Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XA7A100T-1FGG484Q: Automotive-Grade FPGA for High-Performance Applications

Product Details

Overview of XA7A100T-1FGG484Q Automotive FPGA

The XA7A100T-1FGG484Q is a high-performance automotive-grade field-programmable gate array from AMD’s XA Artix-7 family. This FPGA delivers exceptional processing power, low power consumption, and robust reliability for demanding automotive applications. Manufactured using advanced 28nm HKMG process technology, this device provides engineers with a cost-effective solution for modern vehicle electronics, industrial automation, and safety-critical systems.

Featuring 101,440 logic cells and 285 user I/O pins in a compact 484-pin FBGA package, the XA7A100T-1FGG484Q offers the ideal balance between functionality and form factor. This Xilinx FPGA is specifically designed to meet stringent automotive standards while delivering superior performance per watt compared to previous-generation devices.

Key Technical Specifications

Core Device Features

Specification Value
Part Number XA7A100T-1FGG484Q
Manufacturer AMD (formerly Xilinx)
Product Family XA Artix-7 (Automotive)
Logic Cells 101,440 cells
Process Technology 28nm HKMG (High-k Metal Gate)
Core Voltage 1.0V
Speed Grade -1 (Commercial)
Package Type 484-pin FBGA (Fine-Pitch Ball Grid Array)
Total I/O Pins 285 user I/O
Automotive Grade AEC-Q100 qualified

Memory and DSP Resources

Resource Type Specification
Block RAM 4.9 Mb (135 blocks of 36Kb)
Distributed RAM Configurable from LUTs
DSP Slices 240 slices
DSP Performance 264 GMAC/s
CMTs 6 clock management tiles
MMCM/PLL 6 mixed-mode clock managers

Operating Conditions

Parameter Specification
Temperature Range -40°C to +125°C (Automotive)
Supply Voltage (VCCINT) 0.95V to 1.05V
Supply Voltage (VCCAUX) 1.71V to 1.89V
I/O Voltage (VCCO) 1.2V to 3.3V (High Range)
Static Power (Typ) Low quiescent current consumption

Advanced Performance Features

High-Speed I/O Capabilities

The XA7A100T-1FGG484Q incorporates advanced SelectIO technology supporting various industry-standard interfaces. The device delivers exceptional bandwidth with support for DDR3 memory interfaces operating at speeds up to 1,866 Mb/s. With high-speed serial connectivity, the FPGA enables data transfer rates reaching 6.6 Gb/s through built-in multi-gigabit transceivers, making it ideal for applications requiring rapid data processing and communication.

Integrated Analog Mixed Signal Technology

One of the standout features of this automotive FPGA is its integrated Analog Mixed Signal (AMS) capability. The device includes dual independent 12-bit analog-to-digital converters with 17 channels each, operating at 1 MSPS. This integration eliminates the need for external ADC components, reducing system cost, board space, and overall complexity while improving system reliability.

Programmable Logic Architecture

Built on real 6-input lookup table (LUT) technology, the XA7A100T-1FGG484Q offers flexible logic implementation. Each logic slice contains four LUTs and eight flip-flops, providing designers with granular control over their designs. The LUTs can be configured as distributed memory or shift register LUTs (SRLs), offering additional flexibility for memory-intensive applications.

Clock Management System

The device features six clock management tiles (CMTs), each containing one mixed-mode clock manager (MMCM) and one phase-locked loop (PLL). These components provide precise clock synthesis, jitter filtering, and frequency multiplication/division capabilities. The 32 global clock lines ensure efficient clock distribution throughout the FPGA fabric, minimizing clock skew and enabling high-performance synchronous designs.

Automotive-Grade Reliability

AEC-Q100 Qualification

The XA7A100T-1FGG484Q meets the rigorous AEC-Q100 automotive quality standard, ensuring reliable operation in harsh automotive environments. This qualification encompasses extensive testing for temperature cycling, high-temperature operating life, moisture resistance, and electromagnetic compatibility. Engineers can confidently deploy this FPGA in safety-critical automotive systems including advanced driver assistance systems (ADAS), infotainment systems, and powertrain control.

Extended Temperature Performance

Operating reliably across a temperature range from -40°C to +125°C, this automotive FPGA maintains consistent performance in extreme environmental conditions. Whether deployed in engine compartments experiencing high heat or exposed to freezing conditions, the device continues to function within specification, ensuring system reliability across all operating scenarios.

Application Areas

Automotive Electronics

The XA7A100T-1FGG484Q excels in modern automotive applications where high computational performance, low power consumption, and reliability are paramount. Common implementations include sensor fusion systems, camera processing for ADAS, radar signal processing, vehicle networking gateways, and adaptive lighting control. The integrated ADC capability makes it particularly suitable for applications requiring direct sensor interfacing.

Industrial Automation

Beyond automotive applications, this FPGA serves industrial automation requirements including machine vision systems, motion control, industrial networking protocols, and programmable logic controllers. The robust temperature range and proven reliability make it suitable for factory floor environments and outdoor industrial installations.

Safety-Critical Systems

With automotive-grade qualification and proven reliability, the device is well-suited for safety-critical applications requiring functional safety certification. The deterministic behavior of FPGA logic combined with built-in error detection and correction features supports the development of systems meeting ISO 26262 and other functional safety standards.

Development Tools and Software Support

Vivado Design Suite

The XA7A100T-1FGG484Q is fully supported by AMD’s Vivado Design Suite, providing a comprehensive development environment for FPGA design. Vivado offers advanced synthesis, implementation, timing analysis, and debugging capabilities. The integrated design environment streamlines the development process from RTL entry through bitstream generation.

IP Core Library

Designers benefit from access to AMD’s extensive IP core library, including DSP functions, memory controllers, high-speed serial interfaces, and processor cores. The MicroBlaze soft processor core enables embedded software development directly within the FPGA, creating powerful system-on-chip implementations.

Power Estimation Tools

The Xilinx Power Estimator (XPE) enables accurate power consumption analysis during the design phase. This tool helps engineers optimize their designs for power efficiency, a critical consideration for automotive battery-powered systems and thermally constrained environments.

Package and Pinout Information

The 484-pin FBGA package provides an excellent balance between I/O count and physical footprint. The fine-pitch ball grid array offers reliable electrical connections while maintaining a compact form factor suitable for space-constrained automotive and industrial applications. The package supports both wire bonding and flip-chip assembly methods, providing flexibility for different manufacturing requirements.

With 285 user I/O pins, designers have ample connectivity for interfacing with multiple sensors, communication buses, and control signals. The high-range I/O banks support voltage levels from 1.2V to 3.3V, ensuring compatibility with a wide range of external devices and legacy interfaces.

Design Considerations

Power Supply Sequencing

Proper power supply sequencing is essential for reliable operation. The recommended power-on sequence is VCCINT, VCCBRAM, VCCAUX, followed by VCCO. This sequencing minimizes current draw during startup and ensures I/O pins remain in a high-impedance state until the device is fully configured. The power-off sequence should follow the reverse order.

Thermal Management

With typical quiescent current consumption of 170mA on VCCINT and 36mA on VCCAUX, the XA7A100T-1FGG484Q offers excellent power efficiency. However, dynamic power consumption varies based on design utilization and switching activity. Proper thermal analysis using the XPE tool and adequate heat dissipation measures ensure reliable operation across the full temperature range.

Configuration Options

The FPGA supports multiple configuration modes including JTAG, SPI flash, and BPI flash interfaces. For automotive applications, configuration data is typically stored in non-volatile memory and loaded at system startup. The device configuration time is fast enough for most automotive boot-time requirements.

Comparison with Similar Devices

Feature XA7A100T XA7A50T XA7A75T
Logic Cells 101,440 52,160 76,800
DSP Slices 240 120 180
Block RAM 4.9 Mb 2.7 Mb 3.6 Mb
I/O (484 pkg) 285 250 285
CMTs 6 5 6

Ordering Information and Availability

The XA7A100T-1FGG484Q is available through authorized distributors worldwide. When ordering, the complete part number specifies all device characteristics including logic cell count, speed grade, package type, and temperature grade. The “Q” suffix indicates qualification for automotive applications meeting AEC-Q100 standards.

Conclusion

The XA7A100T-1FGG484Q represents a powerful, reliable, and cost-effective solution for automotive and industrial FPGA applications. Its combination of high logic density, integrated analog functionality, automotive-grade reliability, and comprehensive development tool support makes it an excellent choice for next-generation electronic systems. Whether you’re developing advanced automotive electronics, industrial control systems, or safety-critical applications, this FPGA provides the performance, flexibility, and reliability required for success.

Engineers seeking to leverage the full capabilities of this device should consult the complete datasheets and reference designs available from AMD, and consider working with experienced FPGA design partners to accelerate development and ensure optimal implementation of their applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.