Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2C512-10FT256I: Xilinx CoolRunner-II CPLD | Ultra-Low Power 512 Macrocell CPLD

Product Details

The XC2C512-10FT256I is a high-performance Complex Programmable Logic Device (CPLD) from AMD/Xilinx’s renowned CoolRunner-II family. This industrial-grade CPLD combines exceptional speed with ultra-low power consumption, making it the ideal choice for demanding embedded systems, portable electronics, and communication equipment. With 512 macrocells packed into a compact 256-ball FTBGA package, the XC2C512-10FT256I delivers remarkable logic density for complex digital designs.

XC2C512-10FT256I Key Specifications Overview

The XC2C512-10FT256I represents the highest-capacity device in the CoolRunner-II CPLD family with industrial temperature support. Engineers choose this programmable logic device for applications requiring both high performance and energy efficiency.

Parameter Specification
Part Number XC2C512-10FT256I
Manufacturer AMD / Xilinx
Product Family CoolRunner-II CPLD
Number of Macrocells 512
System Gates 12,000
Maximum I/O Pins 212 User I/O
Package Type 256-Ball FTBGA (1.0mm pitch)
Core Voltage 1.8V
Operating Temperature -40°C to +85°C (Industrial)
Speed Grade -10 (9.2ns tPD)

XC2C512-10FT256I Electrical Characteristics

Understanding the electrical specifications of the XC2C512-10FT256I helps engineers design reliable power supply circuits and ensure proper integration into their systems.

Power Consumption Specifications

Parameter Value Unit
Quiescent Current (Standby) 14 μA
Standby Power 28.8 μW
Core Supply Voltage (VCCINT) 1.8 V
I/O Supply Voltage (VCCIO) 1.5 – 3.3 V

XC2C512-10FT256I Timing Performance

Parameter Value Unit
Pin-to-Pin Delay (tPD) 9.2 ns
Maximum Frequency 128 MHz
Setup Time 4.0 ns
Clock-to-Output 5.6 ns

CoolRunner-II CPLD Architecture Features

The XC2C512-10FT256I utilizes Xilinx’s advanced CoolRunner-II architecture, which combines the high-speed performance of the XC9500/XL/XV family with the ultra-low power characteristics of the XPLA3 family.

Function Block Structure

The XC2C512-10FT256I contains 32 function blocks interconnected by the Advanced Interconnect Matrix (AIM). Each function block features:

Component Specification
Product Term PLA 40 x 56
Macrocells per Function Block 16
Input Signals 40 true and complement
Configuration Modes Combinational or Registered

Advanced Power Management Technologies

The XC2C512-10FT256I incorporates several innovative power-saving features that extend battery life in portable applications:

DataGATE Technology

DataGATE allows designers to selectively disable unused input pins, reducing dynamic power consumption. This feature is especially valuable in battery-operated devices where every microwatt counts.

CoolCLOCK Technology

CoolCLOCK combines clock division with DualEDGE flip-flops to reduce switching power. The built-in clock divider supports division ratios of 2, 4, 6, 8, 10, 12, 14, and 16.

DualEDGE Flip-Flops

Available on a per-macrocell basis, DualEDGE flip-flops enable high-performance operation at lower clock frequencies, further reducing power consumption without sacrificing performance.

XC2C512-10FT256I I/O Capabilities

The flexible I/O system of the XC2C512-10FT256I supports multiple voltage standards, enabling seamless integration with various logic families.

Multi-Voltage I/O Support

I/O Standard Compatibility
1.5V LVCMOS ✓ Supported
1.8V LVCMOS ✓ Supported
2.5V LVCMOS ✓ Supported
3.3V LVCMOS ✓ Supported
SSTL2-1 ✓ Supported
SSTL3-1 ✓ Supported
HSTL-1 ✓ Supported

I/O Pin Features

The XC2C512-10FT256I provides extensive I/O configuration options:

Feature Description
I/O Banks 4 separate banks
Schmitt-Trigger Input Optional per-pin configuration
Open-Drain Output For Wired-OR and LED drive
Bus-Hold Optional on selected I/O pins
Weak Pull-up Optional configuration
Hot-Pluggable Yes

XC2C512-10FT256I System Features

In-System Programming (ISP)

The XC2C512-10FT256I supports the fastest in-system programming available through the IEEE 1532 (JTAG) interface. Key programming features include:

Feature Specification
Programming Interface IEEE 1532 JTAG
Boundary Scan IEEE 1149.1 compliant
Programming Voltage 1.8V
On-The-Fly Reconfiguration Supported
Design Security Advanced protection

Global Signal Resources

Resource Availability
Global Clocks Multiple with phase selection
Global Output Enables Multiple
Global Set/Reset Yes
Clock Division 2, 4, 6, 8, 10, 12, 14, 16

XC2C512-10FT256I Package Information

The 256-ball FTBGA package offers an excellent balance between pin count and board space requirements.

Parameter Specification
Package Type Fine-pitch Thin BGA
Ball Count 256
Ball Pitch 1.0mm
Package Dimensions 17mm x 17mm
User I/O Pins 212
Lead-Free Option Available (Pb-free)
Moisture Sensitivity Level MSL 3 (168 hours)

XC2C512-10FT256I Industrial Temperature Grade

The “I” suffix designates industrial temperature range capability, making the XC2C512-10FT256I suitable for harsh operating environments.

Parameter Value
Operating Temperature Range -40°C to +85°C
Storage Temperature -65°C to +150°C
Junction Temperature 125°C (Maximum)

XC2C512-10FT256I Applications

The XC2C512-10FT256I excels in numerous application areas where low power, high performance, and reliability are essential:

Industrial Applications

The industrial temperature rating makes the XC2C512-10FT256I ideal for factory automation, process control systems, and motor drive controllers operating in challenging environments.

Telecommunications Equipment

High-speed data communications systems benefit from the fast pin-to-pin delays and flexible clocking options of the XC2C512-10FT256I.

Portable and Battery-Operated Devices

With standby current as low as 14μA, the XC2C512-10FT256I extends battery life in handheld devices, wearables, and remote sensors.

Automotive Electronics

The extended temperature range supports automotive applications requiring reliable operation across extreme temperature variations.

XC2C512-10FT256I Development Tools

Design support for the XC2C512-10FT256I is available through Xilinx ISE WebPACK, which provides synthesis, simulation, and programming capabilities at no cost.

Tool Description
Xilinx ISE WebPACK Free design software
Vivado (Reference) Modern design suite
JTAG Programmer Platform Cable USB II
Development Boards CoolRunner-II Starter Kit

XC2C512-10FT256I Ordering Information

Part Number Speed Package Temperature Lead-Free
XC2C512-10FT256I -10 256-FTBGA Industrial No
XC2C512-10FTG256I -10 256-FTBGA Industrial Yes
XC2C512-7FT256I -7 256-FTBGA Industrial No
XC2C512-7FTG256I -7 256-FTBGA Industrial Yes

Why Choose XC2C512-10FT256I for Your Design?

The XC2C512-10FT256I delivers an optimal combination of performance, power efficiency, and reliability that few other CPLDs can match. Its 512 macrocells provide sufficient logic resources for complex control applications, while the ultra-low standby current ensures minimal power drain in battery-powered systems.

For engineers seeking high-quality programmable logic solutions, explore our comprehensive selection of Xilinx FPGA products to find the perfect fit for your next project.

XC2C512-10FT256I Technical Summary

Category Specification
Device Family CoolRunner-II CPLD
Logic Capacity 512 Macrocells / 12K Gates
Maximum I/O 212 Pins
Speed Performance 9.2ns tPD / 128MHz
Power Consumption 14μA Standby
Voltage 1.8V Core, 1.5-3.3V I/O
Package 256-Ball FTBGA
Temperature Range -40°C to +85°C
Programming IEEE 1532 JTAG ISP
Process Technology 0.18μm CMOS

The XC2C512-10FT256I is manufactured by AMD (formerly Xilinx) and is part of the CoolRunner-II CPLD family. For detailed technical specifications, please refer to the official XC2C512 datasheet (DS096) and CoolRunner-II family data sheet (DS090).

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.