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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
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Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S100E-5FT256I: High-Performance Spartan-IIE FPGA for Industrial Applications

Product Details

The XC2S100E-5FT256I is a field-programmable gate array from AMD Xilinx’s renowned Spartan-IIE family, designed to deliver exceptional performance in industrial-grade applications. This FPGA chip combines cost-effectiveness with robust functionality, making it an ideal choice for embedded systems, digital signal processing, and telecommunications projects.

Overview of XC2S100E-5FT256I FPGA

The XC2S100E-5FT256I represents the industrial temperature grade variant of the Spartan-IIE series, featuring a 256-pin Fine-Pitch Ball Grid Array (FTBGA) package. As part of the trusted Xilinx FPGA product line, this component offers engineers a reliable solution for demanding applications requiring extended temperature operation and high-density integration.

Key Features of Spartan-IIE XC2S100E

  • 100,000 system gates for complex logic implementations
  • 2,700 logic cells providing flexible design capabilities
  • 182 user I/O pins in the FT256 package configuration
  • Industrial temperature range: -40°C to +100°C
  • 1.8V core voltage for low power consumption
  • Speed grade -5 offering balanced performance and power efficiency

Technical Specifications

Core Architecture Specifications

Parameter Specification
Part Number XC2S100E-5FT256I
Manufacturer AMD Xilinx (formerly Xilinx Inc.)
Product Family Spartan-IIE FPGA
System Gates 100,000 gates
Logic Cells 2,700 cells
CLB Array 20 x 30
Total Block RAM 40 Kbits
Distributed RAM 38,400 bits

Package and Pin Configuration

Feature Details
Package Type FT256 (Fine-Pitch BGA)
Total Pins 256 pins
User I/O 182 I/O pins
Maximum I/O Banks 86
Package Dimensions 17mm x 17mm (nominal)
Ball Pitch 1.0mm

Electrical and Performance Characteristics

Specification Value
Core Voltage (VCCINT) 1.8V ±5%
I/O Voltage (VCCO) 1.5V to 3.3V
Speed Grade -5
Maximum Frequency 357 MHz (internal)
Operating Temperature -40°C to +100°C (Industrial)
Technology Node 0.15μm CMOS
Static Power Low (varies by configuration)

Applications and Use Cases

Industrial Control Systems

The XC2S100E-5FT256I excels in industrial automation environments where extended temperature operation is critical. Its robust design supports motor control, sensor interfacing, and real-time monitoring applications.

Telecommunications Infrastructure

With 182 available I/Os and high-speed capabilities, this FPGA is well-suited for protocol conversion, data multiplexing, and communications interface implementations in telecom equipment.

Embedded Processing Solutions

Engineers leverage the XC2S100E-5FT256I for co-processor applications, peripheral controllers, and custom logic acceleration in embedded systems requiring industrial-grade reliability.

Digital Signal Processing

The distributed RAM architecture and logic cell configuration make this device suitable for DSP applications including filtering, transform operations, and signal conditioning tasks.

Design Considerations and Best Practices

Power Supply Requirements

Implementing the XC2S100E-5FT256I requires careful attention to power distribution. The device operates with a 1.8V core supply while supporting flexible I/O voltages from 1.5V to 3.3V, enabling interfacing with various logic families.

Thermal Management

In industrial environments, proper thermal design ensures reliable operation across the full -40°C to +100°C range. Consider adequate PCB copper area and airflow when designing with the FT256 package.

Configuration Options

The Spartan-IIE family supports multiple configuration modes including master serial, slave serial, and JTAG boundary scan, providing flexibility for system integration and in-field programming.

Comparison with Related Devices

XC2S100E Speed Grade Variations

Part Number Speed Grade Temperature Range Applications
XC2S100E-5FT256I -5 Industrial (-40°C to 100°C) Harsh environments
XC2S100E-6FT256I -6 Industrial (-40°C to 100°C) Higher performance industrial
XC2S100E-6FT256C -6 Commercial (0°C to 85°C) Standard applications

Spartan-IIE Family Scalability

The XC2S100E sits in the mid-range of the Spartan-IIE family, offering an optimal balance between resources and cost. Designers can scale up to XC2S150E, XC2S200E, or higher-density devices for more demanding applications.

Ordering Information and Availability

Part Number Breakdown

XC2S100E-5FT256I decodes as follows:

  • XC2S = Spartan-IIE family
  • 100E = 100,000 gate count
  • -5 = Speed grade (moderate performance)
  • FT256 = 256-pin Fine-Pitch BGA package
  • I = Industrial temperature range

Package Markings

Authentic XC2S100E-5FT256I devices feature top-side markings including the complete part number, date code, and lot traceability information for quality assurance.

Development Tools and Support

Design Software Compatibility

The XC2S100E-5FT256I is supported by Xilinx ISE Design Suite, providing comprehensive tools for synthesis, implementation, and simulation. HDL languages including VHDL and Verilog are fully supported.

IP Core Integration

Designers can leverage Xilinx IP cores for common functions such as memory controllers, arithmetic units, and communication protocols, accelerating time-to-market for projects using the XC2S100E-5FT256I.

Documentation Resources

Complete datasheets, application notes, and reference designs are available through official Xilinx/AMD documentation portals, providing essential information for successful implementation.

Quality and Reliability

Industrial Grade Qualification

The “I” suffix designates this device as industrial-grade, meaning it has undergone rigorous testing to ensure reliable operation in extended temperature conditions and harsh electromagnetic environments.

RoHS Compliance

Modern production runs of the XC2S100E-5FT256I comply with RoHS directives, featuring lead-free solder ball terminations in the BGA package, making them suitable for environmentally-conscious applications.

Frequently Asked Questions

What is the difference between XC2S100E-5FT256I and XC2S100E-6FT256I?

The primary difference is the speed grade: -5 offers moderate performance with lower power consumption, while -6 provides higher maximum operating frequencies. Both share the same industrial temperature range.

Can the XC2S100E-5FT256I replace commercial-grade variants?

Yes, the industrial-grade device can replace commercial variants (C-suffix) since it offers wider temperature operation. However, the reverse substitution is not recommended for industrial applications.

What programming methods are supported?

The XC2S100E-5FT256I supports JTAG boundary-scan programming, master/slave serial configuration modes, and SelectMAP parallel configuration for flexible system integration.

Is this device suitable for new designs?

While the Spartan-IIE family has been superseded by newer generations, existing designs continue to use these devices. For new projects, consider evaluating current-generation Spartan or Artix families for enhanced features.

Conclusion

The XC2S100E-5FT256I delivers proven FPGA technology for industrial applications requiring reliable operation across extended temperature ranges. With 100,000 system gates, 182 I/O pins, and robust industrial-grade specifications, this Spartan-IIE device continues to serve critical roles in embedded systems, telecommunications, and control applications. Engineers selecting this component benefit from mature development tools, extensive documentation, and the reliability of AMD Xilinx’s industry-leading FPGA technology.

Whether you’re designing industrial controllers, communications interfaces, or embedded processing solutions, the XC2S100E-5FT256I provides a cost-effective, proven platform backed by comprehensive technical support and a strong ecosystem of development resources.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.