Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XA7A50T-1CSG324Q: High-Performance Automotive-Grade FPGA for Advanced Applications

Product Details

Overview of the XA7A50T-1CSG324Q FPGA

The XA7A50T-1CSG324Q is a cutting-edge automotive-qualified Field Programmable Gate Array (FPGA) from AMD’s (formerly Xilinx) renowned Artix-7 XA family. This advanced programmable logic device delivers exceptional performance for mission-critical automotive and industrial applications, featuring 52,160 logic cells with 28nm technology in a compact 324-pin CSBGA package.

As a member of the Artix-7 XA series, the XA7A50T-1CSG324Q combines low power consumption with high processing capability, making it ideal for designers seeking reliable, cost-effective solutions for complex digital designs. This automotive-grade FPGA meets stringent AEC-Q100 qualification standards, ensuring robust performance in harsh environmental conditions.

Key Technical Specifications

Core FPGA Architecture

Specification Value
Logic Cells 52,160
Configurable Logic Blocks (CLBs) 6,500
Total I/O Pins 210 user I/O
Block RAM 2,764,800 bits (2.7 Mb)
DSP Slices 120
Process Technology 28nm HKMG (High-K Metal Gate)

Package and Physical Characteristics

Parameter Specification
Package Type 324-LFBGA, CSPBGA
Total Pins 324
Package Size 15mm × 15mm
Ball Pitch 0.8mm
Mounting Type Surface Mount
Maximum Height 1.5mm (typical)

Electrical and Environmental Ratings

Feature Rating
Supply Voltage 1.0V (core)
Operating Temperature -40°C to +125°C (Automotive Grade)
Speed Grade -1 (Standard Performance)
AEC-Q100 Qualified Yes (Automotive Grade)
RoHS Compliance ROHS3 Compliant
Lead Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Moisture Sensitivity Level MSL 3

Advanced Features and Capabilities

High-Performance Logic Architecture

The XA7A50T-1CSG324Q utilizes advanced 6-input Look-Up Table (LUT) technology that can be configured as distributed memory, providing designers with exceptional flexibility. This architecture enables efficient implementation of complex combinatorial and sequential logic designs with optimized resource utilization.

Memory Resources

With substantial on-chip memory capabilities, this FPGA includes:

  • 36 Kb dual-port Block RAM with built-in FIFO logic
  • Distributed RAM configurable through LUTs
  • 337.5 KB total Block RAM capacity
  • Built-in error correction capabilities

DSP Performance

The integrated DSP slices deliver:

  • 264 GMAC/s (Giga Multiply-Accumulate operations per second) DSP performance
  • 25×18 multipliers with pre-adders
  • 48-bit accumulator for high-precision calculations
  • Optimized for signal processing and mathematical operations

High-Speed Connectivity

The XA7A50T-1CSG324Q provides robust I/O capabilities:

  • 52 Gb/s total I/O bandwidth
  • High-performance SelectIO™ technology
  • DDR3 memory interface support up to 1,866 Mb/s
  • High-speed serial connectivity from 600 Mb/s to 6.6 Gb/s
  • Multiple voltage standards support (1.2V to 3.3V)

Analog Mixed Signal (AMS) Integration

A standout feature of the Artix-7 XA family is the integrated AMS technology:

  • Dual 12-bit analog-to-digital converters (ADCs)
  • 1 MSPS sampling rate
  • 17-channel analog input capability
  • On-chip temperature and voltage sensors

Application Areas

Automotive Electronics

The XA7A50T-1CSG324Q excels in automotive applications:

  • Advanced Driver Assistance Systems (ADAS)
  • In-vehicle infotainment systems
  • Camera and sensor processing
  • Engine control units
  • Dashboard displays and instrumentation
  • Vehicle-to-vehicle (V2V) communication

Industrial Automation

Perfect for demanding industrial environments:

  • Industrial control systems
  • Motor control and drive systems
  • Machine vision processing
  • Programmable Logic Controllers (PLCs)
  • Factory automation equipment

High-Reliability Applications

Suitable for mission-critical systems:

  • Medical imaging equipment
  • Aerospace instrumentation
  • Defense systems
  • Rail transportation
  • Energy management systems

Why Choose the XA7A50T-1CSG324Q?

Automotive Qualification

This Xilinx FPGA meets the demanding AEC-Q100 automotive qualification standard, ensuring reliable operation in extreme temperature conditions and harsh automotive environments. The extended operating temperature range of -40°C to +125°C makes it suitable for under-hood and outdoor applications.

Cost-Effective Performance

Built on 28nm HPL (High-Performance Low-Power) technology, the XA7A50T-1CSG324Q delivers more logic per watt compared to previous-generation devices. This efficiency translates to lower system power consumption and reduced thermal management requirements.

Compact Form Factor

The 324-pin CSBGA package with 0.8mm ball pitch offers an excellent balance between I/O density and board-level routing complexity. The compact 15mm × 15mm footprint enables space-efficient designs in size-constrained applications.

Design Flexibility

With 52,160 logic cells and extensive I/O capabilities, designers have ample resources for implementing complex digital designs, including:

  • Custom processing pipelines
  • Multiple communication protocols
  • Real-time signal processing
  • Hardware acceleration
  • System-on-Chip (SoC) implementations

Development and Design Resources

Xilinx Vivado Design Suite

The XA7A50T-1CSG324Q is fully supported by AMD’s Vivado Design Suite, providing:

  • Comprehensive synthesis and implementation tools
  • Advanced timing analysis
  • Power analysis and optimization
  • IP integrator for system-level design
  • Hardware debugging capabilities

Programming Options

Multiple configuration methods are available:

  • JTAG boundary-scan programming
  • Master Serial/SPI Flash configuration
  • Slave Serial configuration
  • Master SelectMAP
  • Processor configuration via PCIe

Reference Designs

AMD provides extensive reference designs and application notes for rapid development:

  • Automotive interface examples
  • Communication protocol implementations
  • Motor control reference designs
  • Image processing pipelines
  • Signal processing applications

Comparison with Similar FPGAs

Artix-7 XA Family Positioning

Model Logic Cells Block RAM DSP Slices I/O (324-pin pkg)
XA7A25T 23,360 1,800 Kb 80 210
XA7A50T 52,160 2,700 Kb 120 210
XA7A75T 75,520 3,960 Kb 180 210
XA7A100T 101,440 4,860 Kb 240 210

The XA7A50T offers an optimal balance of resources for mid-range applications, providing substantial logic capacity without the premium cost of higher-density devices.

Package and Ordering Information

Part Number Breakdown

XA7A50T-1CSG324Q

  • XA = Automotive-grade qualification
  • 7A = Artix-7 architecture
  • 50T = 52,160 logic cell variant
  • -1 = Speed grade (standard performance)
  • C = Commercial temperature with automotive screening
  • SG = Pb-free, RoHS compliant
  • 324 = Pin count
  • Q = Qualification (Automotive AEC-Q100)

Packaging Details

  • Packaging Type: Tray
  • Lead Time: Typically 30 weeks (subject to availability)
  • Product Status: Active
  • Quantity per Tray: Varies by distributor

Quality and Reliability

AEC-Q100 Qualification

The XA7A50T-1CSG324Q has passed rigorous automotive qualification testing:

  • Temperature cycling
  • High-temperature operating life (HTOL)
  • Temperature-humidity-bias (THB)
  • Electrostatic discharge (ESD) testing
  • Latch-up immunity

Operating Lifetime

With automotive-grade qualification and robust 28nm HKMG technology, the XA7A50T-1CSG324Q delivers:

  • Extended operational lifetime in harsh environments
  • Superior resistance to environmental stress
  • Proven reliability in field applications
  • Low failure rates (FIT)

Power Consumption Characteristics

Typical Power Dissipation

The XA7A50T features efficient power management:

  • Static Power: Optimized through advanced process technology
  • Dynamic Power: Scales with design utilization and switching frequency
  • Power Domains: Separate voltage rails for core logic and I/O
  • Clock Gating: Built-in capabilities for power reduction

Power consumption varies significantly based on:

  • Design complexity and resource utilization
  • Operating frequency
  • I/O activity and standards used
  • Temperature conditions

Design Considerations

Thermal Management

For optimal performance and reliability:

  • Ensure adequate PCB copper for heat spreading
  • Consider thermal vias under package
  • Monitor junction temperature using on-chip sensors
  • Follow AMD’s thermal design guidelines

Signal Integrity

Best practices for high-speed design:

  • Follow recommended PCB stackup and routing guidelines
  • Implement proper power delivery network (PDN)
  • Use appropriate termination for high-speed signals
  • Minimize stub lengths on critical nets

Configuration Strategy

Select appropriate configuration method based on:

  • System requirements and boot time constraints
  • Security requirements (bitstream encryption)
  • Field update capabilities needed
  • Bill of materials (BOM) optimization

Frequently Asked Questions

Q: What is the difference between XA7A50T-1CSG324Q and XA7A50T-1CSG324I? A: The “Q” suffix indicates qualification for automotive applications (AEC-Q100), while “I” typically denotes industrial temperature grade without full automotive qualification.

Q: Can this FPGA operate at temperatures above 125°C? A: The maximum junction temperature rating is 125°C. Operation above this temperature may cause unreliable performance or permanent damage.

Q: What development tools are required? A: AMD’s Vivado Design Suite is required for design entry, synthesis, implementation, and programming of the XA7A50T-1CSG324Q.

Q: Is this FPGA compatible with previous Xilinx toolchains? A: No, Artix-7 devices require Vivado Design Suite. The legacy ISE tools do not support 7-series FPGAs.

Q: What programming cables are compatible? A: Standard Xilinx programming cables including Platform Cable USB II, Digilent JTAG-HS2, and compatible third-party JTAG adapters work with this device.

Conclusion

The XA7A50T-1CSG324Q represents an excellent choice for designers requiring a robust, automotive-qualified FPGA with substantial logic resources and advanced features. Its combination of 52,160 logic cells, integrated DSP capability, flexible I/O options, and AEC-Q100 qualification makes it ideal for demanding automotive and industrial applications.

Whether you’re developing advanced driver assistance systems, industrial control equipment, or high-reliability electronics, the XA7A50T-1CSG324Q provides the performance, features, and quality needed for successful product deployment. The extensive development ecosystem, proven reliability, and competitive pricing make this FPGA a compelling solution for your next design project.

For procurement, technical support, or additional product information, contact authorized AMD distributors or visit the AMD documentation portal for comprehensive datasheets, application notes, and reference designs.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.