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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC18V512PC20I: In-System Programmable Configuration PROM for FPGA Applications

Product Details

Overview of XC18V512PC20I Configuration PROM

The XC18V512PC20I is a high-performance, in-system programmable configuration PROM manufactured by AMD Xilinx (formerly Xilinx Inc.). This 512-kilobit memory device provides a reliable, cost-effective solution for storing and reprogramming FPGA configuration bitstreams. Designed specifically for Xilinx FPGA systems, the XC18V512PC20I operates at industrial temperature ranges and delivers exceptional programming flexibility for embedded applications.

Key Specifications and Features

Technical Specifications Table

Specification Value
Part Number XC18V512PC20I
Manufacturer AMD Xilinx (Xilinx Inc.)
Memory Size 512 Kilobit (512Kb)
Supply Voltage 3.3V (3V to 3.6V)
Operating Temperature -40°C to +85°C (Industrial)
Package Type 20-Pin PLCC (Plastic Leaded Chip Carrier)
Package Dimensions 9x9mm
Mounting Type Surface Mount Technology (SMT)
Programming Type In-System Programmable (ISP)
Product Status Active

Performance Characteristics Table

Feature Specification
Program/Erase Cycles 20,000 cycles endurance
Configuration Modes Serial (Slow/Fast) and Parallel
Serial Speed Up to 33 MHz
Parallel Bandwidth Up to 264 Mb/s at 33 MHz
I/O Voltage Tolerance 5V-tolerant (accepts 5V, 3.3V, 2.5V signals)
Output Capability 3.3V or 2.5V
JTAG Support IEEE Std 1149.1 compliant

Product Features and Benefits

Advanced FLASH Memory Technology

The XC18V512PC20I utilizes advanced CMOS FLASH process technology, offering several advantages:

  • High endurance: 20,000 program/erase cycles ensure long-term reliability
  • Wide temperature operation: Functions reliably from -40°C to +85°C
  • Low power consumption: Optimized for energy-efficient embedded systems
  • Non-volatile storage: Retains configuration data without power

Dual Configuration Modes

Serial Configuration Mode

The serial configuration mode provides a simple, cost-effective interface requiring minimal pins. Operating at speeds up to 33 MHz, this mode is ideal for space-constrained applications where board real estate is premium.

Parallel Configuration Mode

For applications requiring faster configuration times, the parallel mode delivers exceptional performance with bandwidth up to 264 Mb/s at 33 MHz. This high-speed option significantly reduces FPGA boot time in time-critical applications.

FPGA Configuration Support

The XC18V512PC20I seamlessly interfaces with Xilinx FPGAs in multiple operating modes:

  • Master Serial Mode: FPGA generates configuration clock
  • Master SelectMAP Mode: FPGA-controlled high-speed parallel configuration
  • Slave Parallel/SelectMAP Mode: External oscillator-driven configuration

In-System Programming Capabilities

The in-system programmable architecture allows field updates without removing the device from the circuit board. Benefits include:

  • Remote firmware updates
  • Reduced maintenance costs
  • Extended product lifecycle
  • Rapid prototyping and development cycles

Application Areas and Use Cases

Industrial Automation Systems

The industrial-grade temperature rating makes the XC18V512PC20I ideal for:

  • Programmable Logic Controllers (PLCs)
  • Industrial control systems
  • Factory automation equipment
  • Process control applications

Communications Infrastructure

Reliable FPGA configuration storage for:

  • Telecommunications equipment
  • Network routers and switches
  • Base station controllers
  • Data center hardware

Embedded Computing Systems

Perfect for embedded applications requiring:

  • System-on-Chip (SoC) FPGA configurations
  • Reconfigurable computing platforms
  • Edge computing devices
  • IoT gateway systems

Test and Measurement Equipment

Essential component for:

  • Oscilloscopes and spectrum analyzers
  • Signal generators
  • Protocol analyzers
  • Laboratory instrumentation

Design and Development Support

JTAG Boundary-Scan Support

The XC18V512PC20I features IEEE Std 1149.1 compliant JTAG interface, enabling:

  • In-circuit testing and debugging
  • Board-level interconnect verification
  • Manufacturing test coverage
  • Standard FPGA configuration initiation

Software Compatibility

Designed for seamless integration with Xilinx development tools:

  • ISE Foundation software package support
  • Vivado Design Suite compatibility
  • Simplified programming and configuration
  • Comprehensive documentation and examples

Cascadable Architecture

Multiple XC18V512PC20I devices can be cascaded to:

  • Store longer configuration bitstreams
  • Support multiple FPGA configurations
  • Enable dynamic reconfiguration scenarios
  • Accommodate complex system requirements

Package and Pin Configuration

20-Pin PLCC Package Details

Package Feature Specification
Package Type PLCC (Plastic Leaded Chip Carrier)
Pin Count 20 pins
Body Size 9x9mm
Pin Pitch J-Lead configuration
Mounting Surface mount (SMT)
RoHS Compliance Lead-free available

Pin Function Summary

The 20-pin configuration includes:

  • Power supply pins (VCC, GND)
  • Data output (D0)
  • Clock input (CLK)
  • Chip enable (CE)
  • Output enable (OE)
  • Reset and control signals
  • JTAG interface pins (TDI, TDO, TMS, TCK)

Comparison with Related Products

XC18V512 Family Variants

Part Number Temperature Range Voltage Application
XC18V512PC20I -40°C to +85°C 3.3V Industrial applications
XC18V512PC20C 0°C to +70°C 3.3V Commercial applications
XC18V512PCG20C 0°C to +70°C 2.5V/3.3V Dual-voltage systems

Quality and Reliability

Manufacturing Standards

AMD Xilinx maintains rigorous quality control:

  • ISO 9001 certified manufacturing
  • Automotive-grade quality processes
  • Comprehensive testing protocols
  • Long-term reliability validation

Reliability Features

  • ESD protection on all pins
  • Latch-up resistant design
  • Temperature cycling tested
  • Moisture sensitivity level (MSL) rated

Ordering and Availability

Part Number Breakdown

XC18V512PC20I decodes as:

  • XC18V = Xilinx configuration PROM family
  • 512 = 512 Kilobit memory size
  • PC = PLCC package
  • 20 = 20-pin package
  • I = Industrial temperature range

Supply Chain Information

The XC18V512PC20I is available through authorized distributors with:

  • Active production status
  • Global availability
  • Standard lead times
  • Volume pricing options
  • Technical support included

Environmental Specifications

Storage and Operating Conditions

Condition Specification
Operating Temperature -40°C to +85°C
Storage Temperature -65°C to +150°C
Relative Humidity 5% to 95% non-condensing
Operating Voltage Range 3.0V to 3.6V

Technical Support and Resources

Documentation Available

  • Complete datasheet with electrical specifications
  • Application notes for FPGA configuration
  • Programming guidelines
  • PCB layout recommendations
  • Thermal management guidelines

Design Resources

Access comprehensive support materials including:

  • Reference designs
  • Evaluation boards information
  • Programming examples
  • Troubleshooting guides
  • FAQs and knowledge base

Conclusion

The XC18V512PC20I represents a proven, reliable solution for FPGA configuration storage in demanding industrial applications. With its robust temperature range, flexible programming options, and comprehensive support for Xilinx FPGAs, this configuration PROM delivers the performance and reliability required for mission-critical embedded systems. Whether designing telecommunications equipment, industrial controllers, or advanced test instruments, the XC18V512PC20I provides the configuration memory foundation essential for successful FPGA-based designs.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.