Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2C512-10FGG324I: Xilinx CoolRunner-II CPLD 512 Macrocell Programmable Logic Device

Product Details

The XC2C512-10FGG324I is a high-performance Complex Programmable Logic Device (CPLD) from the renowned Xilinx CoolRunner-II family. This industrial-grade CPLD delivers exceptional performance with ultra-low power consumption, making it the ideal choice for mission-critical applications in telecommunications, industrial automation, and portable electronics.

XC2C512-10FGG324I Key Features and Benefits

The XC2C512-10FGG324I combines advanced 0.18μm CMOS technology with Xilinx’s proven CoolRunner-II architecture. Engineers choose this CPLD for applications demanding both high speed and minimal power draw.

Ultra-Low Power Consumption

One of the most compelling features of the XC2C512-10FGG324I is its zero-power standby mode. With quiescent current as low as 14μA, this device dramatically extends battery life in portable applications while reducing thermal management requirements in high-density designs.

High-Speed Performance

The XC2C512-10FGG324I achieves pin-to-pin delays as fast as 9.2ns and supports system frequencies up to 128MHz. This performance enables real-time signal processing and high-speed interface bridging applications.

XC2C512-10FGG324I Technical Specifications

Parameter Specification
Part Number XC2C512-10FGG324I
Manufacturer Xilinx (AMD)
Device Family CoolRunner-II
Device Type CPLD
Logic Gates 12,000
Macrocells 512
Function Blocks 32
Maximum Frequency 128 MHz
Pin-to-Pin Delay 9.2 ns
Process Technology 0.18μm CMOS
Core Voltage 1.8V
I/O Voltage Range 1.5V to 3.3V
Package Type 324-Ball FBGA
Ball Pitch 1.0mm
User I/O Pins 270
Operating Temperature -40°C to +100°C (Industrial)
Quiescent Current 14μA (typical)

XC2C512-10FGG324I Package Information

Package Attribute Value
Package Code FGG324
Package Style Fine-Pitch Ball Grid Array (FBGA)
Pin Count 324
Ball Pitch 1.0mm
Package Dimensions 23mm × 23mm
Mounting Type Surface Mount (SMD/SMT)
Lead-Free Option Available
MSL Rating Contact manufacturer

XC2C512-10FGG324I Architecture Overview

The CoolRunner-II architecture in the XC2C512-10FGG324I features a sophisticated design optimized for both performance and power efficiency.

Advanced Interconnect Matrix (AIM)

The Advanced Interconnect Matrix (AIM) is the backbone of the XC2C512-10FGG324I architecture. This low-power routing fabric interconnects all 32 Function Blocks, providing 40 true and complement inputs to each block. The AIM delivers deterministic timing while consuming minimal power.

Function Block Architecture

Each Function Block contains:

  • 40 × 56 Product Term PLA structure
  • 16 macrocells with configurable registers
  • Local clock and clock-enable signals
  • Asynchronous set/reset controls
  • Independent output enable signals

DualEDGE Flip-Flop Technology

The XC2C512-10FGG324I incorporates Xilinx’s innovative DualEDGE flip-flop feature. This technology enables high-performance synchronous operation using lower frequency clocks, effectively reducing dynamic power consumption without sacrificing throughput.

XC2C512-10FGG324I I/O Capabilities

I/O Feature Specification
Maximum User I/O 270 pins
I/O Standards Supported LVCMOS, LVTTL
Voltage Levels 1.5V, 1.8V, 2.5V, 3.3V
Schmitt Trigger Inputs Available
Programmable Slew Rate Yes
Bus Hold Supported
Global Clock Inputs 3
Global Set/Reset Yes
Global Output Enable 2

XC2C512-10FGG324I Programming and Development

In-System Programming (ISP)

The XC2C512-10FGG324I supports industry-fastest In-System Programming via the JTAG interface. This enables:

  • Field firmware updates
  • Manufacturing programming flexibility
  • Rapid prototyping iterations
  • System-level testing and debugging

Development Tools Compatibility

Tool Category Supported Solutions
Design Software Xilinx ISE, Vivado
Programming Interface JTAG (IEEE 1149.1)
Programming Cables Platform Cable USB, Parallel Cable
Third-Party Support Industry-standard EDA tools

XC2C512-10FGG324I Applications

The XC2C512-10FGG324I excels in diverse applications requiring reliable programmable logic:

Industrial Applications

  • Process control systems
  • Motor drive controllers
  • PLC interface modules
  • Industrial networking equipment
  • Factory automation systems

Telecommunications

  • Network interface cards
  • Protocol converters
  • Base station controllers
  • Fiber optic transceivers
  • Switching equipment

Consumer Electronics

  • Set-top boxes
  • Digital displays
  • Gaming peripherals
  • Audio/video processing
  • Smart home devices

Portable and Battery-Powered Devices

  • Handheld instruments
  • Medical monitoring equipment
  • Data loggers
  • Wireless sensors
  • GPS receivers

Why Choose XC2C512-10FGG324I for Your Design?

The XC2C512-10FGG324I offers compelling advantages for engineers and designers:

  1. Industrial Temperature Rating: The “I” suffix indicates full industrial temperature range operation (-40°C to +100°C), ensuring reliability in harsh environments.
  2. Proven Architecture: The CoolRunner-II platform has been deployed in millions of systems worldwide, offering mature, well-documented design resources.
  3. Power Efficiency: Zero-power standby mode and efficient dynamic operation reduce total system power budget.
  4. Design Security: Built-in security features protect valuable intellectual property.
  5. Long-Term Availability: Backed by AMD/Xilinx’s commitment to extended product lifecycles.

XC2C512-10FGG324I Part Number Decoder

Code Segment Meaning
XC2C Xilinx CoolRunner-II Family
512 512 Macrocells
10 Speed Grade (-10)
FGG Fine-pitch BGA Package (Lead-free)
324 324 Balls/Pins
I Industrial Temperature Range

Related Xilinx CPLD and FPGA Products

For projects requiring different specifications or additional programmable logic resources, explore our comprehensive selection of Xilinx FPGA devices. Our inventory includes the complete CoolRunner-II family as well as advanced FPGA solutions for more complex designs.

XC2C512-10FGG324I Ordering Information

Variant Temperature Range Package RoHS Status
XC2C512-10FGG324I Industrial (-40°C to +100°C) 324-FBGA Compliant
XC2C512-10FGG324C Commercial (0°C to +70°C) 324-FBGA Compliant
XC2C512-10FG324I Industrial (-40°C to +100°C) 324-BGA Check availability
XC2C512-10FG324C Commercial (0°C to +70°C) 324-BGA Check availability

Technical Documentation

For complete design implementation, refer to:

  • XC2C512 CoolRunner-II CPLD Family Datasheet (DS096)
  • CoolRunner-II CPLD Design Considerations Application Note
  • XAPP069: Using In-System Programming with CoolRunner-II CPLDs
  • UG445: CoolRunner-II Architecture and Design Guide

Conclusion

The XC2C512-10FGG324I represents the pinnacle of CPLD technology, combining 512 macrocells, ultra-low power consumption, and industrial-grade reliability in a compact 324-ball BGA package. Whether you’re designing telecommunications equipment, industrial controllers, or battery-powered portable devices, this Xilinx CoolRunner-II CPLD delivers the performance, flexibility, and reliability your application demands.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.