Overview of XC18V512PCG20C Configuration Memory
The XC18V512PCG20C is a high-performance in-system programmable configuration PROM manufactured by AMD Xilinx, specifically designed for FPGA configuration storage and programming. This 512-kilobit memory device operates within the 2.5V to 3.3V voltage range and comes in a compact 20-pin PLCC package, making it an ideal solution for embedded systems and programmable logic applications.
Key Features and Technical Specifications
Core Performance Characteristics
The XC18V512PCG20C configuration PROM delivers reliable performance for FPGA bitstream storage with the following specifications:
| Specification |
Details |
| Memory Capacity |
512 Kilobit (512Kb) |
| Supply Voltage |
2.5V / 3.3V |
| Package Type |
20-Pin PLCC (9x9mm) |
| Operating Temperature |
0°C to 70°C (Commercial Grade) |
| Interface Type |
Parallel/Serial |
| Programmability |
In-System Programmable |
| Manufacturer |
AMD Xilinx |
Advanced Programming Capabilities
This configuration PROM supports multiple programming modes, providing flexibility for various FPGA implementation scenarios. The device seamlessly integrates with Xilinx FPGA designs, offering both Master Serial and Slave Parallel configuration modes.
Application Modes and Configuration Options
Master Serial Mode Configuration
When operating in Master Serial mode, the FPGA generates the configuration clock that drives the XC18V512PCG20C PROM. After the chip enable and output enable signals are activated, configuration data becomes available on the DATA output pin, which connects directly to the FPGA’s data input pin. This mode simplifies system design by eliminating the need for external clock generation.
Slave Parallel and SelectMAP Mode
In Slave Parallel or Slave SelectMAP configurations, an external oscillator provides the configuration clock for both the PROM and FPGA. This mode enables faster configuration times and supports data transfer across multiple parallel data lines, making it suitable for applications requiring rapid system initialization.
Cascading Multiple Devices
The XC18V512PCG20C supports device cascading through its CEO (Chip Enable Output) signal, which can drive the CE (Chip Enable) input of subsequent PROMs. This feature allows designers to expand memory capacity beyond 512Kb for larger FPGA bitstreams without additional control logic.
Technical Advantages for FPGA Design
In-System Programmability Benefits
The in-system programmable nature of the XC18V512PCG20C eliminates the need for device removal during firmware updates. Engineers can reprogram configuration data while the device remains soldered to the PCB, significantly reducing maintenance costs and downtime in deployed systems.
Voltage Compatibility and Power Efficiency
Supporting both 2.5V and 3.3V operation, this configuration PROM offers excellent compatibility with various FPGA families and system architectures. The flexible voltage support enables power-optimized designs while maintaining reliable data retention and access performance.
Package and Pin Configuration Details
20-Pin PLCC Package Specifications
| Package Feature |
Specification |
| Package Style |
Plastic Leaded Chip Carrier (PLCC) |
| Physical Dimensions |
9mm x 9mm |
| Lead Type |
J-Lead |
| Pin Count |
20 Pins |
| Mounting Type |
Surface Mount Technology (SMT) |
| Industry Standard |
JEDEC Compliant |
The compact PLCC-20 footprint minimizes board space requirements while providing robust mechanical connections suitable for high-reliability applications.
Compatible FPGA Families and Integration
The XC18V512PCG20C configuration PROM maintains compatibility with various Xilinx FPGA families, including Spartan, Virtex, and other programmable logic devices requiring external configuration memory. The device integrates seamlessly with industry-standard FPGA development tools, including Xilinx Vivado Design Suite and ISE software.
Performance Specifications and Timing
Access Time and Clock Frequency
| Performance Parameter |
Typical Value |
| Access Time |
Fast access after CE/OE enable |
| Configuration Clock |
FPGA-generated or external |
| Data Output Delay |
Minimal propagation delay |
| Power Consumption |
Low-power operation |
Quality and Reliability Standards
Industrial Grade Specifications
The commercial temperature grade version operates reliably across the 0°C to 70°C range, making it suitable for standard industrial and commercial applications. The device employs proven PROM technology ensuring data retention and configuration reliability over extended operational periods.
RoHS Compliance Status
Verification of environmental compliance status is recommended through official AMD Xilinx documentation or authorized distributors to ensure adherence to current regulations and standards.
Design Implementation Guidelines
Integration with FPGA Development Workflow
Engineers implementing the XC18V512PCG20C should follow these design considerations:
- Configuration Mode Selection: Choose between Master Serial and Slave Parallel based on system clock requirements
- Power Supply Design: Ensure clean 2.5V or 3.3V supply with adequate decoupling capacitors
- Signal Routing: Maintain proper trace lengths between PROM and FPGA for timing integrity
- Programming Interface: Implement JTAG or dedicated programming connections for in-system updates
PCB Layout Recommendations
Optimal PCB design for the XC18V512PCG20C includes positioning the device close to the target FPGA, implementing proper ground planes, and using appropriate trace impedance for high-speed configuration signals.
Ordering Information and Part Number Breakdown
Part Number Nomenclature
The complete part number XC18V512PCG20C breaks down as follows:
| Code Segment |
Meaning |
| XC18V |
Configuration PROM family identifier |
| 512 |
Memory density (512 Kilobit) |
| P |
Plastic package |
| C |
Package pin count indicator |
| G |
Lead-free package option |
| 20 |
Pin count (20 pins) |
| C |
Commercial temperature grade (0°C to 70°C) |
Alternative Solutions and Cross-Reference
Engineers seeking alternatives may consider other memory densities within the XC18V family, including 1-megabit, 2-megabit, and 4-megabit options. Different package variants such as SOIC are also available for designs with specific form factor requirements.
Storage and Handling Requirements
Environmental Considerations
Proper storage conditions for the XC18V512PCG20C include moisture-sensitive device precautions, ESD-safe handling procedures, and temperature-controlled environments prior to PCB assembly. Following industry-standard MSL (Moisture Sensitivity Level) guidelines ensures optimal soldering results and long-term reliability.
Conclusion
The XC18V512PCG20C represents a proven configuration memory solution for FPGA-based designs requiring reliable, reprogrammable bitstream storage. Its combination of in-system programmability, flexible voltage operation, compact packaging, and industry-standard interfaces makes it an excellent choice for embedded systems, telecommunications equipment, industrial automation, and other applications utilizing programmable logic devices.
For detailed technical specifications, timing diagrams, and application notes, designers should reference the official AMD Xilinx datasheet and integration guides to ensure optimal implementation in their specific applications.
