The XA7A100T-1CSG324Q is an automotive-qualified field programmable gate array from AMD’s XA Artix-7 family, delivering exceptional performance and reliability for mission-critical automotive systems. This AEC-Q100 certified FPGA combines 101,440 logic cells with advanced DSP capabilities in a compact 324-pin CSPBGA package, making it ideal for space-constrained automotive electronic control units.
Product Overview: XA7A100T-1CSG324Q Specifications
The XA7A100T-1CSG324Q represents the pinnacle of cost-optimized automotive FPGA technology, built on 28nm CMOS process technology to deliver superior performance per watt for advanced driver assistance systems, in-vehicle infotainment, and driver information applications.
Key Technical Specifications
| Specification |
Details |
| Part Number |
XA7A100T-1CSG324Q |
| Manufacturer |
AMD (formerly Xilinx) |
| Product Family |
XA Artix-7 Automotive FPGAs |
| Logic Cells |
101,440 cells |
| Process Technology |
28nm CMOS HKMG |
| Package Type |
324-LFBGA, CSPBGA |
| I/O Count |
210 user I/Os |
| Operating Voltage |
1V core voltage |
| Temperature Range |
-40°C to +125°C (Automotive Grade) |
| Qualification |
AEC-Q100 certified |
Core Features and Capabilities
Advanced Memory Architecture
| Memory Type |
Capacity |
Performance |
| Block RAM |
4,860 Kbit (4.86 Mbit) |
36 Kb blocks |
| Distributed RAM |
1,188 Kbit |
Embedded in logic fabric |
| Total RAM |
6,048 Kbit |
High-bandwidth access |
The XA7A100T-1CSG324Q provides substantial embedded memory resources for buffering, data processing, and application-specific storage requirements without external memory dependencies.
DSP Processing Power
This Xilinx FPGA delivers up to 264 GMACs (giga multiply-accumulate operations per second) of signal processing performance through integrated DSP48E1 slices. Each DSP slice contains:
- 25 x 18 multiplier
- Pre-adder for efficient filter implementations
- 48-bit accumulator
- Pattern detector for advanced algorithms
The DSP architecture is optimized for automotive image processing, radar signal processing, and advanced sensor fusion applications in ADAS systems.
Automotive-Grade Reliability Features
AEC-Q100 Qualification
| Qualification Aspect |
Specification |
| Standard |
AEC-Q100 Grade 2 |
| Operating Temperature |
-40°C to +125°C junction temperature |
| Package Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
| Moisture Sensitivity |
MSL 3 |
| Mounting |
Surface Mount Technology (SMT) |
Advanced Security Features
- AES Encryption: Hardware-accelerated AES encryption engine for bitstream protection
- Device DNA: Unique device identifier for anti-cloning protection
- Secure Boot: Authenticated configuration loading
- Tamper Detection: Built-in security monitoring
High-Speed Connectivity Options
Interface Capabilities
| Interface Type |
Specification |
| Gigabit Transceivers |
Up to 6.25 Gbps GTP transceivers |
| PCIe Support |
Gen 2 x4 lanes |
| Memory Interfaces |
DDR3 up to 1066 Mbps |
| LVDS Performance |
Up to 1.2 Gb/s differential signaling |
| Maximum I/O Bandwidth |
52 Gb/s aggregate |
The integrated gigabit transceivers enable direct connectivity for automotive Ethernet, CAN FD, FlexRay, and other high-speed automotive protocols without additional interface chips.
Analog Mixed Signal Integration
On-Chip ADC System
The XA7A100T-1CSG324Q features an integrated analog-to-digital conversion system:
| ADC Feature |
Specification |
| Resolution |
12-bit |
| Channels |
17 external + internal sensors |
| Sample Rate |
1 MSPS (mega-samples per second) |
| Conversion Type |
Successive approximation |
| Internal Sensors |
Temperature and supply voltage monitoring |
This analog integration eliminates up to $5 in external analog components while providing real-time system health monitoring.
Target Automotive Applications
Advanced Driver Assistance Systems (ADAS)
The XA7A100T-1CSG324Q excels in ADAS applications requiring:
- Multi-camera sensor fusion with up to 264 GMACs processing
- Real-time object detection and classification
- Radar signal processing for adaptive cruise control
- Lidar data processing and point cloud analysis
- Video frame capture, de-warping, and stitching
In-Vehicle Infotainment (IVI)
Delivers premium infotainment experiences with:
- Multiple display controller support
- 3D graphics rendering and overlay capabilities
- High-resolution video processing
- Multi-stream audio processing
- Ethernet AVB/TSN connectivity
Driver Information Systems
Optimizes digital instrument clusters through:
- High-speed display interfaces
- Real-time data visualization
- Flexible graphics pipeline
- CAN/LIN gateway functionality
Power Efficiency and Thermal Management
Low-Power Operation
| Power Characteristic |
Performance |
| Static Power Reduction |
65% lower than 45nm generation |
| Dynamic Power Reduction |
50% lower than previous generation |
| Core Voltage |
1.0V nominal |
| Power Features |
Dynamic partial reconfiguration |
The 28nm high-k metal gate process technology delivers exceptional power efficiency, crucial for automotive thermal constraints and battery-powered applications.
Design Resources and Development Support
Compatible Development Tools
- Vivado Design Suite: Complete FPGA design environment
- Vivado HLx WebPACK: Free version with full device support
- Vitis Software Platform: Embedded software development
- IP Integrator: Drag-and-drop system design
- System Generator for DSP: High-level DSP design tools
Reference Designs Available
The XA7A100T-1CSG324Q benefits from extensive reference designs for automotive applications, including camera interfaces, radar processing pipelines, and motor control implementations.
Package and Pinout Details
Physical Characteristics
| Package Parameter |
Specification |
| Package Type |
CSPBGA (Chip Scale BGA) |
| Pin Count |
324 pins |
| Ball Pitch |
0.8mm |
| Package Dimensions |
Compact footprint for space-constrained designs |
| Thermal Performance |
Optimized for automotive thermal environments |
The fine-pitch 0.8mm ball grid array provides maximum I/O density while maintaining manufacturability with standard PCB fabrication processes.
Long-Term Availability and Support
AMD guarantees long-term product availability extending through 2040 for the 7 Series FPGA family, ensuring design longevity for automotive programs with 15+ year lifecycles. This commitment provides:
- Predictable supply chain planning
- Reduced redesign risks
- Investment protection for long-life automotive programs
- Consistent manufacturing and testing standards
Comparison with Related Devices
XA Artix-7 Family Positioning
| Device |
Logic Cells |
Block RAM |
DSP Slices |
I/O Pins |
| XA7A35T |
33,280 |
1,800 Kb |
90 |
Up to 250 |
| XA7A50T |
52,160 |
2,700 Kb |
120 |
Up to 250 |
| XA7A75T |
76,800 |
3,600 Kb |
180 |
Up to 285 |
| XA7A100T |
101,440 |
4,860 Kb |
240 |
Up to 285 |
The XA7A100T-1CSG324Q provides the highest logic density in the automotive Artix-7 family, making it suitable for the most demanding automotive applications requiring extensive parallel processing capabilities.
Quality and Compliance Standards
Regulatory Compliance
- AEC-Q100: Automotive Electronics Council qualification
- RoHS Compliant: Lead-free, environmentally friendly
- ISO/TS 16949: Automotive quality management certified manufacturing
- REACH Compliant: European chemical safety standards
Reliability Testing
The XA7A100T-1CSG324Q undergoes extensive automotive-grade reliability testing including:
- Temperature cycling (-40°C to +125°C)
- High-temperature operating life (HTOL)
- Temperature-humidity bias (THB)
- Electrostatic discharge (ESD) testing
- Latch-up immunity verification
Configuration and Programming
Configuration Options
| Configuration Method |
Description |
| Master SPI |
Direct boot from SPI flash memory |
| Master BPI |
Parallel flash configuration |
| Slave Serial |
External processor configuration |
| JTAG |
Debug and development programming |
The XA7A100T-1CSG324Q supports multiple configuration modes to accommodate various system architectures and boot requirements in automotive ECUs.
Bitstream Security
Hardware-based bitstream encryption using 256-bit AES protects intellectual property and prevents unauthorized cloning, critical for automotive applications where design security is paramount.
Why Choose XA7A100T-1CSG324Q?
Key Advantages
- Automotive Qualified: Full AEC-Q100 Grade 2 certification for -40°C to +125°C operation
- High Integration: Combines logic, DSP, memory, transceivers, and analog in single chip
- Proven Reliability: Extensive automotive deployment and field validation
- Cost Optimization: Reduces BOM costs through integration and small package size
- Performance Per Watt: Industry-leading power efficiency for battery-constrained systems
- Design Flexibility: Full reprogrammability enables feature upgrades and bug fixes
- Long-Term Support: Guaranteed availability through 2040
- Extensive Ecosystem: Comprehensive tools, IP, and reference designs
Technical Support and Resources
Engineers designing with the XA7A100T-1CSG324Q benefit from AMD’s comprehensive support infrastructure, including detailed datasheets, application notes, reference designs, and technical forums. The device is fully supported by the free Vivado WebPACK edition, eliminating tool licensing costs for most automotive applications.
Conclusion
The XA7A100T-1CSG324Q represents the optimal balance of performance, integration, and automotive qualification for next-generation vehicle electronics. With 101,440 logic cells, 264 GMACs of DSP performance, integrated gigabit transceivers, and full AEC-Q100 certification, this FPGA enables automotive designers to implement sophisticated ADAS, infotainment, and driver information systems with confidence. Its 28nm technology delivers exceptional power efficiency while the compact 324-pin CSPBGA package maximizes functionality in space-constrained automotive ECU environments.
Whether you’re developing advanced camera processing systems, implementing automotive Ethernet connectivity, or building next-generation digital instrument clusters, the XA7A100T-1CSG324Q provides the processing power, I/O flexibility, and automotive-grade reliability required for safety-critical automotive applications.
