Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XA7A50T-2CSG325I: Automotive-Grade Artix-7 FPGA for Industrial Applications

Product Details

Overview of XA7A50T-2CSG325I FPGA

The XA7A50T-2CSG325I is an automotive-grade Field Programmable Gate Array (FPGA) from AMD Xilinx’s XA Artix-7 family. This high-performance programmable logic device combines exceptional reliability with advanced processing capabilities, making it ideal for demanding automotive and industrial applications. Built on 28nm High-K Metal Gate (HKMG) process technology, this FPGA delivers outstanding performance while maintaining low power consumption.

As a member of the automotive-qualified Xilinx FPGA portfolio, the XA7A50T-2CSG325I meets stringent automotive standards with extended temperature range operation from -40°C to +125°C junction temperature.

Key Technical Specifications

Core Performance Features

Specification Value Description
Logic Cells 52,160 Programmable logic capacity for complex designs
CLB Slices 8,150 Configurable Logic Block slices
DSP Slices 120 Digital Signal Processing blocks
Block RAM 2,700 Kbit On-chip memory resources
Max Distributed RAM 400 Kbit Distributed memory capacity
Total I/O Pins 150 User-accessible I/O pins
Transceivers Not included No built-in high-speed serial transceivers

Package and Physical Characteristics

Parameter Specification
Package Type CSBGA (Chip Scale Ball Grid Array)
Pin Count 325 pins (324-ball CSPBGA)
Package Dimensions Compact 17mm x 17mm footprint
Mounting Type Surface Mount Technology (SMT)
Weight Lightweight design for space-critical applications

Electrical and Operating Specifications

Characteristic Range/Value
Supply Voltage (VCCINT) 950 mV to 1.05 V (nominal 1.0V)
Speed Grade -2 (high performance)
Operating Temperature -40°C to +125°C (Automotive Extended)
Maximum Junction Temperature 125°C
Power Consumption Low power HPL technology
ESD Rating Industry-standard protection

Advanced FPGA Architecture Features

Programmable Logic Resources

The XA7A50T-2CSG325I incorporates advanced architectural features that enable flexible, high-performance designs:

  • 6-Input LUT Technology: Advanced lookup tables configurable as distributed memory for optimal logic implementation
  • Dual-Port Block RAM: 36 Kb blocks with built-in FIFO logic for efficient data buffering
  • Mixed-Mode Clock Manager (MMCM): Advanced clock generation and management
  • Phase-Locked Loops (PLL): Precise frequency synthesis and clock distribution
  • Internal Configuration Access Port (ICAP): Dynamic partial reconfiguration capability

Memory Architecture

Memory Type Capacity Features
Block RAM (BRAM) 2,700 Kbit 36 Kb dual-port blocks with FIFO
Distributed RAM 400 Kbit Implemented using LUT resources
Memory Interfaces DDR3 support Up to 800 Mb/s bandwidth
Configuration Memory Internal Secure bitstream storage

DSP Processing Capabilities

The 120 DSP48E1 slices provide dedicated digital signal processing resources:

  • 25 x 18 multipliers for high-speed arithmetic operations
  • 48-bit accumulator for extended precision
  • Pre-adder for efficient filter implementations
  • Pattern detector for advanced DSP algorithms
  • Performance: 628 MHz maximum operating frequency

I/O and Interface Capabilities

SelectIO Technology

The XA7A50T-2CSG325I features Xilinx’s advanced SelectIO technology with 150 user I/O pins supporting multiple standards:

Supported I/O Standards

Standard Voltage Application
LVCMOS 1.2V, 1.5V, 1.8V, 2.5V, 3.3V General-purpose I/O
LVTTL 3.3V Legacy interface support
HSTL Class I and II High-speed memory interfaces
SSTL 1.5V, 1.8V DDR3 memory connections
LVDS Differential signaling High-speed serial data
TMDS Video interfaces Display connectivity

Memory Interface Support

  • DDR3 SDRAM: Up to 1,866 Mb/s with built-in PHY
  • DDR2 SDRAM: Legacy memory support
  • LPDDR2: Low-power mobile memory
  • QDR II+: High-bandwidth SRAM interfaces

Automotive-Grade Qualification

AEC-Q100 Compliance

The XA7A50T-2CSG325I is fully qualified to automotive standards:

  • Grade 2 qualification: -40°C to +125°C junction temperature
  • Extended reliability testing: Meets automotive quality requirements
  • Production Part Approval Process (PPAP): Documentation support available
  • Automotive Safety Integrity Level (ASIL): Suitable for safety-critical applications

Quality and Reliability

Metric Specification
MTBF Extended Mean Time Between Failures
Quality Grade Automotive (XA series)
Radiation Tolerance Standard commercial grade
Moisture Sensitivity MSL 3 rating
Package Reliability IPC/JEDEC standards compliant

Application Areas

Automotive Applications

The XA7A50T-2CSG325I excels in automotive systems:

  • Advanced Driver Assistance Systems (ADAS): Sensor fusion, image processing
  • Infotainment Systems: Graphics processing, multimedia interfaces
  • Instrument Clusters: High-resolution digital displays
  • Vehicle Networking: CAN, LIN, FlexRay protocol implementation
  • Motor Control: Real-time control algorithms
  • Camera Processing: Multi-camera vision systems

Industrial Control Systems

Ideal for harsh industrial environments:

  • Programmable Logic Controllers (PLCs): Real-time control processing
  • Industrial Networking: EtherCAT, PROFINET, EtherNet/IP
  • Machine Vision: High-speed image processing
  • Robotics: Motion control and sensor integration
  • Process Automation: Data acquisition and control
  • Smart Manufacturing: Industry 4.0 connectivity

Embedded Processing

Perfect for embedded system designs:

  • Soft-core Processors: MicroBlaze processor implementation
  • Co-processing: Hardware acceleration alongside CPUs
  • Protocol Bridging: Interface conversion and protocol translation
  • Signal Processing: Real-time DSP applications
  • Data Encryption: Hardware security implementations

Design Tools and Software Support

Vivado Design Suite

The XA7A50T-2CSG325I is fully supported by Xilinx’s comprehensive development environment:

  • Vivado Design Suite: Complete RTL-to-bitstream design flow
  • Vivado HLS: High-Level Synthesis for C/C++ development
  • Vivado IP Integrator: Graphical system design
  • SDK: Software Development Kit for embedded processors
  • ChipScope: Integrated logic analyzer for debugging

Programming and Configuration

Method Description Speed
JTAG Industry-standard boundary scan Standard
Master SPI Serial flash memory boot Fast
Master BPI Parallel flash boot Very Fast
Slave Serial External controller configuration Flexible
SelectMAP Parallel configuration interface Fastest

Performance Benchmarks

Processing Performance

The XA7A50T-2CSG325I delivers impressive computational capabilities:

  • Logic Density: 52,160 logic cells for complex designs
  • DSP Performance: Up to 264 GMAC/s aggregate throughput
  • Memory Bandwidth: High-speed block RAM access
  • I/O Bandwidth: 52 Gb/s total I/O throughput
  • Power Efficiency: 50% reduction versus previous generations

Clocking Performance

Clock Resource Quantity Frequency
MMCMs 5 Up to 1,066 MHz VCO
PLLs Built-in MMCM Up to 800 MHz output
Global Clock Buffers 32 Low-skew distribution
Regional Clock Buffers 64 Reduced power consumption

Package and Footprint Details

CSBGA-325 Package Information

The compact 17mm x 17mm CSBGA package offers:

  • Ball Pitch: 0.8mm for high-density routing
  • Height: Low-profile design for space-constrained applications
  • Thermal Performance: Efficient heat dissipation
  • Moisture Sensitivity: MSL-3 rating
  • Halogen-Free: RoHS compliant, environmentally friendly

PCB Design Considerations

Aspect Recommendation
Layer Count Minimum 6-layer PCB recommended
Via Technology 0.15mm microvias preferred
Trace Impedance 50Ω single-ended, 100Ω differential
Power Planes Dedicated VCCINT, VCCO, VCCAUX
Decoupling Multiple bulk and ceramic capacitors

Power Management

Power Supply Architecture

The XA7A50T-2CSG325I requires multiple power rails:

Rail Voltage Function Typical Current
VCCINT 1.0V Core logic supply High
VCCAUX 1.8V Auxiliary circuits Medium
VCCO 1.2V-3.3V I/O bank supplies Variable
VCCBRAM 1.0V Block RAM supply Medium

Power Consumption Optimization

  • Clock Gating: Automatic power reduction for unused logic
  • Intelligent Clock Networks: Optimized clock tree synthesis
  • I/O Standards Selection: Lower voltage standards reduce power
  • Dynamic Reconfiguration: Runtime power management

Comparison with Similar FPGAs

XA Artix-7 Family Comparison

Model Logic Cells DSP Slices Block RAM I/O Pins
XA7A25T 23,360 80 1,620 Kbit 150
XA7A50T 52,160 120 2,700 Kbit 150
XA7A75T 76,800 180 3,780 Kbit 210
XA7A100T 101,440 240 4,860 Kbit 300

Competitive Advantages

The XA7A50T-2CSG325I offers unique benefits:

  • Automotive Qualification: Full AEC-Q100 Grade 2 compliance
  • Proven Architecture: Based on mature 28nm technology
  • Software Ecosystem: Comprehensive Vivado tool support
  • Cost-Effective: Optimal price-performance ratio
  • Legacy Migration: Pin-compatible upgrades within family

Development Resources

Reference Designs

Xilinx provides extensive reference designs for rapid prototyping:

  • Embedded System Templates: Pre-configured processor systems
  • Communication Protocols: CAN, SPI, I2C, UART implementations
  • Video Processing: Camera interface and display controllers
  • Motor Control: FOC and other control algorithms
  • Industrial Networking: EtherCAT, PROFINET examples

Evaluation Boards

Compatible development platforms include:

  • Arty A7-100T: Affordable evaluation platform
  • Nexys A7: Educational development board
  • Custom Carrier Boards: Application-specific designs

Ordering and Availability

Part Number Breakdown

XA7A50T-2CSG325I decodes as:

  • XA: Automotive-grade qualification
  • 7A: Artix-7 architecture family
  • 50T: 52,160 logic cells
  • -2: Speed grade (high performance)
  • CSG325: Package type and pin count
  • I: Industrial temperature range

Package Options

The XA7A50T is available in multiple packages:

Package Pins Size Application
CPG236 238 10mm x 10mm Ultra-compact designs
CSG325 325 17mm x 17mm Balanced I/O and size
FGG484 484 23mm x 23mm Maximum I/O availability

Lead Time and Stock

  • Standard Lead Time: 12-16 weeks for production quantities
  • Distribution Stock: Available from authorized distributors
  • Minimum Order: Varies by distributor
  • Volume Pricing: Quantity discounts available

Environmental and Compliance

Regulatory Certifications

Standard Compliance
RoHS Compliant – lead-free
REACH Compliant – SVHC-free
AEC-Q100 Grade 2 qualified
ISO 26262 Safety documentation available
ITAR Non-ITAR, exportable

Environmental Operating Conditions

  • Storage Temperature: -65°C to +150°C
  • Operating Humidity: 5% to 95% non-condensing
  • Altitude: Up to 5,000 meters
  • Vibration: Per automotive standards
  • Shock: High-G rated for automotive use

Technical Support and Documentation

Available Documentation

  • Product Datasheet: Detailed electrical specifications
  • User Guide: Architecture and feature descriptions
  • PCB Design Guide: Layout recommendations
  • Programming Guide: Configuration instructions
  • Application Notes: Design best practices
  • Errata: Known issues and workarounds

Support Channels

  • Xilinx Support Portal: Online technical assistance
  • Community Forums: User discussions and solutions
  • Field Application Engineers: Direct technical support
  • Training Resources: Online courses and tutorials
  • Design Services: Third-party design assistance

Migration and Upgrade Path

Family Scalability

The Artix-7 family offers seamless migration:

  • Pin Compatibility: Same package footprint across density options
  • Software Compatibility: Single toolchain for entire family
  • IP Reuse: Design portability between devices
  • Performance Scaling: Upgrade to higher logic capacity

Future-Proof Design

Planning for long-term production:

  • Product Longevity: Automotive products have extended lifecycles
  • Supply Chain: Multiple manufacturing sites
  • Second Source: Industry-standard interfaces
  • Technology Roadmap: Clear migration path to UltraScale+

Conclusion

The XA7A50T-2CSG325I automotive-grade FPGA represents an ideal solution for demanding applications requiring high reliability, extended temperature operation, and proven technology. With 52,160 logic cells, 120 DSP slices, and comprehensive automotive qualification, this Xilinx FPGA delivers exceptional performance for automotive, industrial, and embedded systems.

Whether implementing advanced driver assistance systems, industrial control algorithms, or complex embedded processing, the XA7A50T-2CSG325I provides the flexibility, performance, and reliability required for mission-critical applications. Backed by Xilinx’s comprehensive Vivado Design Suite and extensive ecosystem support, designers can rapidly develop and deploy innovative solutions with confidence.

Why Choose XA7A50T-2CSG325I?

  • Automotive-Qualified: AEC-Q100 Grade 2 compliant
  • High Performance: 628 MHz DSP operation, 52K logic cells
  • Extended Temperature: -40°C to +125°C operation
  • Comprehensive Tools: Full Vivado Design Suite support
  • Proven Technology: Mature 28nm process node
  • Cost-Effective: Optimal price-performance ratio
  • Long-Term Supply: Automotive-grade product lifecycle

For more information about Xilinx FPGAs and to explore the complete product portfolio, visit our comprehensive Xilinx FPGA resource center.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.