Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XA7A15T-2CSG324I: Automotive-Grade Artix-7 FPGA for High-Performance Applications

Product Details

Overview: XA7A15T-2CSG324I FPGA Specifications

The XA7A15T-2CSG324I is an automotive-grade Field Programmable Gate Array from AMD (formerly Xilinx), part of the renowned XA Artix-7 FPGA family. This high-performance programmable logic device delivers exceptional processing capabilities with 16,640 logic cells, making it ideal for demanding automotive, industrial, and embedded applications requiring robust reliability and extended temperature operation.

Built on advanced 28nm HKMG (High-K Metal Gate) process technology, this FPGA combines low power consumption with high-speed performance, offering designers a flexible solution for next-generation automotive systems and industrial control applications.

Key Features and Technical Specifications

Core Architecture

Specification Details
Logic Cells 16,640 configurable logic cells
CLB Slices 2,600 Configurable Logic Blocks
DSP Slices 45 DSP48E1 slices
Block RAM 900 Kbit (112.5 KB) dual-port memory
Process Technology 28nm High-K Metal Gate (HKMG)
Operating Voltage 0.95V to 1.05V (Core)

Package and I/O Configuration

Parameter Specification
Package Type 324-pin CSBGA (Chip Scale Ball Grid Array)
Package Dimensions 15mm x 15mm x 1.5mm
User I/O Pins 210 available I/O pins
Speed Grade -2 (Industrial)
Temperature Range -40°C to +125°C (TJ)
Finish Tin/Silver/Copper (Sn/Ag/Cu)

Memory and Connectivity Features

Feature Capability
Memory Interface DDR3 support up to 1,866 Mb/s
Total RAM Bits 900 Kbit block RAM + distributed RAM
Configuration Memory 921,600 bits
I/O Standards LVDS, LVCMOS, SSTL, HSTL support
SelectIO Technology High-performance programmable I/O

Advanced Technology Features

High-Performance FPGA Logic Architecture

The XA7A15T-2CSG324I incorporates cutting-edge FPGA architecture designed specifically for automotive applications. The device features authentic 6-input lookup table technology configurable as distributed memory, providing designers with maximum flexibility for complex logic implementations.

Integrated Analog Mixed Signal (AMS) Technology

This automotive-grade Xilinx FPGA includes dual 12-bit, 1 MSPS analog-to-digital converters with 17 channels, enabling seamless integration of analog sensing capabilities directly within the FPGA fabric. The integrated XADC (Xilinx Analog-to-Digital Converter) includes on-chip thermal and supply voltage sensors for comprehensive system monitoring.

DSP Processing Capabilities

DSP Feature Performance
DSP Slices 45 DSP48E1 slices
Peak Performance 77 GMAC/s (Giga Multiply-Accumulate per second)
Bit Width 25 x 18 multiplier with 48-bit accumulator
Applications Digital filtering, FFT, motor control, signal processing

Memory Architecture

The XA7A15T-2CSG324I provides versatile on-chip memory resources:

  • 36 Kb dual-port Block RAM with integrated FIFO logic for efficient data buffering
  • Configurable as single 36 Kb or dual 18 Kb RAM blocks
  • Distributed RAM using LUT resources for small, fast memory applications
  • Total memory bandwidth exceeding 1,200 Gb/s for internal operations

Target Applications and Use Cases

Automotive Systems

The XA Artix-7 FPGA series is specifically designed for automotive applications requiring AEC-Q100 compliance. The XA7A15T-2CSG324I excels in:

  • Advanced Driver Assistance Systems (ADAS)
  • In-vehicle infotainment systems
  • Camera and radar signal processing
  • Electronic control units (ECUs)
  • Vehicle-to-vehicle (V2V) communication
  • Automotive gateway and networking

Industrial Automation

Application Area Implementation Benefits
Motor Control Real-time PWM generation and encoder processing
Machine Vision High-speed image processing and pattern recognition
PLCs Flexible logic control with deterministic timing
Industrial IoT Protocol bridging and data aggregation
Process Control Multiple PID loops with microsecond response

Communications Infrastructure

The high-speed I/O capabilities make this FPGA suitable for:

  • Software-defined radio (SDR) applications
  • Protocol conversion and bridging
  • Network packet processing
  • Wireless base station control
  • 5G edge computing applications

Performance Characteristics and Benchmarks

Clock Frequency and Timing

Clock Domain Maximum Frequency
Fabric Logic Up to 500 MHz (design dependent)
Block RAM Up to 500 MHz
DSP Operations Up to 600 MHz
I/O Interface DDR3-1866 (933 MHz I/O)

Power Consumption Profile

The 28nm process technology enables exceptional power efficiency:

  • Static power consumption: Optimized for automotive applications
  • Dynamic power scaling based on utilization
  • Multiple power domains for selective shutdown
  • Junction temperature operation up to 125°C

Development and Programming

Design Tools and Software Support

Tool Purpose
Vivado Design Suite Primary FPGA design environment
Vivado HLS High-Level Synthesis for C/C++ to HDL conversion
SDK Software development for embedded processors
IP Catalog Pre-verified IP cores and interfaces

Configuration and Programming Options

The XA7A15T-2CSG324I supports multiple configuration modes:

  • JTAG programming for development
  • Master/Slave serial configuration
  • Master/Slave SPI configuration
  • BPI (Byte Peripheral Interface) mode
  • Configuration from external flash memory

Programming Interface Specifications

Interface Data Width Max Clock
JTAG 1-bit 66 MHz
Master SPI x1, x2, x4 100 MHz
Slave Serial 1-bit 100 MHz

Quality and Reliability Standards

Automotive Grade Compliance

The XA7A15T-2CSG324I meets stringent automotive requirements:

  • AEC-Q100 Grade 2 qualified (-40°C to +125°C)
  • Designed for automotive functional safety applications
  • Extended temperature range for harsh environments
  • Enhanced screening and quality testing

Environmental and Regulatory Compliance

Standard Compliance Status
RoHS RoHS3 Compliant (lead-free)
REACH EU REACH compliant
Moisture Sensitivity MSL 3 (168 hours at 30°C/60% RH)
ESD Protection HBM Class 2, CDM Class C3

Comparison with Similar Devices

XA7A15T vs. XC7A15T

Feature XA7A15T-2CSG324I XC7A15T-2CSG324I
Grade Automotive (XA) Industrial (XC)
Temperature -40°C to +125°C -40°C to +100°C
AEC-Q100 Yes No
Price Premium Higher Standard

Pin-Compatible Alternatives

Part Number Key Difference
XA7A15T-1CSG324I Speed grade -1 (slower)
XA7A15T-2CSG324Q Q-grade (automotive enhanced)
XA7A35T-2CSG324I More logic cells (35K vs 16K)

Design Considerations and Best Practices

Thermal Management

Operating at extended automotive temperatures requires careful thermal design:

  • Maximum junction temperature: 125°C
  • Recommended heat sink for continuous operation above 85°C ambient
  • Thermal impedance: θJA = 18°C/W (with airflow)
  • Monitor on-chip temperature sensors for reliability

Power Supply Design

Supply Rail Voltage Range Typical Current
VCCINT 0.95V – 1.05V Design dependent
VCCAUX 1.71V – 1.89V 100-300 mA
VCCO 1.2V – 3.3V Bank dependent

PCB Layout Guidelines

Critical design considerations for optimal performance:

  • Maintain controlled impedance traces for high-speed signals
  • Place decoupling capacitors within 5mm of power pins
  • Use ground planes for signal integrity
  • Follow AMD’s PCB design guidelines for BGA packages
  • Consider via-in-pad technology for dense routing

Ordering Information and Availability

Part Number Breakdown

XA7A15T-2CSG324I decodes as:

  • XA = Automotive grade
  • 7A15T = Artix-7, 15K logic cells
  • -2 = Speed grade (industrial temperature)
  • CSG324 = 324-pin CSBGA package
  • I = Industrial temperature range

Package Options and Variants

Suffix Temperature Grade Application
I -40°C to +125°C Automotive/Industrial
Q -40°C to +125°C Enhanced automotive
C 0°C to +85°C Commercial (non-automotive)

Technical Support and Resources

Documentation and References

Access comprehensive technical resources:

  • Product datasheet with electrical specifications
  • PCB design guide and footprint recommendations
  • Application notes for automotive designs
  • Reference designs and example projects
  • Vivado IP core documentation

Getting Started Guide

For engineers beginning XA7A15T-2CSG324I development:

  1. Download Vivado Design Suite (version 2023.1 or later)
  2. Review the Artix-7 SelectIO Resources User Guide
  3. Study automotive-specific design constraints
  4. Implement proper power sequencing and monitoring
  5. Follow AMD’s automotive qualification guidelines

Why Choose XA7A15T-2CSG324I?

This automotive-grade FPGA represents the optimal balance of performance, power efficiency, and reliability for mission-critical applications. Key advantages include:

  • Proven Reliability: AEC-Q100 qualified for automotive environments
  • Design Flexibility: 16,640 logic cells for complex implementations
  • Extended Temperature: Operates reliably from -40°C to +125°C
  • Integrated Analog: On-chip ADC eliminates external components
  • Cost-Effective: Competitive pricing for automotive-grade FPGAs
  • Tool Support: Industry-leading Vivado Design

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.