Overview of the XA7A35T-1CSG324I Automotive FPGA
The XA7A35T-1CSG324I is an industrial-grade field-programmable gate array (FPGA) from AMD’s Automotive XA Artix-7 family, designed specifically for mission-critical applications requiring exceptional reliability and performance. This advanced programmable logic device delivers robust functionality in a compact 324-ball CSBGA package, making it ideal for automotive, industrial control, and aerospace applications.
Key Features and Specifications
Core Performance Specifications
| Parameter |
Specification |
Details |
| Logic Cells |
33,280 cells |
High-density programmable logic |
| CLBs (Configurable Logic Blocks) |
5,200 CLBs |
Advanced logic implementation |
| Total Block RAM |
1,800 Kbits |
Distributed memory architecture |
| DSP Slices |
90 slices |
Hardware multiply-accumulate units |
| I/O Pins |
210 user I/Os |
Maximum connectivity options |
| Operating Temperature |
-40°C to +100°C |
Industrial temperature range |
| Speed Grade |
-1 |
Optimized performance/power balance |
Package and Physical Characteristics
| Characteristic |
Specification |
| Package Type |
CSBGA (Chip Scale Ball Grid Array) |
| Pin Count |
324 balls |
| Package Code |
CSG324 |
| Mounting Type |
Surface Mount Technology (SMT) |
| Moisture Sensitivity |
MSL 3 (Moisture Sensitivity Level 3) |
Technical Architecture and Design Features
Advanced FPGA Architecture
The XA7A35T-1CSG324I incorporates AMD’s proven 28nm CMOS process technology, delivering exceptional power efficiency combined with high-performance processing capabilities. This Xilinx FPGA architecture includes:
- Advanced Memory Hierarchy: 1.8 Mb distributed block RAM for flexible memory implementation
- High-Performance DSP Engine: 90 DSP48E1 slices optimized for signal processing applications
- Flexible I/O Standards: Support for multiple voltage standards including LVDS, LVCMOS, and differential signaling
- Clock Management: Advanced MMCM (Mixed-Mode Clock Manager) and PLL resources for precise timing control
Memory and Processing Capabilities
| Memory Type |
Capacity |
Application |
| Block RAM |
1,800 Kbits |
Data buffering, packet processing |
| Distributed RAM |
Configurable |
Small memory arrays, FIFOs |
| Configuration Memory |
17,536 Kbits |
FPGA bitstream storage |
Application Areas and Use Cases
Automotive Electronics Systems
The XA7A35T-1CSG324I is AEC-Q100 qualified, making it perfect for automotive applications:
- Advanced Driver Assistance Systems (ADAS)
- Automotive infotainment controllers
- Electric vehicle battery management systems
- Automotive sensor fusion processors
- In-vehicle network controllers (CAN, FlexRay, Ethernet)
Industrial Control and Automation
- Motor control systems with real-time feedback
- Industrial communication protocol converters
- Machine vision processing applications
- PLC (Programmable Logic Controller) implementations
- Industrial IoT edge computing devices
Aerospace and Defense Applications
- Avionics control systems
- Radar signal processing
- Secure communication systems
- Flight control computers
- Satellite payload processing
Performance Specifications and Ratings
Electrical Characteristics
| Parameter |
Min |
Typ |
Max |
Unit |
| Core Voltage (VCCINT) |
0.95 |
1.0 |
1.05 |
V |
| Auxiliary Voltage (VCCAUX) |
1.71 |
1.8 |
1.89 |
V |
| I/O Voltage (VCCO) |
1.2 |
– |
3.3 |
V |
| Operating Temperature |
-40 |
25 |
+100 |
°C |
| Junction Temperature |
– |
– |
+125 |
°C |
Power Consumption Profile
| Operating Mode |
Typical Power |
Conditions |
| Static Power |
150-250 mW |
Configured, idle state |
| Dynamic Power |
500-800 mW |
Active processing, typical load |
| Maximum Power |
1.2 W |
Full utilization, worst case |
Configuration and Programming Options
Supported Configuration Modes
The XA7A35T-1CSG324I supports multiple configuration interfaces:
- JTAG Configuration: Industry-standard boundary scan and programming
- Master SPI Flash: Direct boot from external SPI flash memory
- Master BPI Flash: Parallel flash configuration for fast boot
- Slave SelectMAP: High-speed parallel configuration interface
- Serial Configuration: Compact, cost-effective configuration method
Development Tool Support
| Tool Category |
Software |
Purpose |
| Design Entry |
Vivado Design Suite |
HDL synthesis and implementation |
| Simulation |
Vivado Simulator, ModelSim |
Functional verification |
| Programming |
Vivado Hardware Manager |
Device programming and debug |
| IP Integration |
Vivado IP Integrator |
Pre-verified IP core integration |
Interface and Connectivity Features
High-Speed Serial Transceivers
| Feature |
Specification |
Application |
| Transceiver Count |
4 GTP transceivers |
High-speed serial communication |
| Line Rate |
Up to 6.6 Gb/s |
Per transceiver channel |
| Protocol Support |
PCIe Gen2, SATA, SGMII |
Industry-standard protocols |
General Purpose I/O Resources
- 210 user I/O pins with configurable standards
- Differential pair support for high-speed signaling
- Multiple voltage bank architecture for mixed-voltage designs
- Input/output delay control for timing optimization
- On-chip termination for signal integrity
Quality and Reliability Standards
Automotive Quality Certifications
The XA7A35T-1CSG324I meets stringent automotive quality standards:
- AEC-Q100 Grade 2 qualification (-40°C to +100°C)
- Production Part Approval Process (PPAP) documentation available
- Automotive-grade testing including extended temperature cycling
- Enhanced ESD protection for harsh automotive environments
Reliability Metrics
| Metric |
Specification |
Standard |
| MTBF |
>1,000,000 hours |
MIL-HDBK-217F |
| ESD Protection |
HBM: 2000V, CDM: 500V |
JEDEC standards |
| Latch-up Immunity |
>100 mA |
JEDEC JESD78 |
| Design Lifetime |
15+ years |
At rated conditions |
Design Considerations and Best Practices
Power Supply Design Guidelines
For optimal performance and reliability:
- Decoupling Capacitors: Place 0.1µF and 10µF capacitors near power pins
- Power Sequencing: Follow recommended VCCINT → VCCAUX → VCCO sequence
- Voltage Regulation: Use low-noise LDO or switching regulators
- PCB Layer Stack: Dedicate power and ground planes for noise reduction
Thermal Management Recommendations
| Condition |
Recommendation |
Benefit |
| Heat Sink |
Required for >500 mW |
Extends operating temperature range |
| Airflow |
200 LFM minimum |
Reduces junction temperature |
| Thermal Vias |
Under package area |
Improves heat dissipation |
| PCB Material |
FR4 with thermal conductivity >0.3 W/mK |
Better heat spreading |
Comparison with Alternative FPGA Solutions
XA7A35T vs. Similar Devices
| Feature |
XA7A35T-1CSG324I |
XA7A50T |
XA7A25T |
| Logic Cells |
33,280 |
52,160 |
23,360 |
| DSP Slices |
90 |
120 |
80 |
| Block RAM |
1,800 Kb |
2,700 Kb |
1,350 Kb |
| Transceivers |
4 |
4 |
2 |
| Package Options |
CSG324, CPG236 |
FGG484 |
CPG236 |
| Best For |
Balanced automotive applications |
Complex processing |
Cost-sensitive designs |
Getting Started with the XA7A35T-1CSG324I
Required Components for Development
- Development Board: Xilinx/AMD evaluation platform or custom board
- Software Tools: Vivado Design Suite (version 2019.1 or later)
- Programming Cable: Platform Cable USB II or compatible JTAG programmer
- Power Supply: Adjustable 1.0V/1.8V/3.3V multi-rail supply
Quick Start Design Flow
1. Design Entry → Write HDL code or use IP Integrator
2. Synthesis → Convert RTL to gate-level netlist
3. Implementation → Place and route design
4. Generate Bitstream → Create configuration file
5. Programming → Load bitstream to FPGA
6. Verification → Test and debug functionality
Ordering Information and Package Marking
Part Number Breakdown
XA7A35T-1CSG324I
- XA: Automotive grade
- 7A35T: Device family and size
- -1: Speed grade
- CSG324: Package type and pin count
- I: Industrial temperature range
Package Marking Information
The device topmarking includes:
- AMD logo
- Device part number
- Date code (YY-WW format)
- Lot traceability code
- Country of origin
Environmental and Compliance Standards
RoHS and Environmental Compliance
| Standard |
Status |
Details |
| RoHS 6/6 |
Compliant |
Lead-free, halogen-free options available |
| REACH |
Compliant |
No SVHC substances above threshold |
| Conflict Minerals |
Compliant |
DRC conflict-free certified |
| WEEE |
Compliant |
Recyclable packaging materials |
Support Resources and Documentation
Technical Documentation Available
- Datasheet: Complete electrical and timing specifications
- User Guide: Programming and configuration procedures
- PCB Design Guide: Layout recommendations and reference designs
- Errata: Known device limitations and workarounds
- Application Notes: Design examples and best practices
Technical Support Channels
- AMD Community Forums for peer-to-peer support
- Technical Support Portal for direct engineering assistance
- Local FAE (Field Application Engineer) support
- Training webinars and workshops
Conclusion: Why Choose the XA7A35T-1CSG324I
The XA7A35T-1CSG324I represents an optimal balance of performance, reliability, and cost-effectiveness for automotive and industrial applications. With its proven 28nm architecture, comprehensive I/O capabilities, and automotive-grade qualification, this FPGA provides a robust foundation for next-generation embedded systems.
Whether you’re designing advanced driver assistance systems, industrial automation controllers, or aerospace applications, the XA7A35T-1CSG324I delivers the programmable flexibility and processing power needed for mission-critical applications.
Key Advantages Summary
✓ Automotive-qualified (AEC-Q100 Grade 2)
✓ High logic density (33,280 logic cells)
✓ Flexible I/O (210 user pins, multiple standards)
✓ Proven reliability (extended temperature range)
✓ Cost-effective solution for mid-range applications
✓ Comprehensive tool support (Vivado Design Suite)
✓ Long-term availability for automotive programs
For more information about AMD Xilinx FPGAs and related products, visit the official AMD website or contact your local distributor for pricing and availability.
