 0.15 micron CMOS
Core Voltage 1.8V
Package Type 256-Pin FTBGA (Fine-Pitch Ball Grid Array)
Temperature Grade Industrial (-40°C to +100°C)
RoHS Compliance Non-RoHS Compliant

Memory Configuration

Memory Type Capacity
Block RAM Up to 288K bits
Distributed RAM Up to 221,184 bits
Dual-Port Block RAM Configurable 4K-bit true dual-port
LUT Distributed RAM 16 bits per LUT

Package and Pin Information

  • Package Code: FT256 (Fine-Pitch BGA)
  • Total Pins: 256
  • Package Dimensions: Compact ball grid array format
  • Mounting Type: Surface Mount Technology (SMT)
  • Lead Pitch: Fine-pitch for high-density PCB designs

Key Features and Benefits

Advanced FPGA Capabilities

The XC2S100E-6FT256I incorporates cutting-edge features derived from Xilinx’s Virtex-E architecture, providing designers with professional-grade capabilities:

1. SelectRAM Hierarchical Memory System

  • Flexible memory architecture supporting distributed and block RAM configurations
  • Dual-port memory access for concurrent read/write operations
  • Optimized for data buffering and temporary storage applications

2. Delay-Locked Loop (DLL) Technology

  • Four integrated DLLs for precise clock management
  • Reduces clock skew and improves timing performance
  • Enables higher system frequencies and improved signal integrity

3. High-Speed I/O Standards

  • Supports 19 selectable I/O standards
  • Compatible with LVTTL, LVCMOS, PCI, and differential signaling
  • Flexible voltage level support for multi-standard system integration

4. Performance Optimization

  • System performance exceeding 200 MHz in typical applications
  • Fast, predictable interconnect architecture
  • Consistent timing across design iterations

Application Areas

Industrial Control Systems

The XC2S100E-6FT256I excels in industrial automation environments where reliability and performance are critical. Common applications include:

  • Programmable Logic Controllers (PLCs)
  • Motor control systems
  • Factory automation equipment
  • Process monitoring and control

Communications Equipment

With its high-speed capabilities and flexible I/O standards, this Xilinx FPGA is ideal for:

  • Digital signal processing
  • Protocol conversion and bridging
  • Data acquisition systems
  • Network interface controllers

Embedded Systems

The industrial temperature range and low power consumption make it suitable for:

  • Automotive electronics
  • Medical device controllers
  • Aerospace instrumentation
  • Military and defense systems

Consumer Electronics

Cost-effective FPGA solution for:

  • Digital video processing
  • Audio/video interface conversion
  • Custom peripheral controllers
  • IoT edge computing devices

Advantages Over Traditional ASICs

Flexibility and Reprogrammability

Unlike mask-programmed ASICs, the XC2S100E-6FT256I offers:

  • In-System Reprogrammability: Update functionality without hardware replacement
  • Rapid Prototyping: Faster time-to-market compared to ASIC development
  • Field Upgrades: Deploy firmware updates and feature enhancements remotely
  • Design Iteration: Modify designs without expensive mask sets

Cost-Effectiveness

  • No NRE Costs: Eliminate non-recurring engineering expenses associated with ASIC development
  • Low Initial Investment: Start production without multi-million dollar tooling costs
  • Flexible Production: Adjust to market demands without minimum order quantities
  • Risk Mitigation: Avoid the financial risk of ASIC development cycles

Development Tools and Support

Xilinx ISE Design Suite

The XC2S100E-6FT256I is fully supported by Xilinx development tools:

  • Comprehensive synthesis and implementation environment
  • Advanced timing analysis and constraint management
  • Integrated simulation and verification tools
  • ChipScope Pro for in-system debugging

Programming Options

  • JTAG boundary-scan programming
  • Serial configuration through SPI flash
  • SelectMAP parallel configuration
  • Partial reconfiguration capability

Package and Ordering Information

Part Number Breakdown

XC2S100E-6FT256I

  • XC2S = Spartan-IIE family
  • 100E = 100K gate density
  • 6 = Speed grade (-6)
  • FT256 = Fine-Pitch BGA, 256 pins
  • I = Industrial temperature range

Related Part Numbers

For different temperature grades and package options, consider:

  • XC2S100E-6FTG256C (Commercial grade, 0°C to +85°C)
  • XC2S100E-6PQ208I (208-pin PQFP package, Industrial)
  • XC2S100E-6TQ144I (144-pin TQFP package, Industrial)

Quality and Reliability

Manufacturing Standards

  • Produced using advanced 0.15-micron CMOS process technology
  • Rigorous quality control and testing procedures
  • Full compliance with AMD Xilinx quality standards
  • ESD protection on all I/O pins

Product Lifecycle

While the XC2S100E-6FT256I is a mature product (not recommended for new designs by AMD Xilinx), it remains:

  • Available for legacy system support
  • Suitable for cost-sensitive applications
  • Supported by extensive documentation and community resources
  • Compatible with established design flows

Technical Comparison Table

XC2S100E vs. Similar FPGAs

Feature XC2S100E-6FT256I XC3S100E-4TQ144C XC2S100-5FG256I
Family Spartan-IIE Spartan-3E Spartan-II
Gates 100K 100K 100K
Cells 2,700 2,160 2,700
Voltage 1.8V 1.2V 2.5V
Process 0.15μm 90nm 0.18μm
Max Freq 357 MHz 572 MHz 263 MHz

Getting Started

Design Considerations

When implementing designs with the XC2S100E-6FT256I, engineers should consider:

  1. Power Supply Design: Ensure stable 1.8V core voltage with adequate current capacity
  2. Thermal Management: Industrial temperature range requires proper heat dissipation
  3. Configuration Strategy: Select appropriate configuration method for your application
  4. Signal Integrity: Fine-pitch BGA requires careful PCB layout and impedance control

Resource Utilization

Optimize your FPGA design by:

  • Balancing logic cell usage with available resources
  • Leveraging block RAM for data-intensive applications
  • Utilizing DLLs for clock domain management
  • Implementing appropriate I/O standards for your interfaces

Supply Chain and Availability

Authorized Distributors

The XC2S100E-6FT256I is available through multiple authorized channels including:

  • Digi-Key Electronics
  • Mouser Electronics
  • Arrow Electronics
  • Avnet
  • Independent distributors worldwide

Packaging and Storage

  • Anti-static packaging with ESD protection
  • Moisture sensitivity level per JEDEC standards
  • Proper storage conditions ensure long-term reliability
  • Tray or tape-and-reel options available

Conclusion

The XC2S100E-6FT256I represents a proven, reliable FPGA solution for industrial applications requiring moderate logic density, high performance, and cost-effectiveness. Its industrial temperature rating, comprehensive feature set, and established design ecosystem make it an excellent choice for legacy system support and cost-sensitive new projects.

Whether you’re designing industrial control systems, communications equipment, or embedded applications, the XC2S100E-6FT256I offers the perfect balance of performance, flexibility, and value. With unlimited reprogrammability and extensive development tool support, this Spartan-IIE FPGA continues to serve engineers worldwide in creating innovative electronic solutions.

For technical specifications, pricing information, and availability, consult authorized AMD Xilinx distributors or visit the official AMD Xilinx documentation center.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.