Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S100E-6FGG456C: Complete Guide to Xilinx Spartan-IIE FPGA

Product Details

Overview of XC2S100E-6FGG456C FPGA

The XC2S100E-6FGG456C is a high-performance field-programmable gate array (FPGA) from Xilinx’s Spartan-IIE family, designed to deliver cost-effective programmable logic solutions for embedded systems and digital circuit applications. This 456-pin FBGA package device features 100,000 system gates and operates at 1.8V, making it an ideal choice for power-sensitive applications requiring moderate logic capacity.

XC2S100E-6FGG456C Technical Specifications

Understanding the technical capabilities of the XC2S100E-6FGG456C helps engineers make informed decisions for their design projects.

Specification Details
Part Number XC2S100E-6FGG456C
Manufacturer Xilinx (now AMD Xilinx)
FPGA Family Spartan-IIE 1.8V
System Gates 100,000 gates
Logic Cells 2,700 cells
Maximum Frequency 357 MHz
Process Technology 0.15 micron (150nm)
Core Voltage 1.8V
Package Type 456-Pin FBGA (Fine-Pitch Ball Grid Array)
Operating Temperature Commercial (0°C to +85°C)
Speed Grade -6 (standard performance)

Key Features of Spartan-IIE XC2S100E-6FGG456C

Advanced Architecture and Design

The XC2S100E-6FGG456C incorporates second-generation ASIC replacement technology with streamlined features based on the proven Virtex-E FPGA architecture. This Xilinx FPGA delivers exceptional performance while maintaining low power consumption and cost efficiency.

Programmable Logic Resources

Resource Type XC2S100E-6FGG456C Capacity
Configurable Logic Blocks (CLBs) 2,700 logic cells
System Gates 100,000 gates
Distributed RAM Available in CLBs
Block SelectRAM Hierarchical memory architecture
I/O Pins Multiple I/O options
User I/O Varies by package configuration

Memory and Storage Capabilities

The XC2S100E-6FGG456C features SelectRAM hierarchical memory, providing flexible on-chip storage solutions:

  • Distributed RAM: Embedded within CLBs for fast, localized storage
  • Block RAM: Dedicated memory blocks for larger data storage requirements
  • Dual-Port RAM Support: Enables simultaneous read/write operations
  • Configuration Memory: 863,840 bits total configuration data

XC2S100E-6FGG456C Performance Characteristics

Clock Speed and Timing

The XC2S100E-6FGG456C operates at frequencies up to 357 MHz, delivering high-speed performance for demanding applications. The -6 speed grade indicates standard performance characteristics suitable for most commercial applications.

Power Consumption Profile

Power Parameter Typical Value
Core Voltage 1.8V
I/O Voltage 1.8V to 3.3V (configurable)
Static Power Low standby current
Dynamic Power Depends on design utilization
Power Technology 0.15µm CMOS process

Applications for XC2S100E-6FGG456C FPGA

Industrial Control Systems

The XC2S100E-6FGG456C excels in industrial automation, providing reliable programmable logic for:

  • Motor control systems
  • Process automation controllers
  • Factory automation equipment
  • Industrial communication protocols
  • Safety-critical control systems

Communications Equipment

With its high-speed capabilities, this FPGA is ideal for:

  • Digital signal processing
  • Protocol converters
  • Network interface controllers
  • Telecommunications infrastructure
  • Data acquisition systems

Consumer Electronics

The low power consumption makes the XC2S100E-6FGG456C suitable for:

  • Digital video processing
  • Audio processing applications
  • Embedded system controllers
  • Smart home devices
  • Portable electronics

Programming and Development Tools

ISE Design Suite Compatibility

The XC2S100E-6FGG456C is supported by Xilinx ISE Design Suite, providing comprehensive development tools including:

  • Synthesis Tools: Convert HDL code to netlist format
  • Implementation Tools: Place and route design resources
  • Simulation Environment: Verify design functionality
  • Timing Analysis: Ensure timing requirements are met
  • BitGen Configuration: Generate programming files

Hardware Description Language Support

HDL Type Description
VHDL IEEE standard hardware description language
Verilog Popular HDL for digital design
Schematic Entry Graphical design capture method
EDIF Netlist Electronic Design Interchange Format

Package Information: 456-Pin FBGA

Physical Dimensions and Layout

The Fine-Pitch Ball Grid Array (FBGA) package provides:

  • Total Pins: 456 balls
  • Package Size: Compact footprint for PCB design
  • Ball Pitch: Fine-pitch spacing for high-density routing
  • Thermal Performance: Enhanced heat dissipation
  • Mounting: Surface-mount technology (SMT)

PCB Design Considerations

Design Aspect Recommendation
Layer Count Minimum 6-layer PCB recommended
Via Technology Microvias for dense routing
Power Planes Dedicated 1.8V and 3.3V planes
Decoupling Multiple bypass capacitors near power pins
Thermal Management Consider thermal vias and heatsinks

Configuration Options for XC2S100E-6FGG456C

Configuration Modes

The XC2S100E-6FGG456C supports multiple configuration methods:

  1. Master Serial Mode: FPGA generates configuration clock
  2. Slave Serial Mode: External source provides clock
  3. Master Parallel Mode: Parallel data loading
  4. Slave Parallel Mode: High-speed parallel configuration
  5. JTAG Configuration: Boundary-scan based programming

Configuration Memory Requirements

Parameter Value
Configuration Bits 863,840 bits
Default CCLK Frequency 4 MHz
Maximum CCLK Frequency Configurable via ConfigRate
Power-Up CCLK 2.5 MHz (first 60 bytes)
Configuration Time Depends on mode and clock speed

Comparison with Related Xilinx FPGAs

Spartan-IIE Family Comparison

Model System Gates Logic Cells Configuration Bits
XC2S100E 100,000 2,700 863,840
XC2S150E 150,000 3,840 1,134,496
XC2S200E 200,000 5,292 1,442,016
XC2S300E 300,000 6,912 1,875,648
XC2S400E 400,000 10,800 2,693,440
XC2S600E 600,000 15,552 3,961,632

Design Implementation Best Practices

Optimization Strategies

To maximize performance of the XC2S100E-6FGG456C:

  1. Resource Utilization: Efficiently use CLBs and block RAM
  2. Clock Domain Management: Minimize clock domain crossings
  3. Timing Constraints: Define accurate timing requirements
  4. I/O Standards: Select appropriate voltage standards
  5. Power Optimization: Implement clock gating where possible

Timing Closure Techniques

Technique Benefit
Pipelining Increases maximum frequency
Register Replication Reduces fanout delays
Logic Optimization Minimizes combinational depth
Placement Constraints Controls critical path routing
Clock Buffers Reduces clock skew

Reliability and Longevity

Product Lifecycle Status

Important Note: The Spartan-IIE family, including the XC2S100E-6FGG456C, has been marked as obsolete by Xilinx and is not recommended for new designs. However, the device remains suitable for:

  • Legacy system maintenance
  • Replacement and repair applications
  • Existing product support
  • Long-term inventory planning

Recommended Alternatives

For new designs, consider these modern alternatives:

Alternative Series Key Advantages
Spartan-7 Lower power, higher performance
Artix-7 Enhanced DSP and memory
Zynq-7000 Integrated ARM processor

Quality and Compliance Standards

Manufacturing Quality

The XC2S100E-6FGG456C adheres to:

  • ISO 9001 quality management systems
  • Industry-standard reliability testing
  • Comprehensive quality assurance protocols
  • Rigorous electrical testing procedures

Environmental Compliance

Standard Status
RoHS Compliant versions available
REACH EU regulations compliance
Conflict Minerals Reporting available
Green Products Environmental documentation

Purchasing and Availability

Authorized Distributors

The XC2S100E-6FGG456C can be sourced through:

  • Electronic component distributors
  • Authorized Xilinx/AMD partners
  • Specialized FPGA suppliers
  • Online electronics marketplaces

Pricing Considerations

Pricing factors include:

  • Order quantity (volume discounts available)
  • Lead times and availability
  • Package options and speed grades
  • Market conditions and demand
  • Obsolescence status

Technical Support and Resources

Documentation Available

Resource Type Description
Datasheet Complete electrical specifications
User Guide Detailed architecture information
Application Notes Design implementation guidance
Reference Designs Example projects and code
Errata Known issues and workarounds

Design Support Services

Engineers working with the XC2S100E-6FGG456C can access:

  • Technical forums and communities
  • Application engineering support
  • Training materials and webinars
  • Design consultation services
  • Migration guides for alternative devices

Frequently Asked Questions

What is the difference between XC2S100E and XC2S100?

The XC2S100E belongs to the Spartan-IIE family with 1.8V core voltage and 0.15µm technology, while the XC2S100 is from the older Spartan-II family with 2.5V core voltage and 0.18µm technology. The “E” version offers lower power consumption and improved performance.

Can XC2S100E-6FGG456C be used in new designs?

While technically capable, this device is obsolete and not recommended for new designs. Xilinx suggests migrating to newer families like Spartan-7 or Artix-7 for better performance, support, and long-term availability.

What programming cable is required?

The XC2S100E-6FGG456C can be programmed using Xilinx Platform Cable USB or compatible JTAG programmers that support IEEE 1149.1 boundary-scan standard.

What is the typical power consumption?

Power consumption varies based on design utilization, clock frequencies, and I/O activity. The 1.8V core voltage significantly reduces power compared to previous generations, typically ranging from 100mW to several watts depending on application.

Conclusion: Is XC2S100E-6FGG456C Right for Your Project?

The XC2S100E-6FGG456C represents proven FPGA technology suitable for moderate-complexity applications requiring 100,000 system gates. While marked as obsolete for new designs, it remains a viable solution for legacy system support, replacement applications, and cost-sensitive projects with existing design infrastructure.

For engineers maintaining existing systems, the XC2S100E-6FGG456C offers reliable performance with extensive documentation and established design methodologies. However, new projects should consider modern alternatives that provide enhanced features, better development tools, and long-term product support.

When selecting an FPGA for your application, evaluate factors including logic capacity requirements, I/O count, performance specifications, power budget, package constraints, and long-term availability to ensure the best fit for your specific needs.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.