Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2C512-7FTG256I: AMD CoolRunner-II CPLD with 512 Macrocells and Ultra-Low Power

Product Details

The XC2C512-7FTG256I is a high-performance Complex Programmable Logic Device (CPLD) from AMD’s renowned CoolRunner-II family. This industrial-grade CPLD delivers exceptional performance with 512 macrocells, 12,000 system gates, and an impressive maximum frequency of 179MHz, all while consuming ultra-low power. Designed for demanding applications requiring instant-on functionality and nonvolatile operation, the XC2C512-7FTG256I is the ideal choice for communication systems, industrial automation, and portable electronics.

For more AMD/Xilinx programmable logic devices, visit Xilinx FPGA.


XC2C512-7FTG256I Key Features and Benefits

The CoolRunner-II XC2C512-7FTG256I CPLD integrates advanced features that set it apart from conventional programmable logic devices. The device operates from a single 1.8V core voltage, making it compatible with modern low-voltage system designs while maintaining backward compatibility with legacy interfaces.

Ultra-Low Power Consumption

One of the standout characteristics of the XC2C512-7FTG256I is its exceptional power efficiency. The device achieves a standby current of only 16µA and dynamic power consumption as low as 28.8µW. This ultra-low power profile is made possible by CoolCLOCK technology, which automatically disables unused clock networks, and DataGATE technology, which blocks unnecessary data switching.

High-Speed Performance

Despite its low power consumption, the XC2C512-7FTG256I delivers impressive speed performance with a pin-to-pin propagation delay of just 7.5ns and a maximum system frequency of 179MHz. This combination of speed and efficiency makes it suitable for high-frequency communication protocols and real-time control applications.


XC2C512-7FTG256I Technical Specifications

Parameter Specification
Manufacturer AMD (formerly Xilinx)
Part Number XC2C512-7FTG256I
Device Family CoolRunner-II CPLD
Macrocells 512
System Gates 12,000
Function Blocks 32
Maximum I/O Pins 270

XC2C512-7FTG256I Electrical Characteristics

Parameter Value
Core Voltage (VCCINT) 1.8V (1.7V ~ 1.9V)
I/O Voltage (VCCIO) 1.5V / 1.8V / 2.5V / 3.3V
Standby Current 16µA (Typical)
Dynamic Power 28.8µW (Typical)
Max Frequency (fSYSTEM) 179MHz
Pin-to-Pin Delay (tPD) 7.5ns

XC2C512-7FTG256I Package Information

Parameter Specification
Package Type 256-FTBGA (Fine-Pitch Thin Ball Grid Array)
Pin Count 256
Ball Pitch 1.0mm
Package Dimensions 17mm × 17mm
Mounted Height 1.55mm (Max)
Lead-Free/RoHS Compliant

XC2C512-7FTG256I Operating Conditions

Parameter Commercial (C) Industrial (I)
Operating Temperature 0°C to +70°C -40°C to +85°C
Storage Temperature -65°C to +150°C -65°C to +150°C
Temperature Grade Suffix C I

The “I” suffix in XC2C512-7FTG256I indicates this is an industrial-grade component rated for extended temperature operation from -40°C to +85°C, making it suitable for harsh environmental conditions.


XC2C512-7FTG256I Architecture Overview

Advanced Interconnect Matrix (AIM)

The XC2C512-7FTG256I utilizes AMD’s proprietary Advanced Interconnect Matrix (AIM) architecture, which provides a low-power routing structure connecting all 32 Function Blocks. The AIM delivers 40 true and complement inputs to each Function Block, enabling flexible signal routing while minimizing power consumption.

Function Block Structure

Each of the 32 Function Blocks in the XC2C512-7FTG256I contains:

  • 40 × 56 Product Term PLA
  • 16 Macrocells per Function Block
  • Local clock, clock-enable, and reset signals
  • DualEDGE flip-flop capability for reduced clock frequency operation

Macrocell Configuration Options

The 512 macrocells offer extensive configuration flexibility:

Feature Options
Output Type Combinational or Registered
Flip-Flop Type D, T, Latch, DualEDGE
Clock Sources 3 Global Clocks + Product Term Clock
Reset/Set Asynchronous/Synchronous
Output Enable Global or Product Term

XC2C512-7FTG256I Advanced Features

DataGATE Technology

DataGATE technology in the XC2C512-7FTG256I enables power reduction by blocking data inputs to inactive sections of the device. This feature can reduce total power consumption by up to 90% in applications with intermittent data activity.

CoolCLOCK Technology

CoolCLOCK combines clock gating with a global clock divider to reduce dynamic power consumption. The clock divider can generate eight different clock frequencies from a single external clock source (GCK2), supporting both even and odd division ratios.

In-System Programming (ISP)

The XC2C512-7FTG256I supports IEEE 1532 In-System Programming through a standard JTAG interface. Key ISP features include:

Feature Specification
Programming Interface IEEE 1149.1 JTAG
Programming Voltage 1.8V
Program Cycles 10,000 minimum
Data Retention 20 years minimum
Instant-On Operation Yes (Nonvolatile)

Multi-Voltage I/O Support

The XC2C512-7FTG256I supports multiple I/O voltage standards for seamless integration with various system components:

I/O Standard Voltage Level
LVCMOS33 3.3V
LVCMOS25 2.5V
LVCMOS18 1.8V
LVCMOS15 1.5V
SSTL2-I 2.5V
SSTL3-I 3.3V
HSTL-I 1.5V

XC2C512-7FTG256I Typical Applications

The XC2C512-7FTG256I is well-suited for a wide range of applications:

Communication Systems

  • Protocol bridging and conversion
  • Bus interface management
  • Clock generation and distribution
  • Signal conditioning

Industrial Automation

  • PLC interface logic
  • Motor control sequencing
  • Sensor data preprocessing
  • Safety interlock systems

Consumer Electronics

  • Power management control
  • Display timing controllers
  • Audio/video signal routing
  • Remote control interfaces

Portable and Battery-Powered Devices

  • Ultra-low power state machines
  • Sleep mode control logic
  • Power sequencing
  • Battery monitoring interfaces

XC2C512-7FTG256I Part Number Decoder

Understanding the XC2C512-7FTG256I part number structure:

Segment Value Meaning
XC2C CoolRunner-II Family
512 512 Number of Macrocells
-7 7 Speed Grade (7.5ns tPD)
FT FT Fine-Pitch Thin Package
G G Lead-Free (Green) Package
256 256 Pin Count
I I Industrial Temperature Grade

XC2C512-7FTG256I Design Tools and Software Support

The XC2C512-7FTG256I is fully supported by AMD’s comprehensive development ecosystem:

Tool Purpose
Vivado Design Suite Synthesis and Implementation
ISE Design Suite Legacy Design Support
ISE WebPACK Free Design Entry
ChipScope Pro On-Chip Debugging
Xilinx Platform Cable JTAG Programming

Design entry supports VHDL, Verilog, and schematic capture methodologies.


XC2C512-7FTG256I Ordering Information

Part Number Description
XC2C512-7FTG256I Industrial Grade, Lead-Free, 256-FTBGA
XC2C512-7FTG256C Commercial Grade, Lead-Free, 256-FTBGA
XC2C512-7FT256I Industrial Grade, Leaded, 256-FTBGA
XC2C512-10FTG256I Industrial Grade, Faster Speed (-10), 256-FTBGA

Why Choose XC2C512-7FTG256I for Your Design?

The XC2C512-7FTG256I offers a compelling combination of features for modern electronic designs:

  1. Ultra-Low Power – 16µA standby current extends battery life in portable applications
  2. Instant-On Operation – Nonvolatile technology eliminates boot time delays
  3. Industrial Temperature Range – Reliable operation from -40°C to +85°C
  4. High Integration – 512 macrocells reduce component count and board space
  5. Flexible I/O – Multi-voltage support simplifies system integration
  6. Long-Term Availability – AMD/Xilinx CoolRunner-II family with established production history
  7. RoHS Compliant – Meets environmental regulations for lead-free manufacturing

XC2C512-7FTG256I Summary Specifications Table

Specification Value
Part Number XC2C512-7FTG256I
Manufacturer AMD (Xilinx)
Family CoolRunner-II
Type CPLD
Macrocells 512
Gates 12,000
Max Frequency 179MHz
Core Voltage 1.8V
Propagation Delay 7.5ns
Standby Current 16µA
Package 256-FTBGA
Temperature Range -40°C to +85°C
Process Technology 0.18µm CMOS
RoHS Status Compliant

The XC2C512-7FTG256I CoolRunner-II CPLD represents AMD’s commitment to delivering high-performance, low-power programmable logic solutions for demanding industrial and commercial applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.