Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2C384-7FTG256C: High-Performance CoolRunner-II CPLD for Industrial Applications

Product Details

The XC2C384-7FTG256C is a high-performance Complex Programmable Logic Device (CPLD) from AMD Xilinx’s renowned CoolRunner-II family. This advanced CPLD combines exceptional processing speed with ultra-low power consumption, making it the ideal choice for demanding industrial, telecommunications, and portable electronic applications. Engineers seeking reliable programmable logic solutions will find the XC2C384-7FTG256C delivers outstanding performance in a compact 256-pin FTBGA package.


XC2C384-7FTG256C Technical Specifications

The XC2C384-7FTG256C offers impressive specifications that make it suitable for complex digital logic implementations. Below is a comprehensive overview of its key technical parameters.

Core Specifications Table

Parameter Value
Manufacturer AMD (Xilinx)
Product Family CoolRunner-II CPLD
Part Number XC2C384-7FTG256C
Number of Macrocells 384
Equivalent Gates 9,000 (9K)
Maximum Frequency 217 MHz
Propagation Delay 7.1 ns
Speed Grade -7
Process Technology 0.18 µm CMOS
Core Voltage 1.8V
Package Type 256-Pin FTBGA (Fine-Pitch Thin Ball Grid Array)
Mounting Type Surface Mount
Operating Temperature 0°C to +70°C (Commercial)
RoHS Compliant Yes

I/O and Interface Specifications

Feature Specification
I/O Standards Supported LVCMOS 1.5V, 1.8V, 2.5V, 3.3V
Number of I/O Banks 2
User I/O Pins Up to 240
Input Voltage Tolerance Up to 3.9V
Schmitt-Trigger Inputs Yes (1.5V compatible)
JTAG Support IEEE 1149.1/1532 Boundary-Scan
In-System Programmable (ISP) Yes

Key Features of CoolRunner-II XC2C384-7FTG256C

The XC2C384-7FTG256C incorporates several advanced features that distinguish it from competing CPLD solutions.

Ultra-Low Power Consumption

The CoolRunner-II architecture employs advanced power management techniques including:

  • Zero Power Standby Mode: Quiescent current less than 100µA
  • DataGATE Technology: Selectively disables unused inputs to reduce dynamic power
  • CoolCLOCK Feature: Combines clock division and DualEDGE flip-flops for optimal power efficiency

High-Performance Architecture

The XC2C384-7FTG256C features a sophisticated internal structure designed for maximum performance:

  • Advanced Interconnect Matrix (AIM): Low-power routing architecture connecting all function blocks
  • 8 Function Blocks: Each containing 48 macrocells with 40×56 P-term PLA
  • DualEDGE Triggered Flip-Flops: Enable higher effective clock frequencies
  • Clock Divider: Eight selectable division ratios for flexible clocking options

Flexible I/O Banking

Two independent I/O banks allow simultaneous interfacing with multiple voltage domains (1.5V, 1.8V, 2.5V, and 3.3V), simplifying multi-voltage system designs.


XC2C384-7FTG256C Package Information

256-FTBGA Package Details

Specification Value
Package Code FTG256
Ball Pitch 1.0 mm
Package Dimensions 17 × 17 mm
Ball Count 256
Package Height 1.0 mm (max)
Thermal Resistance (θJA) Approximately 35°C/W

Applications for XC2C384-7FTG256C CPLD

The XC2C384-7FTG256C is engineered for diverse applications requiring reliable programmable logic:

  • Telecommunications Equipment: Protocol conversion, signal routing, and interface bridging
  • Industrial Automation: PLC interface, motor control logic, and sensor data processing
  • Portable Devices: Battery-powered equipment benefiting from ultra-low standby power
  • Consumer Electronics: Display controllers, peripheral interfaces, and timing generators
  • Networking Hardware: Packet processing, address decoding, and control logic
  • FPGA Configuration: In-system programmable PROM for Xilinx FPGA configuration storage
  • Automotive Systems: Dashboard controllers and infotainment interfaces
  • Medical Devices: Signal conditioning and control logic implementation

XC2C384-7FTG256C Part Number Breakdown

Understanding the part number helps identify exact device specifications:

Segment Meaning
XC2C CoolRunner-II CPLD Family
384 384 Macrocells
-7 Speed Grade (-7 = 7.1ns, faster than -10)
FTG Fine-pitch Thin BGA with Lead-Free (RoHS)
256 256-Pin Package
C Commercial Temperature Range (0°C to +70°C)

Related Part Numbers

Part Number Speed Grade Temperature Package
XC2C384-7FTG256I -7 Industrial (-40°C to +85°C) 256-FTBGA
XC2C384-10FTG256C -10 Commercial 256-FTBGA
XC2C384-7TQG144C -7 Commercial 144-TQFP
XC2C384-10TQG144I -10 Industrial 144-TQFP

Design Tools and Development Support

Software Requirements

The XC2C384-7FTG256C is supported by Xilinx ISE Design Suite, which provides:

  • Schematic capture and HDL design entry
  • Synthesis and implementation tools
  • Timing analysis and simulation
  • JTAG programming interface
  • ChipScope debugging capabilities

Development Resources

Engineers working with the XC2C384-7FTG256C have access to:

  • Comprehensive datasheets (DS095 for device specifications)
  • CoolRunner-II family overview (DS090)
  • Application notes for design best practices
  • Reference designs and evaluation boards
  • Active community forums for technical support

Why Choose XC2C384-7FTG256C for Your Design?

The XC2C384-7FTG256C offers several compelling advantages for electronic design engineers:

  1. Optimal Power-Performance Balance: Achieve 217 MHz operation while maintaining ultra-low standby current
  2. Flexible Voltage Interfacing: Two I/O banks support multiple voltage standards in a single device
  3. Compact Form Factor: 256-FTBGA package with 1.0mm ball pitch saves valuable PCB space
  4. Reliable Operation: Industrial-grade variants available for harsh environment applications
  5. Design Security: Supports device security features to protect intellectual property
  6. Long-Term Availability: Part of AMD’s established CPLD portfolio with extended lifecycle support

Ordering Information

When ordering the XC2C384-7FTG256C, ensure you specify the complete part number to receive the correct speed grade, package, and temperature range for your application. Contact authorized distributors for current pricing, stock availability, and lead time information.

The XC2C384-7FTG256C represents an excellent choice for designers requiring high-performance, low-power programmable logic in space-constrained applications. Its combination of 384 macrocells, fast 7.1ns propagation delay, and comprehensive I/O flexibility makes it ideal for modern embedded system designs.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.