Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XC18V01SO20I: High-Performance Configuration PROM for FPGA Applications

Product Details

Overview of the XC18V01SO20I Configuration Memory

The XC18V01SO20I is a professional-grade, in-system programmable configuration PROM (Programmable Read-Only Memory) designed specifically for FPGA configuration applications. Manufactured by AMD (formerly Xilinx), this industrial-temperature range device delivers reliable, non-volatile memory storage for Xilinx FPGA configurations in demanding environments.

As part of AMD’s XC18V00 Series, the XC18V01SO20I provides engineers and designers with a robust solution for storing FPGA bitstreams, offering 1-Megabit (1Mb) memory capacity in a compact 20-pin SOIC package. This configuration PROM supports both serial and parallel programming modes, making it versatile for various design architectures.

Key Technical Specifications

XC18V01SO20I Core Features

Specification Details
Part Number XC18V01SO20I
Manufacturer AMD (Xilinx)
Memory Capacity 1 Megabit (1Mb)
Supply Voltage 3.3V (VCC)
Package Type 20-Pin SOIC (Small Outline Integrated Circuit)
Operating Temperature -40°C to +85°C (Industrial Grade)
Programming Interface JTAG, Serial, Parallel
Product Status Active

Electrical and Performance Characteristics

Parameter Specification
Supply Voltage Range 3.0V to 3.6V
Programming Cycles 20,000 minimum erase/write cycles
Data Retention 20 years minimum
Programming Method In-System Programmable (ISP)
Interface Standard IEEE 1149.1 JTAG Compliant
Security Features Read protection capability

Comprehensive Technical Description

Memory Architecture and Design

The XC18V01SO20I features advanced non-volatile memory architecture optimized for FPGA configuration storage. With 1-Megabit capacity organized for efficient bitstream storage, this configuration PROM ensures fast and reliable FPGA boot-up sequences. The device incorporates Flash-based technology that provides excellent data retention characteristics while maintaining low power consumption during standby operations.

In-System Programmability (ISP) Capabilities

One of the standout features of the XC18V01SO20I is its comprehensive in-system programmability. Engineers can program the device after it has been soldered onto the PCB, eliminating the need for costly pre-programming or socket-based solutions. This ISP capability supports:

  • JTAG Boundary-Scan Programming: Full IEEE 1149.1 compliance enables seamless integration with standard programming tools
  • Serial Configuration Mode: Direct connection to FPGA serial configuration pins
  • Parallel Configuration Support: High-speed programming for production environments

Package and Pin Configuration

The 20-pin SOIC package provides an optimal balance between pin count and board space requirements. Key pin functions include:

Pin Function Description
VCC Power Supply (3.3V)
GND Ground Reference
CLK Configuration Clock Input
DIN Serial Data Input
DOUT Serial Data Output
CE (Chip Enable) Device Selection Control
OE/RESET Output Enable/Reset Function
CCLK Configuration Clock

Application Use Cases

Primary Applications for XC18V01SO20I

The XC18V01SO20I configuration PROM excels in numerous industrial and commercial applications:

1. FPGA Configuration Storage

Provides reliable bitstream storage for Xilinx Spartan, Virtex, and other FPGA families, ensuring consistent power-up configuration.

2. Industrial Control Systems

The industrial temperature range (-40°C to +85°C) makes this device ideal for harsh environment applications including factory automation, process control, and manufacturing equipment.

3. Telecommunications Equipment

Supports base stations, routers, and network infrastructure where reliable FPGA configuration is critical for system operation.

4. Embedded Systems Development

Perfect for prototype development and production systems requiring field-upgradeable FPGA configurations.

Programming and Configuration Modes

Master Serial Mode Configuration

In Master Serial Mode, the XC18V01SO20I acts as the configuration master, controlling the clock and data transfer to the target FPGA. This mode is particularly useful for:

  • Single FPGA configurations
  • Simple system architectures
  • Cost-sensitive designs

Slave Parallel Mode Operation

For applications requiring faster configuration times, the Slave Parallel mode enables high-speed data transfer with configuration rates significantly exceeding serial mode capabilities.

Daisy-Chain Configuration

Multiple XC18V01SO20I devices can be cascaded to support larger bitstream requirements, with the CEO (Chip Enable Output) pin facilitating seamless device chaining.

Reliability and Quality Standards

Industrial-Grade Reliability Features

Reliability Parameter Specification
Endurance 20,000 program/erase cycles guaranteed
Data Retention Minimum 20 years at room temperature
ESD Protection HBM (Human Body Model) compliant
Temperature Cycling -40°C to +85°C operational range
MTBF Rating Exceeds 1 million hours

Quality Certifications

The XC18V01SO20I meets stringent quality standards including:

  • RoHS compliant (lead-free manufacturing)
  • Automotive-grade quality processes
  • ISO 9001 certified manufacturing

Design Considerations and Best Practices

PCB Layout Guidelines

When designing with the XC18V01SO20I, consider these layout recommendations:

  1. Power Supply Decoupling: Place 0.1µF ceramic capacitors close to VCC pins
  2. Pull-up Resistors: Use 4.7kΩ pull-ups on OE/RESET and DONE pins as recommended
  3. Signal Integrity: Maintain short trace lengths for clock and data signals
  4. Ground Plane: Implement solid ground plane for noise immunity

Programming Considerations

  • JTAG Chain Design: Ensure proper termination and bypass capacitors in JTAG chains
  • Voltage Levels: Verify 3.3V compatibility with target FPGA I/O standards
  • Clock Frequency: Observe maximum clock frequency specifications for your configuration mode

Competitive Advantages

Why Choose XC18V01SO20I?

  1. Proven Reliability: Backed by AMD/Xilinx’s decades of FPGA ecosystem experience
  2. Wide Temperature Range: Industrial-grade operation from -40°C to +85°C
  3. Flexible Programming: Multiple configuration modes support diverse design requirements
  4. Long-Term Support: Active product with guaranteed long-term availability
  5. Cost-Effective Solution: Optimal price-to-performance ratio for 1Mb configurations

Comparison with Similar Configuration PROMs

Feature XC18V01SO20I XC18V01SO20C XC18V512SO20I
Temperature Range -40°C to +85°C 0°C to +70°C -40°C to +85°C
Memory Size 1 Megabit 1 Megabit 512 Kilobit
Package 20-Pin SOIC 20-Pin SOIC 20-Pin SOIC
Supply Voltage 3.3V 2.5V/3.3V 3.3V

Technical Support and Resources

Available Documentation

Engineers working with the XC18V01SO20I have access to comprehensive technical resources:

  • Detailed datasheets with electrical specifications
  • Programming user guides
  • Application notes for common use cases
  • Reference designs and schematics
  • JTAG programming tool support

Development Tools Compatibility

The XC18V01SO20I is fully compatible with:

  • Xilinx ISE Design Suite
  • Vivado Design Suite
  • Platform Cable USB II
  • Third-party JTAG programmers

Ordering Information and Package Marking

Part Number Breakdown

XC18V01SO20I decoding:

  • XC18V = XC18V00 Series family
  • 01 = 1 Megabit memory density
  • SO = SOIC package
  • 20 = 20-pin configuration
  • I = Industrial temperature range (-40°C to +85°C)

Package Marking

Each device is clearly marked with:

  • Part number
  • Date code
  • Country of origin
  • Lot traceability code

Storage and Handling Requirements

Proper Device Storage

To maintain optimal device reliability:

  • Store in moisture barrier bag with desiccant
  • Maintain storage temperature between -55°C to +150°C
  • Observe moisture sensitivity level (MSL) ratings
  • Follow ESD precautions during handling

Reflow Soldering Guidelines

The XC18V01SO20I SOIC package is compatible with standard lead-free reflow profiles:

  • Peak temperature: 260°C maximum
  • Time above 217°C: 60-150 seconds
  • Ramp rate: 3°C/second maximum

Future-Proofing Your Design

Long-Term Availability Commitment

AMD maintains active production and support for the XC18V01SO20I as a critical component in their FPGA ecosystem. The device is not planned for obsolescence and represents a safe choice for designs requiring multi-year production support.

Migration Path Options

For designs requiring expansion, the XC18V00 family offers clear migration paths:

  • XC18V02 (2 Megabit) for larger configurations
  • XC18V04 (4 Megabit) for complex FPGA bitstreams
  • Pin-compatible upgrades minimize redesign requirements

Conclusion

The XC18V01SO20I configuration PROM represents an optimal choice for engineers designing FPGA-based systems requiring reliable, industrial-grade configuration memory. With its 1-Megabit capacity, robust temperature range, flexible programming options, and proven reliability, this device delivers exceptional value for embedded systems, industrial control, telecommunications, and numerous other applications.

Whether you’re developing a new FPGA-based product or maintaining existing designs, the XC18V01SO20I provides the performance, reliability, and flexibility needed for demanding applications. Combined with AMD’s comprehensive technical support and long-term product availability commitment, this configuration PROM ensures your design remains supported throughout its entire lifecycle.

For more information about FPGA solutions and compatible configuration devices, visit Xilinx FPGA resources and technical documentation.


Frequently Asked Questions (FAQ)

Q: What is the difference between XC18V01SO20I and XC18V01SO20C? A: The primary difference is the operating temperature range. The “I” suffix indicates industrial temperature range (-40°C to +85°C), while the “C” suffix denotes commercial temperature range (0°C to +70°C).

Q: Can I reprogram the XC18V01SO20I multiple times? A: Yes, the device supports a minimum of 20,000 program/erase cycles, making it suitable for development and field updates.

Q: Which FPGAs are compatible with the XC18V01SO20I? A: The device is compatible with Xilinx Spartan, Virtex, Virtex-E, Virtex-II Pro, and other Xilinx FPGA families that support 3.3V serial configuration.

Q: Is special programming hardware required? A: Standard JTAG programming tools such as Platform Cable USB II or compatible third-party programmers can be used to program the device.

Q: What is the typical power consumption? A: The device features low standby current (typically under 10µA) and moderate active current during configuration, making it suitable for power-sensitive applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.