The XC2C512-10FGG324I is a high-performance Complex Programmable Logic Device (CPLD) from AMD’s CoolRunner-II family. This industrial-grade CPLD features 512 macrocells, 12K system gates, and operates at speeds up to 128MHz with ultra-low power consumption. Designed for demanding embedded applications, the XC2C512-10FGG324I delivers exceptional reliability in harsh environments with its extended temperature range of -40°C to +100°C.

---

XC2C512-10FGG324I Key Features and Benefits

The CoolRunner-II XC2C512-10FGG324I stands out in the CPLD market due to its unique combination of high performance and zero standby power technology. Engineers choose this device for applications requiring instant-on capability, battery-powered operation, and robust industrial performance.

Ultra-Low Power Architecture

The XC2C512-10FGG324I incorporates AMD’s advanced Fast Zero Power (FZP) technology. This innovation delivers:

• Quiescent current as low as 14 μA
• Zero standby power consumption
• Reduced thermal management requirements
• Extended battery life for portable applications

High-Speed Performance Specifications

With pin-to-pin delays as fast as 9.2 nanoseconds, the XC2C512-10FGG324I meets the timing requirements of modern high-speed digital designs. The device operates at system frequencies up to 128MHz, making it suitable for communication interfaces, industrial control systems, and signal processing applications.

---

XC2C512-10FGG324I Technical Specifications

General Device Parameters

Electrical Characteristics

Package Information

Operating Conditions

---

XC2C512-10FGG324I Architecture Overview

Advanced Interconnect Matrix (AIM)

The XC2C512-10FGG324I features AMD’s proprietary Advanced Interconnect Matrix technology. The AIM provides low-power signal routing between the 32 function blocks while maintaining predictable timing characteristics. Each function block receives 40 true and complement inputs from the interconnect matrix.

Function Block Structure

Each of the 32 function blocks in the XC2C512-10FGG324I contains:

• 40 × 56 Product-term PLA
• 16 macrocells with configurable flip-flops
• Local and global clock routing
• Synchronous clock enable controls
• Asynchronous set/reset options

DualEDGE Flip-Flop Technology

The XC2C512-10FGG324I incorporates DualEDGE flip-flop capability on a per-macrocell basis. This feature enables high-performance synchronous operation while using lower frequency clocking, significantly reducing dynamic power consumption without sacrificing system throughput.

Clock Distribution Network

The device includes a sophisticated clock management system featuring:

• 3 global clock inputs (GCK0, GCK1, GCK2)
• Programmable clock divider on GCK2
• 8 selectable division ratios (even and odd)
• Per-macrocell clock source selection

---

XC2C512-10FGG324I Part Number Decoder

Understanding the AMD Xilinx part numbering system helps engineers select the correct device variant:

Related Part Numbers

---

XC2C512-10FGG324I Applications

The XC2C512-10FGG324I serves diverse application areas where low power, high reliability, and instant-on operation are critical requirements.

Industrial Automation and Control

• Programmable logic controllers (PLC) interface
• Motor drive control systems
• Industrial sensor interfaces
• Factory automation equipment

Communications Equipment

• Protocol conversion and bridging
• Interface logic for networking equipment
• Clock generation and distribution
• Signal conditioning and level translation

Consumer Electronics

• Battery-powered portable devices
• Power management sequencing
• System configuration control
• Peripheral interface expansion

Automotive and Transportation

• Dashboard control units
• Body electronics modules
• Infotainment system interfaces
• Sensor data acquisition

---

Programming and Development Support

In-System Programming (ISP)

The XC2C512-10FGG324I supports IEEE 1149.1 JTAG-compliant in-system programming. This capability enables:

• Field firmware updates without device removal
• Production programming on assembled boards
• Boundary scan testing for manufacturing
• Design iteration without hardware changes

Development Tools

AMD provides comprehensive development support for the CoolRunner-II family:

• ISE Design Suite: Complete design environment for synthesis, simulation, and implementation
• Vivado Design Suite: Modern development platform with enhanced capabilities
• ModelSim: Industry-standard simulation tool support
• ChipScope Pro: Integrated logic analyzer for debugging

---

XC2C512-10FGG324I vs. Alternative Solutions

Comparison with Other CoolRunner-II Devices

CPLD vs. FPGA Selection

While the XC2C512-10FGG324I CPLD excels in applications requiring instant-on capability and non-volatile configuration, some designs may benefit from FPGA solutions. For projects requiring higher logic density or complex signal processing, explore the complete Xilinx FPGA portfolio for advanced programmable logic options.

---

Quality and Compliance Information

Manufacturing Standards

The XC2C512-10FGG324I is manufactured according to stringent quality standards:

• ISO 9001 certified production facilities
• Automotive-grade qualification available (AEC-Q100)
• Moisture sensitivity level (MSL) documentation
• Full traceability from wafer to finished product

Environmental Compliance

---

Ordering Information for XC2C512-10FGG324I

Package Marking

Devices feature laser-marked identification including:

• AMD logo and part number
• Date code and lot number
• Country of origin
• Lead-free indicator (where applicable)

Moisture Sensitivity

---

XC2C512-10FGG324I Design Considerations

Power Supply Requirements

For optimal performance of the XC2C512-10FGG324I, follow these power supply guidelines:

• Provide stable 1.8V core supply with ±5% tolerance
• Use separate power planes for VCCINT and VCCIO
• Include adequate decoupling capacitors near power pins
• Consider power-on sequence requirements for mixed-voltage designs

PCB Layout Recommendations

• Follow BGA routing guidelines for the 1.0mm pitch package
• Maintain controlled impedance for high-speed signals
• Provide adequate ground plane coverage
• Use proper via-in-pad techniques if required

Thermal Management

The ultra-low power consumption of the XC2C512-10FGG324I typically eliminates the need for heatsinks. However, ensure adequate airflow in enclosed designs and verify thermal performance across the full industrial temperature range.

---

Summary: Why Choose XC2C512-10FGG324I

The XC2C512-10FGG324I represents an optimal solution for engineers requiring:

• High-density programmable logic with 512 macrocells
• Industrial-grade reliability from -40°C to +100°C
• Ultra-low power consumption for battery and portable applications
• Instant-on capability with non-volatile configuration
• High-speed performance at 128MHz operation
• Comprehensive I/O voltage compatibility (1.5V to 3.3V)

With its proven CoolRunner-II architecture and robust industrial specifications, the XC2C512-10FGG324I delivers the performance, reliability, and flexibility demanded by today’s embedded system designs.